Patent application number | Description | Published |
20090157815 | MOBILE DEVICE FOR PROVIDING BLOG SERVICE AND METHOD FOR PROVIDING BLOG SERVICE USING THE SAME - A mobile device for providing a blog service and a method and system for providing the blog service. The mobile device that operates as a blog providing server includes: a unit for obtaining raw data; a storage unit storing the raw data and blog information; and a blog editor generating/editing a blog page by using the raw data and the blog information. | 06-18-2009 |
20090198763 | METHOD AND SYSTEM FOR PROVIDING BLOG SERVICE BY USING MOBILE TERMINAL, AND MOBILE BLOG CASTER THEREFOR - A method and system to provide a blog by using a mobile terminal, and a mobile blog (MB) caster therefor, the method including: receiving blog data including one or more pieces of downsized data from an MB caster; selecting a piece of downsized data from among the one or more pieces of downsized data; obtaining metadata corresponding to the selected piece of downsized data; accessing a web blog server; and downloading original data corresponding to the metadata from the web blog server. Since the blog is created and provided by using the downsized data, instead of the original data, a blog server operation can be realized by using only existing mobile devices. Furthermore, the mobile terminal does not have to be connected to the Internet (or the web blog server) for a blog service. Also, it is possible to provide the blog at very high speed. | 08-06-2009 |
20120085574 | Heat radiating substrate and method of manufacturing the same - Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured. | 04-12-2012 |
20140041906 | METAL HEAT RADIATION SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein are a metal heat radiation substrate and a manufacturing method thereof. The metal heat radiation substrate includes: a metal substrate having a through-hole formed therein; a heat resistant insulating material filled in the through-hole and having a via hole formed at a filled portion; a metal oxide film formed on upper and lower surfaces of the metal substrate except for an inner wall of the through-hole by performing anodizing thereon; and a conductive layer filled in the via hole and formed over the metal oxide film. | 02-13-2014 |
20140187112 | PREPREG, METHOD FOR MANUFACTURING THE SAME, AND COPPER CLAD LAMINATE USING THE SAME - Disclosed herein are a prepreg, including: an inorganic fiber, an organic fiber, or a hybrid fiber obtained by mix-weaving the inorganic fiber and the organic fiber, coated with a thermally conductive component or impregnated with a thermally conductive component; and a cross-linkable resin for impregnating the fiber therewith, a method for manufacturing the same, and a copper clad laminate using the same, so that the prepreg and the copper clad laminate can maintain a low coefficient of thermal expansion and a high modulus of elasticity and have excellent heat radiation property. | 07-03-2014 |
20140353004 | INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY AND ELECTRICAL PROPERTIES, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board. | 12-04-2014 |
20150053457 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and buried in the positive photosensitive insulating layer. | 02-26-2015 |
20150114691 | CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having internal electrodes exposed on both surfaces thereof. | 04-30-2015 |
20150114696 | CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof. | 04-30-2015 |