Patent application number | Description | Published |
20100167203 | Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same - A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the composition including a solvent and an organosilane polymer, the organosilane polymer being a condensation polymerization product of at least one first compound represented by Chemical Formulae 1 and 2 and at least one second compound represented by Chemical Formulae 3 to 5. | 07-01-2010 |
20100167212 | RESIST UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME - A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the resist underlayer composition including a solvent and an organosilane-based polymer, the organosilane-based polymer being a polymerization product of at least one first compound represented Chemical Formulae 1 to 3 and at least one second compound represented by Chemical Formulae 4 and 5. | 07-01-2010 |
20100279509 | Silicon-based hardmask composition and process of producing semiconductor integrated circuit device using the same - A silicon-based hardmask composition, including an organosilane polymer represented by Formula 1: | 11-04-2010 |
20110129981 | FILLER FOR FILLING A GAP AND METHOD FOR MANUFACTURING SEMICONDUCTOR CAPACITOR USING THE SAME - A filler for filling a gap includes a hydrogenated polysiloxazane having an oxygen content of about 0.2 to about 3 wt %. A chemical structure of the hydrogenated polysiloxazane includes first, second, and third moieties represented by the following respective Chemical Formulas 1-3: | 06-02-2011 |
20110156185 | Resin Composition for Protection Layer of Color Filter, Protection Layer of Color Filter Using Same and Image Sensor Including Same - Disclosed is a resin composition for a protective layer of a color filter including an acrylate-based resin including a repeating unit represented by each of Chemical Formulae 1 to 3, a melamine-based resin represented by Chemical Formula 4, a thermal acid generator (TAG), and a solvent. | 06-30-2011 |
20120164382 | COMPOSITION FOR FORMING A SILICA LAYER, METHOD OF MANUFACTURING THE COMPOSITION, SILICA LAYER PREPARED USING THE COMPOSITION, AND METHOD OF MANUFACTURING THE SILICA LAYER - A composition for forming a silica layer, a method of manufacturing the composition, a silica layer prepared using the composition, and a method of manufacturing the silica layer, the composition including hydrogenated polysilazane, hydrogenated polysiloxazane, or a combination thereof, wherein a concentration of a sum of hydrogenated polysilazane and hydrogenated polysiloxazane having a weight average molecular weight, reduced to polystyrene, of greater than or equal to about 50,000 is about 0.1 wt % or less, based on a total amount of the hydrogenated polysilazane and hydrogenated polysiloxazane. | 06-28-2012 |
20120177829 | COMPOSITION FOR FORMING SILICA BASED INSULATING LAYER, METHOD FOR MANUFACTURING COMPOSITION FOR FORMING SILICA BASED INSULATING LAYER, SILICA BASED INSULATING LAYER AND METHOD FOR MANUFACTURING SILICA BASED INSULATING LAYER - A composition for forming silica-based insulation layer includes a hydrogenated polysiloxazane including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, and having a chlorine concentration of about 1 ppm or less: | 07-12-2012 |
20120267766 | RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THE SAME - A resist underlayer composition includes a solvent and an organosilane condensation polymerization product, the organosilane condensation polymerization product including about 40 to about 80 mol % of a structural unit represented by the following Chemical Formula 1, | 10-25-2012 |
20120270143 | RESIST UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES USING THE SAME - A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product including about 10 to about 40 mol % of a structural unit represented by Chemical Formula 1: | 10-25-2012 |
20120270981 | RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THE SAME - A resist underlayer composition includes a solvent, and an organosilane condensation polymerization product of: a compound represented by the following Chemical Formula 1, a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3, | 10-25-2012 |
20120270998 | RESIN COMPOSITION FOR TRANSPARENT ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE FORMED USING THE SAME - A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2, | 10-25-2012 |
20120282776 | PHOTORESIST UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME - A photoresist underlayer composition includes a solvent, and a polysiloxane resin represented by Chemical Formula 1: | 11-08-2012 |
20130017662 | FILLER FOR FILLING A GAP, METHOD OF PREPARING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR CAPACITOR USING THE SAMEAANM PARK; Eun-SuAACI Uiwang-siAACO KRAAGP PARK; Eun-Su Uiwang-si KRAANM Kim; Bong-HwanAACI Uiwang-siAACO KRAAGP Kim; Bong-Hwan Uiwang-si KRAANM Lim; Sang-HakAACI Uiwang-siAACO KRAAGP Lim; Sang-Hak Uiwang-si KRAANM Kwak; Taek-SooAACI Uiwang-siAACO KRAAGP Kwak; Taek-Soo Uiwang-si KRAANM Bae; Jin-HeeAACI Uiwang-siAACO KRAAGP Bae; Jin-Hee Uiwang-si KRAANM Yun; Hui-ChanAACI Uiwang-siAACO KRAAGP Yun; Hui-Chan Uiwang-si KRAANM Kim; Sang-KyunAACI Uiwang-siAACO KRAAGP Kim; Sang-Kyun Uiwang-si KRAANM Lee; Jin-WookAACI Uiwang-siAACO KRAAGP Lee; Jin-Wook Uiwang-si KR - A filler for filling a gap includes a compound represented by the following Chemical Formula 1. | 01-17-2013 |
20130037921 | RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING SAME - A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product of hydrolyzed products produced from a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3. | 02-14-2013 |
20130143363 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME - An adhesive film for a semiconductor may include about 60 wt % to about 80 wt % of a thermoplastic resin based on a total solid content of the adhesive film, a phenolic curing agent, and an amine curing agent, and the adhesive film may have a storage modulus of about 2 MPa or more and a reaction curing rate of about 50% or more when cured at 150° C. for 20 minutes. | 06-06-2013 |
20130171564 | Positive Photosensitive Resin Composition, and Display Device and Organic Light Emitting Device Using the Same - Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. | 07-04-2013 |
20130171568 | Positive Photosensitive Resin Composition, and Photosensitive Resin Layer and Display Device Using the Same - Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same. | 07-04-2013 |
20140170562 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm. | 06-19-2014 |
20140187017 | PROCESS OF PREPARING A GAP FILLER AGENT, A GAP FILLER AGENT PREPARED USING SAME, AND A METHOD FOR MANUFACTURING SEMICONDUCTOR CAPACITOR USING THE GAP FILLER AGENT - A method of preparing a gap filler agent includes adding a halosilane to a basic solvent, and, to the basic solvent and the halosilane, adding ammonia in an amount of about 50 to about 70 parts by weight based on 100 parts by weight of the halosilane at a rate of about 1 g/hr to about 15 g/hr. | 07-03-2014 |
20140315367 | RINSE LIQUID FOR INSULATING FILM AND METHOD OF RINSING INSULATING FILM - A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1: | 10-23-2014 |
20140346391 | POLYSILOXANE HYDROXIDE THIN-FILM RINSE SOLUTION, AND POLYSILOOXAZINE HYDROXIDE THIN-FILM PATTERN-FORMING METHOD USING THE SAME - Provided is a rinse solution for a hydrogenated polysiloxazane thin film including an additive selected from an alcohol-based solvent, an ester-based solvent, a silanol-based solvent, an alkoxysilane-based solvent, an alkylsilazane-based solvent, and a combination thereof in an amount of 0.01 wt % to 7 wt % based on the total amount of the rinse solution. | 11-27-2014 |