Patent application number | Description | Published |
20090261356 | Sub-Mount, light emitting diode package and manufacturing method thereof - A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced. | 10-22-2009 |
20100032705 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns. | 02-11-2010 |
20120001544 | LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component. | 01-05-2012 |
20120043875 | RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE - The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element. | 02-23-2012 |
20120206928 | Illuminating Apparatus - The present disclosure relates to an illuminating apparatus which is received at the back of an outer surface and which includes: a lighting part having a front surface, through which the light is irradiated, and a rear surface, which is the back side of the front surface; an electric connector electrically connected to the lighting part and coupled to a power supply at the back of the outer surface; and a length-adjustable shaft provided between the lighting part and the electric connector and bringing the rear surface of the lighting part into contact with the outer surface. | 08-16-2012 |
20120217877 | Lighting Apparatus Using PN Junction Light-Emitting Element and Dimming Method Thereof - The present disclosure discloses a dimming method of a lighting apparatus using a PN junction light-emitting element, the method including: supplying AC controlled by a dimmer; causing a first group, which has one PN junction light-emitting element positioned within a first boundary and one PN junction light-emitting element positioned within a second boundary, to emit light at a first voltage by the supplied AC when a first switch is in the ON state; and causing a second group, which has another PN junction light-emitting element positioned within the first boundary and another PN junction light-emitting element positioned within the second boundary and which is connected in series to the first group, to emit light at a second voltage higher than the first voltage by the supplied current when the first switch positioned between the first group and the second group is in the OFF state. | 08-30-2012 |
20120217891 | Lighting Apparatus Using PN Junction Light-Emitting Element - The present disclosure discloses a lighting apparatus using a PN junction light-emitting element, the apparatus including: a power transmitting substrate having a plurality of boundaries defined thereon; a plurality of PN junction light-emitting elements positioned within each boundary and divided into a plurality of groups; and a first switch provided on the power transmitting substrate, wherein the first switch goes into the ON state by a supplied AC having a first voltage to cause PN junction light-emitting elements of a first group positioned within each boundary to emit light, and the first switch is in the OFF state when PN junction light-emitting elements of a second group, which is positioned within each boundary and connected in series to the first group, emit light by a supplied AC having a second voltage higher than the first voltage. | 08-30-2012 |
20140034358 | ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME, PRINTED CIRCUIT BOARD USING ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. | 02-06-2014 |
20140103386 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns. | 04-17-2014 |
20140210362 | ILLUMINATING APPARATUS USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS - An illuminating apparatus using semiconductor light emitting elements comprising: n LED groups (n≧2) which are serially connected, each being capable of radiating light in a half cycle of an AC input voltage and including a first LED of a first color temperature or a second LED of a second color temperature higher than the first color temperature, wherein, in a current flow path, a first LED group of the n LED groups includes the first LED; and a set of switches including at least one bypass switch located between the p-th LED group (1≦p07-31-2014 | |