Patent application number | Description | Published |
20120073747 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
20120075818 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
Patent application number | Description | Published |
20100167081 | RESIN COMPOSITION CONTAINING CATALYST PRECURSOR FOR ELECTROLESS PLATING IN FORMING ELECTRO-MAGNETIC SHIELDING LAYER, METHOD OF FORMING METALLIC PATTERN USING THE SAME, AND METALLIC PATTERN FORMED BY THE SAME METHOD - A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating. | 07-01-2010 |
20110151379 | BLACK MATRIX COMPOSITION WITH HIGH LIGHT-SHIELDING AND IMPROVED ADHESION PROPERTIES - The present invention relates to a black matrix photosensitive resin composition having high light-shielding and improved adhesion properties and a black matrix for a liquid crystal display including the same. The black matrix photosensitive resin composition comprises an alkali-soluble binder resin, a multi-functional monomer having an ethylenic unsaturated double bond, a photopolymerization initiator, an adhesion accelerator, a solvent, and a colorant comprising black pigments. A Cardo type binder is mixed in an amount of 10 to 90 wt % and an acryl type binder is mixed in an amount of 10 to 90 wt % based on a total weight of the alkali-soluble binder resin including the Cardo type binder and the acryl type binder. | 06-23-2011 |
20120189961 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE MATERIAL COMPRISING THE SAME - The present invention relates to a photosensitive resin composition and a photosensitive material comprising the same. The photosensitive resin composition according to an exemplary embodiment of the present invention may comprise two multi-functional monomers where structures of side chains comprising unsaturated double bonds are different from each other while a composition ratio is changed. Accordingly, in the exemplary embodiment of the present invention, processability is excellent, and it is possible to decrease defects by a rupture when a LCD substrate is sealed and substrate separation defects due to an impact to the LCD products by improving an adhesion property to a lower substrate after a hard baking process. | 07-26-2012 |
20130203617 | Glycoprotein Analysis Kit and Use Thereof - Disclosed are a glycoprotein analysis kit and use thereof. The glycoprotein analysis kit comprises a fluorescently labeled antibody, a fluorescently labeled biomaterial, and a support, and is used in a dual probing method for analyzing the content of a glycoprotein and profiling the oligosaccharide chain, simultaneously, and a method for selecting a single cell producing the glycoprotein having a desired glycosylation pattern. Also, a single cell producing the glycoprotein having a desired glycosylation pattern is provided. | 08-08-2013 |
20140030426 | RESIN COMPOSITION CONTAINING CATALYST PRECURSOR FOR ELECTROLESS PLATING IN FORMING ELECTRO-MAGNETIC SHIELDING LAYER, METHOD OF FORMING METALLIC PATTERN USING THE SAME, AND METALLIC PATTERN FORMED BY THE SAME METHOD - A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating. | 01-30-2014 |
20140088292 | Water-Soluble Polypeptides Comprised of Repeat Modules, Method for Preparing the Same and Method for a Target-Specific Polypeptide and Analysis of Biological Activity Thereof - The present invention relates to a soluble polypeptide comprised of repeat modules. More particularly, the present invention relates to a soluble fusion polypeptide of the N-terminal domain of internalin and LRR (Leucine rich repeat) family protein, a method for preparing the polypeptide, a vector comprising a nucleic acid sequence encoding the polypeptide, a host cell comprising the vector, a method for producing a solubility and folding-improved fusion polypeptide by expressing the vector in the host cell, and a method for improving the solubility and folding of the fusion polypeptide. Further, the present invention relates to a method for preparing the polypeptide bound with a specific target and analyzing the efficacy of the soluble polypeptide. | 03-27-2014 |
20140220491 | PHOTOACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME - The present invention relates to a photoactive compound having a novel structure and a photosensitive resin composition including the same, and the photoactive compound according to the present invention has excellent sensitivity due to efficient absorption to a UV light source by including a nitro group and a phosphonate structure, and has excellent retention rate, mechanical strength, heat resistance, chemical resistance and developing resistance by improving solubility of the photosensitive resin composition by excellent compatibility of the phosphonate structure and a binder resin. Therefore, the photosensitive resin composition according to the present invention is useful to cure a column spacer, an overcoat, a passivation material and the like of a liquid crystal display device, and is useful in view of a high temperature process property. | 08-07-2014 |
20150111009 | PHOTOSENSITIVE RESIN COMPOSITION AND TOUCH PANEL OR DISPLAY DEVICE INCLUDING BEZEL PATTERN PREPARED BY USING SAME - The present specification relates to a photoresist resin composition, a touch panel including a bezel pattern manufactured by using the photoresist resin composition, and a display device including the bezel pattern manufactured by using the photoresist resin composition. | 04-23-2015 |
20150125789 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMED USING SAME AND DISPLAY PANEL COMPRISING SAME - The present specification provides a photosensitive resin composition comprising an alkali-soluble binder, a crosslinkable compound, a photopolymerization initiator, a solvent, a coloring agent and an epoxy adhesion promoter. The photosensitive resin composition has excellent insulating properties and light-shielding properties and shows excellent chemical resistance in an etching process and a stripping process. Thus, the photosensitive resin composition can be formed into a thin bezel layer having a gradual taper, and thus can provide an integrated touch sensor that makes it possible to prevent short circuits from occurring in metal wiring and minimize any decrease in resistance resulting from high-temperature processing. | 05-07-2015 |
Patent application number | Description | Published |
20090073154 | POWER GENERATING MODULE AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - Provided are a power generating module and an LCD having the same. The power generating module includes a first driving voltage generator, a second driving voltage generator and an output deviation controller. The first driving voltage generator generates and outputs a first driving voltage including a first liquid crystal driving voltage and a first gate-on-voltage. The second driving voltage generator generates and outputs a second driving voltage including a second liquid crystal driving voltage and a second gate-on-voltage. The output deviation controller controls the first and second driving voltage generators using a feedback signal corresponding to a potential difference between the first driving voltage and the second driving voltage to reduce output deviation between the first driving voltage and the second driving voltage. The voltage levels of driving powers output from a plurality of power source units are compared to generate feedback signals corresponding to potential differences thereof and to provide the generated feedback signals to the plurality of power source units, so that the voltage levels of the driving powers output from the plurality of power source units are controlled to converge to an intermediate level. Therefore, output deviation between driving powers output from the plurality of power source units can be reduced. | 03-19-2009 |
20090245461 | COMPLEX IMAGING SYSTEM FOR DENTAL - Disclosed therein is a dental complex imaging system including: a base seated on the ground; a chair part disposed on the upper portion of the base for allowing a patient to wait for imaging with him/her seated thereon; a pole mounted on the base so as to be adjacent to the chair part; a support part adapted to extend toward the patient from the top of the pole; an expanding and contracting part pivotally coupled to the underside of the support part so as to be expanded and contracted; a radiation generator part disposed below one side of the expanding and contracting part and moving according to expansion and contraction of the expanding and contracting part for emitting radiation selected according to CT imaging, cephalography and panoramic radiography; a radiation detecting part disposed on the other side of the expanding and contracting part in such a way as to be opposed to the radiation generator part for detecting radiation selectively emitted from the radiation generator part according to the CT imaging, the cephalography and the panoramic radiography; and a control part for reading imaging information detected by the radiation detecting part. The dental complex imaging system can provide a doctor and a patient with convenience and economic profits since it does not need various equipments for conducting the CT imaging, the panoramic radiography, and the cephalography. | 10-01-2009 |
20100055647 | Manufacturing Method and Apparatus of Artificial Teeth Using Dental CT - The present invention discloses a manufacturing method and apparatus of artificial human teeth using dental CT. The method comprises the steps of: removing a damaged part of human teeth; obtaining surface coordinates of the teeth using a dental CT machine located at a dental clinic for a medical checkup; converting the surface coordinates of the actual teeth to CAD/CAM data; manufacturing artificial teeth by cutting metal or ceramic with a three-dimensional N/C machine using the converted data; obtaining shape data of upper or lower actual teeth corresponding to the artificial teeth; changing the shape of the artificial teeth by direct surface processing according to the shape data of the upper or lower teeth; and coating ceramic to the artificial teeth after sintering the processed artificial teeth for a predetermined period. | 03-04-2010 |
20120020501 | DUAL EARPHONE USING BOTH BONE CONDUCTION AND AIR CONDUCTION - Disclosed is an earphone set using both bone conduction and air conduction. The earphone set includes: a dual earphone which allows a user to selectively hear sounds from the front or rear side of the earphone set; a case cover provided at an end of the dual earphone; a cylindrical reinforcing frame assembled on one side of the case cover; a finishing ring mounted on the outer peripheral surface of the cylindrical reinforcing frame; a top cover assembled on one side of the cylindrical reinforcing frame and the finishing ring and having an extension projection at one side thereof; a rubber ear cap assembled at a front end of the extension projection to be inserted into an ear hole of a user; and a bone conduction vibrator provided inside the dual earphone. | 01-26-2012 |
20120269003 | DATA DECISION METHOD AND MEMORY - A data decision method including checking whether threshold voltages of a plurality of memory cells are greater than a first verification voltage, checking whether the threshold voltages of the plurality of memory cells are greater than a second verification voltage, wherein the second verification voltage is greater than the first verification voltage, and checking threshold voltages of memory cells adjacent to memory cells having threshold voltages greater than the first verification voltage and lower than the second verification voltage among the plurality of memory cells. | 10-25-2012 |
20130308798 | Communication Terminal Having Bone Conduction Function - The present invention relates to a communication terminal having a bone conduction function. To this end, the present invention provides a communication terminal having a bone conduction function equipped with a bone conduction vibration receiver/speaker ( | 11-21-2013 |
20150143203 | SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor device includes a memory device suitable for outputting health monitoring data including information on a threshold voltage distribution, and outputting read data read from memory cells included in the memory device, and a controller suitable for receiving a predetermined quantity of the read data from the memory device based on the health monitoring data, and performing a decoding operation for an error correction by using the received read data. | 05-21-2015 |
Patent application number | Description | Published |
20090049686 | Method of manufacturing component-embedded printed circuit board - A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first insulation layer stacked over a first metal layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers. | 02-26-2009 |
20090244864 | Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof - Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C). | 10-01-2009 |
20120152886 | METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD - A method of manufacturing a capacitor-embedded printed circuit board, the method including providing a substrate on which a first metal layer, a dielectric layer and an adhesive resin layer are stacked on the order thereof; etching a part of the first metal layer to form a first electrode and a first circuit pattern; compressing a surface of the substrate, on which the first electrode is formed, onto a core board by interposing an insulation resin layer; forming a second electrode and a second circuit pattern on the adhesive resin layer; stacking an insulation board on the substrate such that the second electrode and the second circuit pattern are covered; and forming a third circuit pattern on the insulation board. | 06-21-2012 |
Patent application number | Description | Published |
20080196931 | Printed circuit board having embedded components and method for manufacturing thereof - A printed circuit board having embedded components and a method for the manufacturing of the printed circuit board are disclosed. The printed circuit board includes: an intermediary insulation layer; a first core board, in which a first component having at least one electrode formed on one side is embedded, stacked on one side of the intermediary insulation layer; a first insulation layer stacked on the first core board such that the first component is covered; a second core board, in which a second component having at least one electrode formed on one side is embedded, stacked on the other side of the intermediary insulation layer; a second insulation layer stacked on the second core board such that the second component is covered; and a first via, which penetrates the first core board and the second core board. The use of this printed circuit board allows highly integrated designs. | 08-21-2008 |
20110005823 | PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein. | 01-13-2011 |
20110123808 | INSULATOR AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT - An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer. | 05-26-2011 |
20110216513 | ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other. | 09-08-2011 |