Sangalang
Erwin Aguas Sangalang, Singapore SG
Patent application number | Description | Published |
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20110140252 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL ROW LEAD-FRAME HAVING TOP AND BOTTOM TERMINALS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming outer leads having outer terminal sections, the outer terminal sections having an upper terminal and a bottom terminal; forming inner leads having inner terminal sections wider than a distance between the outer terminal sections of the outer leads, and the inner terminal sections have an upper terminal and a bottom terminal; connecting an integrated circuit to the inner leads and the outer leads; and encapsulating the integrated circuit, the inner leads, and the outer leads with an encapsulation while leaving the upper terminals and the bottom terminals of the outer terminal sections and the upper terminals and bottom terminals of the inner terminal sections exposed from the encapsulation. | 06-16-2011 |
20110233743 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a leadframe strip system, having a stress relief slot and a leadframe unit, the stress relief slot is at a frame corner of the leadframe strip system and spans adjacent sides of the leadframe unit, the leadframe unit includes a paddle, a tie bar therefrom, and a lead finger; connecting an integrated circuit and the lead finger; forming an encapsulation covering the integrated circuit; and singulating the integrated circuit in the encapsulation from the leadframe strip system with a package corner of the encapsulation free of micro-cracks with an inspection of the package corner at least 50× view. | 09-29-2011 |
Jesus S. Sangalang, Dublin, CA US
Patent application number | Description | Published |
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20110215459 | INTERCONNECT AND TEST ASSEMBLY INCLUDING AN INTERCONNECT - An interconnect includes an elastic body, an electric conductor and a spacer. The elastic body has a first surface, a second surface, a first hole extending from the first surface to the second surface, and a second hole extending from the first surface to the second surface. The electric conductor is disposed in the first hole of the insulating body for contacting one of a plurality of balls of the first integrated circuit package and one of a plurality of conductor pads of the second integrated circuit package. The electric conductor includes an elastic body and electric conductor particles disbursed in the elastic body. The spacer is disposed in the second hole. | 09-08-2011 |
Joan C. Sangalang, Mountain View, CA US
Patent application number | Description | Published |
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20090105211 | INHIBITORS OF HEDGEHOG PATHWAY - The present invention is directed to a compound of Formula I | 04-23-2009 |
20090186905 | ANAPLASTIC LYMPHOMA KINASE MODULATORS AND METHODS OF USE - The present invention relates to compounds of the Formula I, wherein L, X, Y, Z, R | 07-23-2009 |
20120238570 | INHIBITORS OF THE HEDGEHOG PATHWAY - The present invention is directed to a compound of Formula I | 09-20-2012 |
20120245139 | INHIBITORS OF THE HEDGEHOG PATHWAY - The present invention is directed to a compound of Formula I | 09-27-2012 |
Joan Cruz Sangalang, San Francisco, CA US
Patent application number | Description | Published |
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20080249079 | Pyrimidine Derivatives As Kinase Modulators and Method of Use - The invention provides compounds and methods for inhibition of kinases, more specifically IGF 1 R kinases. The invention also provides compounds and methods for inhibition of wildtype Abl. The invention provides compounds for modulating protein kinase enzymatic activity for modulating cellular activities such as proliferation, differentiation, programmed cell death, migration and chemoinvasion. Compounds of the invention inhibit, regulate and/or modulate kinase receptor signal transduction pathways related to the changes in cellular activities as mentioned above, and the invention includes compositions which contain these compounds, and methods of using them to treat kinase-dependent diseases and conditions. A compound of formula (I), or a pharmaceutically acceptable salt, hydrate, or prodrug thereof, wherein, V is NR | 10-09-2008 |