Patent application number | Description | Published |
20100077429 | SYSTEM AND METHOD FOR PROVIDING MULTIMEDIA SERVICE - The present invention relates to a system and method for providing a multimedia service, which support event based home network service mobility through a Radio Frequency Identification (RFID) tag. The system for providing a multimedia service, includes a RFID tag, and a home server for performing a login authentication operation using RFID tag information provided from the RFID tag, storing service usage information of a multimedia service provided for a login user, and providing a corresponding multimedia service based on the service usage information of the multimedia service when a multimedia service is requested again. | 03-25-2010 |
20100124404 | MULTIMEDIA PLAYING SYSTEM AND METHOD FOR PLAYING MULTIMEDIA USING THE SAME - Provided are a multimedia playing system and a method for playing multimedia using the system. The system includes a first multimedia player, a second multimedia player, and a user interface. The first multimedia player includes a first media controller controlling plays of a first video and a first audio in response to multimedia data received from an external device. The second multimedia player includes a second media controller operating independently of the first multimedia player and controlling plays of second video in response to the multimedia data. The user interface transmits synchronization information to the first and second media controller. | 05-20-2010 |
20110010774 | MULTIMEDIA PLAY APPARATUS AND METHOD - Provided are a multimedia play apparatus and method. The multimedia play apparatus and method enable synchronization between an audio and a video through existing multimedia play time information, and even in a multimedia service that simultaneously provides multimedia and a message, the multimedia play apparatus and method enable synchronization between multimedia and a message that occurs by terminal characteristics between different environments and different users on the basis of existing multimedia play time information and multimedia meaning information. Moreover, by performing synchronization between multimedia and a message on the basis of the multimedia meaning information, the multimedia play apparatus and method can prevent the damage of a multimedia service that provides multimedia and a message together because of a spoiler corresponding to a malicious message. | 01-13-2011 |
20110014985 | SYSTEM AND METHOD FOR DELIVERING AND MANAGING CONTENTS IN MULTIPLE METAVERSE - Provided are a system and method for delivering and managing contents in multiple metaverses. The system includes a plurality of metaverses and a multiverse management platform. The plurality of metaverses include first and second metaverses providing different mixed reality environments to allow a user to perform various business activities using contents. The multiverse management platform supports a teleport between the first and second metaverses, converts values of the contents used in the first metaverse into contents usable in the second metaverse, and performs integrated management of the plurality of metaverses to allow the converted contents to be used in the second metaverse through the teleport. | 01-20-2011 |
20150321107 | EXPERIENCE RIDE REPRESENTATION APPARATUS AND METHOD FOR REAL-SENSE MEDIA SERVICE BASED ON MULTI-VISION - Disclosed herein are an experience ride representation apparatus and method for a real-sense media service based on a multi-vision. An experience ride representation apparatus for a real-sense media service based on a multi-vision in which a motion of a user is reflected so as to move in a plurality of screen units depending on a first signal received from the user, a second signal is transmitted to the user based on real-sense media contents reproduced on the screen unit, and metaverse contents are provided to a plurality of users when the screen unit is shared by the plurality of users. | 11-12-2015 |
20150324701 | APPARATUS FOR REPRESENTING SENSORY EFFECT AND METHOD THEREOF - Provided is a sensory effect representation apparatus including a collection unit configured to collect user status information about a user status, a storage unit configured to store sensory effects; an analysis unit configured to analyze the user status information to generate a user status prediction pattern, a sensory effect recommendation unit configured to recommend a sensory effect corresponding to the user status prediction pattern, from among the stored sensory effects; and a sensory effect provision unit configured to read a sensory effect corresponding to the sensory effect prediction pattern, from the storage unit and provide the read sensory effect. Accordingly, it is possible to provide a sensory effect appropriate for a user characteristic by predicting a user status and reflecting a feedback on a recommended sensory effect. | 11-12-2015 |
20150361401 | INDUCED PLURIPOTENT STEM CELL MODEL FOR FABRY DISEASE AND USE THEREOF - The present invention relates to an induced pluripotent stem cell model of Fabry disease, a preparation method thereof, and a use of the same for the study of Fabry disease development and for the screening of a therapeutic agent for the disease. Particularly, Fabry disease derived induced pluripotent stem cells (iPSCs), embryoid body (EB), and vascular cells were developed and differentiated from fibroblasts originated from Fabry disease patient, wherein the Fabry disease originated iPSCs displayed significantly reduced expression and activity of GLA protein therein, compared with the normal cells, resulting in the accumulation of globotriaosylceramide (Gb3, CD77). Also, the differentiation of vascular cells was induced from the Fabry disease originated iPSCs, and as a result the iPSCs were successfully differentiated into vascular endothelial cells and vascular smooth muscle cells with significantly expressing the marker protein. When the vascular endothelial cells and vascular smooth muscle cells were treated with Fabrazyme, the accumulation of Gb3 was significantly reduced, suggesting that the said cell model can be effectively used for the analysis/study of Fabry disease outbreak mechanism and for the screening of a therapeutic agent for the disease. | 12-17-2015 |
Patent application number | Description | Published |
20090049412 | Apparatus and method of providing graphical user interface - The present invention relates to an apparatus and method of providing a graphical user interface, and, more particularly, to an apparatus and method of providing a graphical user interface that enables a user to rapidly search a desired menu. | 02-19-2009 |
20090049477 | Apparatua and method of browsing content - The present invention relates to an apparatus and method of browsing content and in particular, to an apparatus and method of browsing content that allows a user to easily browse desired content | 02-19-2009 |
20090097748 | Image display apparatus and method - Provided are an image display apparatus and method which enables a user to quickly and easily obtain information related to an image currently being reproduced. The image display apparatus includes: a setting module setting a plurality of sub regions into which a predetermined image frame of an image being played back are divided according to color; and a mapping module mapping one or more thumbnail images of one or more relevant contents related to the image to one or more sub regions selected from the sub regions. | 04-16-2009 |
20100048861 | POLYIMIDE RESIN AND LIQUID CRYSTAL ALIGNMENT LAYER AND POLYIMIDE FILM USING THE SAME - Disclosed is a polyimide resin, which is colorless and transparent and has superior properties, including mechanical properties and heat stability, and thus is usable in various fields, including semiconductor insulating films, TFT-LCD insulating films, transparent electrode films, passivation films, liquid crystal alignment layers, optical communication materials, protective films for solar cells, and flexible display substrates. Also, a liquid crystal alignment layer and a polyimide film using the polyimide resin are provided. | 02-25-2010 |
20100110229 | Terminal having photographing function and display method for the same - Provided are a terminal having a photographing function and a displaying method for the terminal. The displaying method includes generating a plurality of process images by processing an original image, which is an image shown through a lens of the terminal, several times using different setup information each time, and displaying the generated plurality of process images on a plurality of buttons. Accordingly, even when a user is not proficient with how to obtain a high quality photograph by setting setup information, such as a focus, exposure, etc. and with operating the buttons, the user can select a process image, which seems to be the most preferable to the user, from among the process images, and thus the user can easily find the optimum setup information with a simple button operation. | 05-06-2010 |
20100317821 | POLYIMIDE RESIN AND LIQUID CRYSTAL ALIGNMENT LAYER AND POLYIMIDE FILM USING THE SAME - Disclosed is a polyimide resin, which is colorless and transparent and has superior properties, including mechanical properties and heat stability, and thus is usable in various fields, including semiconductor insulating films, TFT-LCD insulating films, transparent electrode films, passivation films, liquid crystal alignment layers, optical communication materials, protective films for solar cells, and flexible display substrates. Also, a liquid crystal alignment layer and a polyimide film using the polyimide resin are provided. | 12-16-2010 |
20120308198 | IMAGE DISPLAY APPARATUS AND METHOD - Provided are an image display apparatus and method which enables a user to quickly and easily obtain information related to an image currently being reproduced. The image display apparatus includes: a setting module setting a plurality of sub regions into which a predetermined image frame of an image being played back are divided according to color; and a mapping module mapping one or more thumbnail images of one or more relevant contents related to the image to one or more sub regions selected from the sub regions. | 12-06-2012 |
20130207195 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate, a gate structure disposed on the substrate and which includes a gate insulating layer and a gate electrode layer, a first nitride layer disposed on the substrate and the gate structure and which includes silicon, and a second nitride layer that is disposed on the first nitride layer and has an atomic percentage of silicon less than that of the first nitride layer. | 08-15-2013 |
Patent application number | Description | Published |
20110187451 | POWER AMPLIFIER - There is provided a power amplifier that can reduce power consumption by selectively turning a plurality of amplifiers on or off according to the power of a signal to be transmitted. A power amplifier according to an aspect of the invention may include: a first amplification section amplifying an input signal by a predetermined gain; a second amplification section having a plurality of amplification units re-amplifying the input signal, amplified by the first amplification section, by predetermined gains; and a switch section supplying or cutting off power to the plurality of amplification units according to an switching signal to selectively operate the plurality of amplification units. | 08-04-2011 |
20110215981 | HIGH FREQUENCY TRANSMISSION MODULE WITH IMPROVED HARMONIC FEATURE - There is provided a high frequency transmission module, including: a high band power amplifier amplifying power of a preset high band frequency signal; a low band power amplifier amplifying power of a preset low band frequency signal; an LC matching circuit unit matching output impedance of the low band power amplifier to impedance of an antenna switch circuit; the antenna switch circuit connecting one of a first terminal connected to an output terminal of the high band power amplifier and a second terminal connected to the LC matching circuit unit to a common terminal; and a matching/ESD protecting unit matching impedances between the antenna switch circuit and an antenna and blocking static electricity introduced from the antenna. | 09-08-2011 |
20120154052 | POWER AMPLIFYING APPARATUS - There is provided a power amplifying apparatus including: a power amplifier; a power regulator providing a driving voltage and a driving current corresponding to a control voltage to the power amplifier; a current sensing unit sensing a current and a voltage corresponding to the driving current and controlling the driving voltage according to the sensed current; a current control unit controlling a current bias according to the sensed voltage of the current sensing unit; and a current bias circuit unit controlling a bias current of the power amplifier according to the controlling of the current control unit. | 06-21-2012 |
20120249262 | POWER COMBINER, POWER AMPLIFYING MODULE HAVING THE SAME, AND SIGNAL TRANSCEIVING MODULE - There are provided a power combiner implemented by a printed circuit board, a power amplifying module having the same, and a signal transceiving module. The power combiner includes: a primary wiring unit formed on one surface of a printed circuit board, receiving a plurality of balance signals having positive balance signals and negative balance signals, and including a plurality of positive primary wirings and a plurality of negative primary wirings, wherein the plurality of positive primary wirings are spaced apart from each other by a predetermined interval, the plurality of negative primary wirings are spaced apart from each other by a predetermined interval, one ends of the plurality of positive primary wirings are connected in common to thereby receive the plurality of positive balance signals, one ends of the plurality of negative primary wirings are connected in common to thereby receive the plurality of negative balance signals, and the other ends of the plurality of positive primary wirings and the other ends of the plurality of negative primary wirings are connected to each other to thereby form a loop; and a secondary wiring unit formed on the other surface of the printed circuit board, and including a secondary wiring combining powers of the plurality of balance signals from the primary wirings forming the loop to thereby output a single end signal. | 10-04-2012 |
20130072187 | DUAL MODE COMMUNICATIONS DEVICE AND METHOD OF IMPROVING DATA RATE THEREOF - There are provided a dual mode communications device and a method of improving a data rate thereof. The dual mode communications device according to the embodiment of the present invention may include a selection unit | 03-21-2013 |
20130285761 | VARIABLE CAPACITOR MODULE - Disclosed herein is a variable capacitor module, including: a capacitor circuit part including a plurality of capacitor units connected in parallel with each other; and a switching circuit part including a plurality of switch units connected between the plurality of capacitor units, and varying a capacitance of the capacitor circuit part by selecting at least one capacitor unit according to operations of the switch units, and thus, an asymmetric phenomenon where the RF terminal has directivity by gate resistance of the switch can be removed. | 10-31-2013 |
20130285762 | VARIABLE CAPACITOR MODULE - Disclosed herein is a variable capacitor module, including a variable capacitor circuit part including a first capacitor unit, a second capacitor unit connected in parallel with the first capacitor unit, and first and second switch units connected between the first and second capacitor units, and selecting at least one capacitor unit according to operations of the first and second switch units, wherein the variable capacitor circuit part is present in plural, and the plural variable capacitor parts are connected in parallel with each other, and thus, an asymmetric phenomenon where the RF terminal has directivity by gate resistance of the switch can be removed. | 10-31-2013 |
20140159829 | VARIABLE CAPACITANCE CIRCUIT - There is provided a variable capacitance circuit, including a capacitance circuit unit connected between a first terminal and a second terminal and providing a preset capacitance, a variable capacitance circuit unit including a first transistor connected to the capacitance circuit unit in series between the first terminal and the second terminal, the first transistor being operated according to a gate voltage, and a switching unit connected between a body of the first transistor and an input terminal of a preset body voltage, wherein the switching unit is turned off when the first transistor is turned on and turned on when the first transistor is turned off. | 06-12-2014 |
20140221041 | DUAL MODE COMMUNICATIONS DEVICE AND METHOD OF IMPROVING DATA RATE THEREOF - There are provided a dual mode communications device and a method of improving a data rate thereof. The dual mode communications device according to the embodiment of the present invention may include a selection unit | 08-07-2014 |
Patent application number | Description | Published |
20100208226 | Holographic exposure apparatuses - A holographic exposure apparatus may include an object to be exposed, a holographic mask on which a pattern to be transferred onto the object is formed, a stage to support the mask, and a gap adjustment unit disposed between the mask and stage in order to move the mask relative to the stage. A holographic exposure apparatus also may include an object to be exposed, a mask spaced apart from the object, a holder that holds the mask, and a stage on which the holder is movably mounted such that a gap between the mask and object is adjusted. In addition, a holographic exposure apparatus may include a stage, a prism supported by the stage, a mask spaced apart from the prism and supported by the stage, and a gap adjustment unit disposed between the mask and stage in order to move the mask relative to the prism. | 08-19-2010 |
20100208316 | Holographic exposure apparatuses - A holographic exposure apparatus may include a main body, a mask stage supported by the body, a holographic mask supported by the mask stage, and a driving unit disposed between the body and mask stage. A holographic exposure apparatus may include an object supported by a substrate stage, a holographic mask spaced apart from the object and supported by a mask stage, a main body supported by the mask stage, and a driving unit disposed between the mask stage and body to control a gap between the mask stage and body. A holographic exposure apparatus may include a main body, a mask stage supported by the body, a holographic mask supported by the mask stage, and a piezoelectric element disposed between the body and mask stage. The body may include a support arm that supports the element. The mask stage may include a seat arm that supports the element. | 08-19-2010 |
20130016361 | STAGE APPARATUSAANM Park; Sang WookAACI Suwon-siAACO KRAAGP Park; Sang Wook Suwon-si KRAANM Jang; In BaeAACI SeoulAACO KRAAGP Jang; In Bae Seoul KRAANM Jang; Sang DonAACI Suwon-siAACO KRAAGP Jang; Sang Don Suwon-si KRAANM Kim; Oui SergAACI Seongnam-siAACO KRAAGP Kim; Oui Serg Seongnam-si KR - The stage apparatus includes a stage having a range of movement on a stage base, an interferometer and a fixed mirror that are installed outside the stage on the stage base, and a first movable mirror disposed on the stage to reflect light, which is introduced from the interferometer, toward the fixed mirror, and to reflect the light, which is received after being reflected by the fixed mirror, to the interferometer. | 01-17-2013 |
20130150119 | DUAL COMMUNICATIONS NETWORK BASE STATION APPARATUS - There is provided a dual communications network base station apparatus including: a first UTRA network transmitting and receiving first data including pairs information via a previously set first communications band; a second UTRA network transmitting and receiving second data including the pairs information via a second communications band different from the first communications band; a core network combining the first data and the second data by using the pairs information during wireless reception, dividing the first data and the second data including the pairs information according to a previously set division rate during wireless transmission, and providing the corresponding UTRA network with the divided first data and second data; and a server communicating data including the first and second data with the core network. | 06-13-2013 |
20140268171 | STAGE DEVICE AND DRIVING METHOD THEREOF - A stage device includes a stage configured to move in an X-axis direction and a Y-axis direction, an X-axis interference reflector spaced apart from the stage in the X-axis direction, a first X-axis interferometer disposed on the stage that is configured to measure an X-axis location of the stage using the X-axis interference reflector, and an optical movable element spaced apart from the stage in the Y-axis direction that is configured to shift in the X-axis direction a path of a light beam propagating in the Y-axis direction according to movement of the stage in the X-axis direction. | 09-18-2014 |
20150091231 | STAGE DEVICE AND SEMICONDUCTOR FABRICATION APPARATUS INCLUDING THE SAME - A stage device includes an interference mirror extending in an X-axis direction and first through third flexure structures configured to restrict the interference mirror. The first flexure structure restricts the interference mirror in a Y-axis direction and a Z-axis direction. The second flexure structure restricts the interference mirror in the Y-axis direction and the Z-axis direction. The third flexure structure restricts the interference mirror in the X-axis direction and the Z-axis direction. | 04-02-2015 |
Patent application number | Description | Published |
20110027604 | EXPANDABLE METAL MEMBRANE WITH ORTHOGONALLY ISOTROPIC BEHAVIOR - In a metal membrane for a low-temperature-fluid storage tank wherein longitudinal and transverse corrugations are formed and both corrugations intersect each other, a bidirectional expandable member connected to each corrugation is formed in the intersection of the corrugations so that the bidirectional expandable member is longitudinally and transversely expandable. The bidirectional expandable member is protruded and is shaped like a pyramid, a dome or a cross. Each metal membrane is welded into a unit panel and the edge of each metal membrane is welded with the common edge of another adjacent metal membrane. | 02-03-2011 |
20110076092 | APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF - A fixing apparatus of a cargo insulation panel includes a fixing plate adhered to one face of an insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets fixed by stud bolts arranged on the hull, and a plurality of couplers configured to couple the fixing brackets to the fixing plate. | 03-31-2011 |
20120211621 | APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF - An apparatus for a cargo insulation panel and an insulation panel using the fixing apparatus are provided. By providing a fixing apparatus of a cargo insulation panel and an insulation panel using the fixing apparatus, which include a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate, the present invention can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally, and solve the problem of damage by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel. | 08-23-2012 |
20120305524 | INSULATION STRUCTURE OF LNG CARRIER CARGO TANK AND METHOD FOR CONSTRUCTING THE SAME - An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure include a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil. | 12-06-2012 |
20130121758 | APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF - A fixing apparatus for fixing a cargo insulation panel to a hull is provided. The fixing apparatus includes a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate. The fixing apparatus can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally. The fixing apparatus also solves the problem of damage caused by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel. | 05-16-2013 |
Patent application number | Description | Published |
20110056954 | INSULATION PANEL FOR CORNER AREA OF LNG CARGO CONTAINMENT SYSTEM - A corner panel of an LNG cargo that includes a main body, which forms a corner area of the cargo, and a stress diverging part, which reduces the convergence of stress of the main body by being integrated with an internal face of the main body and being formed with curvature, and a secondary barrier formed in a curved shape. | 03-10-2011 |
20110056955 | INSULATION STRUCTURE OF LNG CARRIER CARGO TANK AND METHOD FOR CONSTRUCTING THE SAME - An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure includes a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil. | 03-10-2011 |
20110186580 | REINFORCING MEMBER FOR CORRUGATED MEMBRANE OF LNG CARGO TANK, MEMBRANE ASSEMBLY HAVING THE REINFORCING MEMBER AND METHOD FOR CONSTRUCTING THE SAME - The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer. | 08-04-2011 |
20150114970 | REINFORCING MEMBER FOR CORRUGATED MEMBRANE OF LNG CARGO TANK, MEMBRANE ASSEMBLY HAVING THE REINFORCING MEMBER AND METHOD FOR CONTRUCTING THE SAME - The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer. | 04-30-2015 |
Patent application number | Description | Published |
20080206955 | Method of Forming an Isolation Film in a Semiconductor Device - A method of forming an isolation film in a semiconductor device is disclosed. The disclosed method includes performing a patterning process on a predetermined region of a semiconductor substrate in which a patterned pad film is formed, forming a trench defining an inactive region and an active region, forming a liner film on the entire surface including the trench, forming an insulating film for trench burial only within the trench, stripping the remaining liner film formed except for the inside of the trench and the patterned pad film formed below the liner film, forming a sacrificial film on the entire surface, and performing a polishing process on the entire surface in which the sacrificial film is formed until the semiconductor substrate of the active region is exposed, thereby forming the isolation film having no topology difference with the semiconductor substrate of the active region. | 08-28-2008 |
20080242046 | Method on Forming an Isolation Film or a Semiconductor Device - A method of forming an isolation film in a semiconductor device is disclosed. The disclosed method includes performing a patterning process on a predetermined region of a semiconductor substrate in which a patterned pad film is formed, forming a trench defining an inactive region and an active region, forming a liner film on the entire surface including the trench, forming an insulating film for trench burial only within the trench, stripping the remaining liner film formed except for the inside of the trench and the patterned pad film formed below the liner film, forming a sacrificial film on the entire surface, and performing a polishing process on the entire surface in which the sacrificial film is formed until the semiconductor substrate of the active region is exposed, thereby forming the isolation film having no topology difference with the semiconductor substrate of the active region. | 10-02-2008 |
20080272373 | Flash Memory Device Having Resistivity Measurement Pattern and Method of Forming the Same - A flash memory device has a resistivity measurement pattern and method of forming the same. A trench is formed in an isolation film in a Self-Aligned Floating Gate (SAFG) scheme. The trench is buried to form a resistivity measurement floating gate. This allows the resistivity of the floating gate to be measured even in the SAFG scheme. Contacts for resistivity measurement are directly connected to the resistivity measurement floating gate. Therefore, variation in resistivity measurement values, which is incurred by the parasitic interface, can be reduced. | 11-06-2008 |
20100062711 | BLUETOOTH DEVICE AND METHOD OF SEARCHING FOR PERIPHERAL BLUETOOTH DEVICE - A Bluetooth device and a method of searching for a peripheral Bluetooth device using a previous search results are provided. The method of searching for a peripheral Bluetooth device includes: acquiring, if input instructing the start of an initial search is received, initial search address information and initial search device information about at least one peripheral Bluetooth device in a preset period; storing the acquired initial search address information and initial search device information in a storage unit; acquiring, if a request for searching for a peripheral device for performing Bluetooth communication is input, address information of a found peripheral Bluetooth device; determining whether address information corresponding to the acquired address information of the found peripheral Bluetooth device exists in the storage unit; and notifying a user, if address information corresponding to the acquired address information of the found peripheral Bluetooth device exists in the storage unit, of the stored initial search device information of the found peripheral device corresponding to the address information. | 03-11-2010 |
20100151057 | MEDICINAL HERBAL EXTRACT HAVING ANTI-OBESITY EFFECT - Disclosed is an anti-obesity active extract obtained from a medicinal plant. More specifically, the extract obtained from lysimachiae foenum-graeci herba (which is a medicinal plant traditionally used in the East) can be used as an active ingredient for a raw material, a functional food, cosmetic, a crude drug, etc. for an obesity preventing or therapeutic agent because the extract can suppress the adipocyte differentiation and decrease the body weight and body fat in an obese animal, thereby suppressing fat accumulation (that is, a factor for obesity). | 06-17-2010 |
20100285156 | COMPOSITION FOR PREVENTING AND TREATING METABOLIC DISEASES COMPRISING THE EXTRACT OF LYSIMACHIAE FOENUM-GRAECI HERBA - Disclosed are raw material, functional foods, and herb medicines for preventing and treating metabolic diseases, which comprise a Lysimachiae Foenum-Graeci Herba extract as an effective ingredient. The Lysimachiae Foenum-Graeci Herba extract have an activity of reducing blood glucose levels, triglycerides and cholesterol levels, AST and ALT levels, and fat in the liver, and thus can be effectively used as a hepatic protector and a remedy for preventing and treating various metabolic diseases including diabetes, high blood pressure, fatty liver, cardiovascular diseases, and hyperlipidemia. | 11-11-2010 |
20130093669 | APPARATUS AND METHOD FOR CONTROLLING SCREEN IN WIRELESS TERMINAL - An apparatus and method for controlling a screen in a wireless terminal including a bendable display unit for easily controlling the screen, the apparatus including a bendable display unit, a bending detector for detecting bending of the bendable display unit, and a controller for controlling the bendable display unit to up-scale and display data in a non-bent screen region on the bendable display unit when the bendable display unit is bent. | 04-18-2013 |
20130214831 | CIRCUIT FOR DETECTING A VOLTAGE CHANGE USING A TIME-TO-DIGITAL CONVERTER - A circuit for detecting a voltage change is described. The circuit includes a supply insensitive pulse generator that generates a pulse signal. The circuit also includes a time-to-digital converter coupled to the supply insensitive pulse generator. The time-to-digital converter generates a digital signal based on the pulse signal and a voltage. The circuit also includes a controller coupled to the time-to-digital converter that detects a voltage change based on the digital signal. | 08-22-2013 |
20130215153 | MOBILE TERMINAL HAVING A MULTIFACETED GRAPHICAL OBJECT AND METHOD FOR PERFORMING A DISPLAY SWITCHING OPERATION - A mobile terminal includes a display unit to display a first surface of a multifaceted graphical object, a motion detecting unit to detect a motion of the mobile terminal, and a control unit to switch the displayed first surface to a second surface of the multifaceted graphical object based on the detected motion. A method for switching a display surface of a multifaceted graphical object includes displaying a first surface of the multifaceted graphical object on a mobile terminal, detecting a motion of the mobile terminal, and switching the displayed first surface to a second surface of the multifaceted graphical object based on the detected motion. | 08-22-2013 |
20130242198 | METHOD AND APPARATUS FOR REDUCING NOISE OF VIDEO - A method and apparatus for reducing noise of a video image are provided. The method includes: reducing noise in a difference between a current frame and a previous frame in which temporal noise is reduced; detecting motion information about the current frame based on the difference in which the noise is reduced; reducing temporal noise in the current frame via a weighted sum of the current frame and the previous frame in which the temporal noise is reduced, according to the motion information; and reducing spatial noise in the current frame based on an edge direction of the current frame in which the temporal noise is reduced. | 09-19-2013 |
20140153823 | METHOD AND APPARATUS FOR PROCESSING IMAGE - An image processing apparatus includes an adaptive interpolation device which converts a MFA pattern image into a quincuncial pattern image based on difference values, and interpolates color channels and an NIR channel, based on difference values of the converted quincuncial pattern image in vertical and horizontal pixel directions; a frequency compensation device which obtains a high-resolution MFA image using high-frequency and medium-frequency components of a high-resolution base image, based on linear regression analysis and compared energy levels of MFA channel images to an energy level of a base image; and a channel interference suppression device which removes color distortion generated between each channel of the high-resolution MFA image, and another channel of the high-resolution MFA image and a base channel using a weighted average of pixel value differences between each channel of the high-resolution MFA image, and the other channel of the high-resolution MFA image and the base channel. | 06-05-2014 |
20140246005 | METHOD FOR MANUFACTURING AN ELECTRODEPOSITED DIAMOND WIRE SAW USING PATTERNED NON-CONDUCTIVE MATERIALS - The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region. | 09-04-2014 |
Patent application number | Description | Published |
20080237889 | Semiconductor package, method of fabricating the same, and semiconductor package mold - Provided is a semiconductor package, which may include a plurality of semiconductor chips to form a multi-stack semiconductor package (MSP), a method of fabricating the semiconductor package and the MSP, and a semiconductor package mold for fabricating the semiconductor package. The semiconductor package may include a first semiconductor chip package having a first substrate including a first surface having a center portion on which a first semiconductor chip is mounted, and at least one first boundary portion on which a plurality of conductive connection pad groups are formed, and a molding member including a body that covers the first semiconductor chip, and at least one extension that extends from the body towards a corner portion of the first surface of the first substrate, wherein the extension extends while avoiding the conductive connection pad group. The semiconductor package may further include a second semiconductor chip package stacked on the first semiconductor chip package, the second semiconductor chip including a second substrate on which at least one second semiconductor chip that is electrically connected to the conductive connection pad group may be mounted. | 10-02-2008 |
20080315379 | Semiconductor packages including thermal stress buffers and methods of manufacturing the same - Provided is a semiconductor package and method of manufacturing the same. The semiconductor package may include a semiconductor chip, an encapsulant encapsulating the semiconductor chip, a lead unit, and a partially encapsulated by the encapsulating thermal stress buffer which absorbs thermal stress of the semiconductor chip or the encapsulant. | 12-25-2008 |
20090121332 | SEMICONDUCTOR CHIP PACKAGE - A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring. | 05-14-2009 |
20100007007 | SEMICONDUCTOR PACKAGE - A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions. | 01-14-2010 |
20130277831 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package including a circuit board including a plurality of pads; a support structure disposed on the circuit board; and a plurality of semiconductor chips stacked on the circuit board and the support structure, each semiconductor chip including at least one pad. For each semiconductor chip, the at least one pad is aligned with a corresponding pad of the circuit board; and an electrical connection is formed between the at least one pad and the corresponding pad of the circuit board through the support structure. | 10-24-2013 |
Patent application number | Description | Published |
20080308913 | STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A stacked semiconductor package includes a first semiconductor package, a second semiconductor package and a conductive connection member. The first semiconductor package includes a first semiconductor chip, a first lead frame having first outer leads that are electrically connected to the first semiconductor chip, and a first molding member formed on the first semiconductor chip and the first lead frame to expose the first outer leads. The second semiconductor package includes a second semiconductor chip, a second lead frame formed on the first molding member and having second outer leads that may be electrically connected to the second semiconductor chip, and a second molding member formed on the second semiconductor chip and the second lead frame to expose the second outer leads. The conductive connection member may electrically connect the first outer leads and the second outer leads to each other. Further, the conductive connection member may have a crack-blocking groove. | 12-18-2008 |
20090026596 | LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME - In certain embodiments, a lead frame includes a paddle, a plurality of inner leads, first outer leads, and a second outer lead. The plurality of inner leads can be arranged at a side face of the paddle. The first outer leads can extend from the inner leads along a first direction and can be arranged at a substantially central portion of the side face of the paddle. Furthermore, each of the first outer leads can have a first area. The second outer lead can be arranged at an edge portion of the side face of the paddle and can be supported by the paddle. The second outer lead can have a second area that is larger than the first area. | 01-29-2009 |
20090032916 | SEMICONDUCTOR PACKAGE APPARATUS - A semiconductor package apparatus and a method of fabricating the semiconductor package apparatus. The semiconductor package apparatus includes: semiconductor chips comprising active and inactive surfaces and protected by a packing portion; a substrate on which the semiconductor chips are installed; leads comprising front portions electrically coupled to the active surfaces of the semiconductor chips and rear portions extending substantially to the substrate; and bonding materials bonded between ends of the rear portions of the leads and the substrate to electrically couple the leads to the substrate. Ends of the rear portions of the leads may stand on the substrate. Thus, solder joint reliability can be improved, and a wetting characteristic of solder can be improved during surface installation. Also, semiconductor package apparatuses having similar attributes can easily be multilayered. In addition, a foot print of the semiconductor package apparatus can be reduced to enable high-density installation. Moreover, shapes of the bonding materials (solder) can be controlled to optimize bonding strength of the leads, quantity of the bonding materials, or the like. | 02-05-2009 |
20090057916 | SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME - A semiconductor package is provided. The semiconductor package comprises a substrate having a top surface and a bottom surface, a first semiconductor chip having a plurality of bonding pad regions electrically connected to the substrate by a plurality of first bonding wires, a spacer tape covering the active surface of the first semiconductor chip excluding the plurality of bonding pad regions, and a second semiconductor chip mounted on the active surface of the first semiconductor chip with the spacer interposed. | 03-05-2009 |
20090184410 | SEMICONDUCTOR PACKAGE APPARATUS HAVING REDISTRIBUTION LAYER - Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity. | 07-23-2009 |
20120189963 | WATER-SOLUBLE RESIN COMPOSITION AND METHOD OF FORMING FINE PATTERNS BY USING THE SAME - A water-soluble resin composition for forming fine patterns comprising water-soluble polymer represented by Chemical Formula 1 as below and the first water-soluble solvent, is coated and heated on a photoresist layer having at least one contact hole to reduce a size of the at least one contact hole. | 07-26-2012 |
20130216957 | WATER-SOLUBLE RESIN COMPOSITION FOR FORMING FINE PATTERNS AND METHOD OF FORMING FINE PATTERNS BY USING THE SAME - The water-soluble resin composition for forming fine patterns comprises a water-soluble polymer represented by Chemical Formula 1 and a first water-soluble solvent. The composition is coated and heated on a photoresist layer having contact holes to reduce a size of the contact holes. | 08-22-2013 |
20130251033 | METHOD OF COMPRESSING VIDEO FRAME USING DUAL OBJECT EXTRACTION AND OBJECT TRAJECTORY INFORMATION IN VIDEO ENCODING AND DECODING PROCESS - Disclosed is a method of compressing video frame using dual object extraction and object trajectory information in a video encoding and decoding process, including: segmenting a background and a object from a reference frame in video to extract the object, extracting and encoding motion information of the object based on the object, determining whether a frame is a reference frame based on encoded video in a decoding process, if it is determined that the frame is the reference frame, generating background information of a prediction frame based on the reference frame, and generating the prediction frame by extracting an object of the reference frame and referring to header information to reflect motion information of the object. | 09-26-2013 |
20130251279 | IMAGE ENCODING METHOD USING ADAPTIVE PREPROCESSING SCHEME - The present invention relates to an image encoding method using an adaptive preprocessing scheme, including loading an input image for each frame, determining an encoding type of each of the frames, determining the size of a block to be encoded in each frame according to the determined encoding type, determining blocks that can be replicated from the blocks having the determined size and performing an intra-picture replication preprocessing or inter-picture replication preprocessing procedure on the determined blocks according to the encoding types of the frames, and encoding the frames on which the preprocessing procedure has been performed. | 09-26-2013 |
20130279821 | IMAGE ENCODING METHOD USING BINARY PARTITION TREE - An image encoding method using a Binary Partition Tree (BPT) includes performing the BPT on a reference frame, detecting blocks, each having a difference in a pixel value exceeding a threshold value in a current frame, based on a result of the BPT of the reference frame, and performing the BPT of the current frame on the detected blocks. In accordance with the present invention, block partition is not applied to all frames, but a partial partition method based on a difference between the pixel values of a reference frame and a current frame to be encoded is provided. Accordingly, the encoding speed within the P frame or the B frame can be improved. Furthermore, the PSNR of a corresponding frame can be maintained within a specific range of the PSNR of a reference frame, and a compression effect can be improved. | 10-24-2013 |
Patent application number | Description | Published |
20110079890 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE, AND MOBILE PHONE INCLUDING THE SEMICONDUCTOR PACKAGE STRUCTURE - Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips. | 04-07-2011 |
20110272819 | WAFER LEVEL PACKAGE AND METHODS OF FABRICATING THE SAME - In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern. | 11-10-2011 |
20110318876 | SEMICONDUCTOR PACKAGE, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring. | 12-29-2011 |
20120115307 | METHODS OF MANUFACTURING SEMICONDUCTOR CHIPS - A method of manufacturing semiconductor chips includes providing a semiconductor substrate including circuit regions, irradiating the semiconductor substrate with a laser beam onto to form a frangible layer, and polishing the semiconductor substrate to separate the circuit regions of the semiconductor substrate from one another into semiconductor chips. The frangible layer may be removed completely during the polishing of the semiconductor substrate. | 05-10-2012 |
20120199968 | SEMICONDUCTOR PACKAGE - A semiconductor package and method of manufacturing thereof are provided. The package includes: a substrate; a first metal wire on a top surface of the substrate; a first semiconductor chip disposed on the substrate; a first insulation layer which covers the first semiconductor chip and at least a part of the substrate; a second metal wire formed on a top surface of the first insulation layer; a first via formed in the first insulation layer, wherein the first via electrically connects the second metal wire and the first metal wire; and a second semiconductor chip disposed on the second metal wire, wherein the second semiconductor chip is electrically connected to the second metal wire. | 08-09-2012 |
20120234497 | DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF - A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit. | 09-20-2012 |
20120298656 | APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICES - An apparatus for fabricating semiconductor devices includes a chamber having a bottom plane, a side wall and a lid. An irradiating unit is at an interior of the chamber. A substrate mounting unit is between the bottom plane of the chamber and the irradiating unit. The irradiating unit includes an irradiating tube and a hole penetrating the central region of the irradiating tube. The irradiating tube has a hollow disk shape, and a lower surface of the irradiating tube is opened to the substrate mounting unit. | 11-29-2012 |
20120309167 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process. | 12-06-2012 |
20120313244 | SEMICONDUCTOR PACKAGE, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring. | 12-13-2012 |
20130032947 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package that stably protects an internal semiconductor chip from external shocks, and a method of manufacturing the semiconductor package is disclosed. The semiconductor package includes a first semiconductor chip including a first body layer having a first surface, a second surface, and a lateral surface between the first surface and the second surface, and a first protective layer that exposes an edge portion of the first surface and forms a step difference with the first surface; an encapsulation structure that covers a lateral surface of the first body layer and the edge portion of the first surface so as to encapsulate the first semiconductor chip to have a locking structure; and a first conductive terminal formed on the first body layer through the protective layer. | 02-07-2013 |
20130087917 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad. | 04-11-2013 |
20130149817 | FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN - A fabricating method of a semiconductor device may include forming a semiconductor die on a supporting wafer, and picking up the die from the wafer by attaching to the die a transfer unit, the transfer unit including a head unit configured to enable twisting movement, and performing the twisting movement. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer; and picking up the first semiconductor device from the wafer, moving the first semiconductor device onto a second semiconductor device, and bonding the first semiconductor device to the second semiconductor device while maintaining the first semiconductor device oriented so that a surface faces upwardly. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer, attaching to the first semiconductor device a transfer unit configured to enable twisting movement, and performing the twisting movement. | 06-13-2013 |
20130169347 | Temperature Management Circuit, System on Chip Including the Same and Method of Managing Temperature - In managing temperature in a system on chip (SOC), a main temperature signal is generated using a main sensor, where the main temperature signal is a signal having a value corresponding to a main temperature of the SOC. Subsidiary temperature signals are generated using subsidiary sensors, where the subsidiary temperature signals are pulse signals having frequencies corresponding to subsidiary temperatures of subsidiary blocks in the SOC, respectively. An operation of the SOC is controlled based upon the main temperature signal and the subsidiary temperature signals. | 07-04-2013 |
20140138799 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Semiconductor packages capable of reducing a total height thereof and methods of manufacturing the semiconductor package are provided. The semiconductor package includes a semiconductor substrate having first and second surfaces opposite to each other, a semiconductor device formed on the first surface of the semiconductor substrate, pads formed on the first surface of the semiconductor substrate and electrically connected to the semiconductor device, and at least one printed circuit layer including a resin layer, via electrodes penetrating through the resin layer, and line layers formed on the first resin layer and connected to the via electrodes and attached onto the first surface of the semiconductor substrate. The via electrodes and the line layers are formed of the same type of material, and the via electrodes are electrically connected to the pads. | 05-22-2014 |
20140299980 | SEMICONDUCTOR PACKAGES INCLUDING A HEAT SPREADER AND METHODS OF FORMING THE SAME - Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer. | 10-09-2014 |
20150130083 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device and a method of fabricating the same includes providing a first semiconductor chip which has first connection terminals, providing a second semiconductor chip which comprises top and bottom surfaces facing each other and has second connection terminals and a film-type first underfill material formed on the bottom surface thereof, bonding the first semiconductor chip to a mounting substrate by using the first connection terminals, bonding the first semiconductor chip and the second semiconductor chip by using the first underfill material, and forming a second underfill material which fills a space between the mounting substrate and the first semiconductor chip and covers side surfaces of the first semiconductor chip and at least part of side surfaces of the second semiconductor chip. | 05-14-2015 |
20150223758 | ELECTROCARDIOGRAM SENSOR AND METHOD OF PROCESSING SIGNALS USING THE SAME - An electrocardiogram (ECG) sensor includes an analog front end device configured to remove a DC offset in a first ECG signal received from a measuring electrode, and adjust a gain amplification value based on the first ECG signal. The analog front end device is configured to output an adjusted first ECG signal, the adjusted first ECG signal being based on the adjusted gain amplification value and the removed DC offset in the first ECG signal. The ECG sensor includes a digital signal processor configured to analyze and process the adjusted first ECG signal based on an algorithm and to output information. The analog front end device is configured to remove the DC offset in the first ECG signal during a first period, and remove a DC offset in a second ECG signal and simultaneously adjust a gain amplification value for the second ECG signal during a second period. | 08-13-2015 |
20150230757 | ELECTROCARDIOGRAM (ECG) SENSOR AND METHOD OF OPERATING THE SAME - An electrocardiogram (ECG) sensor includes a motion artifact detector configured to detect a motion artifact component from a first channel signal of a first channel and a second channel signal of a second channel using a channel offset coefficient. The channel offset coefficient indicates a difference between the first channel signal and the second channel signal. The ECG sensor includes an ECG filter configured to generate an ECG signal by performing a least mean square (LMS) filtering operation on the first channel signal to remove the motion artifact component. | 08-20-2015 |