Patent application number | Description | Published |
20120279683 | COOLING APPARATUS FOR COMMUNICATIONS PLATFORMS - An apparatus comprising a rack having one or more shelves, a plurality of electronics circuit boards and heat conduits and a cooler. Each board is held by one of the one or more shelves, some of the boards having a localized heat source thereon. Each heat conduit forms a heat conducting path over and adjacent to a particular one of the boards from a region adjacent to the heat source thereon to a connection zone, the zone being remote from the heat source. The cooler is located on a side of the rack and coupled to the zones such that heat is transferable from the paths to the cooler. The cooler is configured to flow a cooling fluid therein to cool localized thermal interfaces at the cooler, each interface being adjacent to and at a corresponding one of the zones. | 11-08-2012 |
20120281359 | MECHANICALLY-REATTACHABLE LIQUID-COOLED COOLING APPARATUS - An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler. | 11-08-2012 |
20130088835 | ACTIVE AIR-COOLING DEVICE FOR ELECTRONIC CIRCUITS - A device comprising a casing and a motorized air-mover. The casing encloses an air-inlet duct, air-outlet duct and a cavity located between the air-inlet duct and the air-outlet duct and in air-flow communication with the air-inlet duct and the air-outlet duct. The motorized air-mover is located in the cavity, the motorized air-mover configured to move air from the air-inlet duct to the air-outlet duct, wherein there is a gap between an outer-surface of the motorized air-mover and an interior wall of casing defining the cavity. | 04-11-2013 |
20130118543 | GEOTHERMALLY-COOLED SOLAR THERMOELECTRIC ENERGY HARVESTER - A solar thermoelectric generator (STEG) is disclosed. A STEG includes a thermoelectric generator (TEG) configured to convert light energy from solar light into electrical energy, and a heat transfer structure coupled to the TEG where a portion of the heat transfer structure is configured to be embedded in the earth. The TEG includes a first side and a second side, wherein the solar light is incident on the first side of the TEG and the heat transfer structure is configured to provide cooling for the second side of the TEG using geothermal cooling. The use of geothermal cooling to provide cooling for the second side of the TEG increases the temperature difference across the TEG of the STEG, thereby increasing the net generation efficiency of the STEG. | 05-16-2013 |
20140083653 | Vapor-Based Heat Transfer Apparatus - A vapor-based heat transfer apparatus comprising a hollow structure and a working liquid within the hollow structure, wherein the structure is made of a thermally conductive polymer. In some embodiments the apparatus comprises a vapor chamber. In some other embodiments, the apparatus comprises a vapor chamber, heat pipe and a heat sink. | 03-27-2014 |
Patent application number | Description | Published |
20100246128 | Circuit Pack Cooling Solution - An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components. | 09-30-2010 |
20110086196 | Thermal Interface Device - Device including enclosure, plurality of particles, and matrix material. Particles are formed of material having substantial bulk thermal conductivity of at least about one watt per meter-Kelvin (1 W/[mK]) at standardized measurement temperature of about 68° F. Particles are dispersed in matrix material and encapsulated in enclosure. Enclosure is configured, upon deformation, to allow portion of matrix material to escape while retaining at least portion of particles within enclosure. System that includes device. Method that includes providing enclosure, first object having first surface, and second object having second surface. Method also includes placing enclosure between first and second surfaces and pressing first and second surfaces together, causing enclosure to be deformed allowing portion of matrix material to escape while retaining portion of particles within enclosure. | 04-14-2011 |
20110149518 | HEAT-TRANSFER ARRANGEMENT FOR ENCLOSED CIRCUIT BOARDS - An electronics module designed to efficiently remove heat from enclosed circuit boards via one or more configurable heat conduits. Each heat conduit is custom-configured to provide good thermal contact between the corresponding heat-generating electronic device of an enclosed circuit board and the clamshell housing that encloses the circuit board. Good thermal contact between the clamshell housing and the outer case of the electronic module facilitates efficient heat transfer to the finned exterior surface of the outer case, where the heat is dissipated into the ambient environment via thermal conduction, natural convection, forced convection, and/or thermal radiation. Depending on the topology of the circuit board and the individual characteristics of the electronic device to be cooled, the corresponding configurable heat conduit might be based on a nested heat-sink coupler, a fitted movable plug, or a flexible ribbon-shaped heat pipe. | 06-23-2011 |
Patent application number | Description | Published |
20120012284 | HEAT SINK WITH STAGGERED HEAT EXCHANGE ELEMENTS - Heat sink comprising a base and a plurality of heat exchange elements. The elements are connected to and raised above, a surface of the base. There is a first row of the elements, with each of the elements having a long dimension that is substantially parallel to the long dimension of the other elements of the first row and to the surface. There is a second row of the elements, each of the elements having a long dimension that is substantially parallel to the long dimension of the other elements of the second row and to the surface. The first row and the second row are substantially opposed to each other such that one set of ends of the elements of the first row are staggered with respect to one set of ends of the elements of the second row. | 01-19-2012 |
20120012286 | AIR JET ACTIVE HEAT SINK APPARATUS - An apparatus comprising a heat sink and a plenum. The heat sink includes a base and a plurality of heat exchange elements, connected to and raised above, a surface of the base. The plenum is located above the heat exchange elements. The plenum includes a housing configured to hold a positive air-pressure therein, and openings in a surface of the housing. The opening are positioned such that air exiting the plenum through the openings is directed to the heat sink. | 01-19-2012 |
20140151012 | HEAT SINK WITH STAGGERED HEAT EXCHANGE ELEMENTS - A heat sink comprising a base, a first row of metal fins and a second row of wedge-shaped vortex generators. The first row of metal fins can be connected to and raised above a surface of the base, long dimensions of the metal fins being substantially parallel to each other and to the surface. The second row of wedge-shaped vortex generators can be connected to and raised above the base, each of the wedge-shaped vortex generators having a long dimension that is substantially parallel to the long dimensions of others of the wedge-shaped vortex generators and to the surface. The first and second rows can be substantially opposed to each other such that first ends of the metal fins are staggered with respect to first ends of the wedge-shaped vortex generators. | 06-05-2014 |
Patent application number | Description | Published |
20090242036 | Directed-flow conduit - Device including channel having channel input and output. Channel has interior channel surface extending along channel path from channel input to output. In one implementation, channel includes plurality of channel sections in serial communication along channel path. Each of channel sections includes first internal circumference spaced apart along channel path from second internal circumference, in each of channel sections the first and second internal circumferences being substantially different. Each of channel sections includes sub-surface of interior channel surface. At least region of sub-surface of each channel section includes distribution of raised micro-scale features. As another implementation, at least first region of interior channel surface includes distribution of raised micro-scale features interrupted by plurality of raised barriers spaced apart along channel path on interior channel surface. Each raised barrier extends on interior channel surface in directions partially transverse to and partially parallel to longitudinal axis. Method also provided. | 10-01-2009 |
20090242175 | Thermal energy transfer device - Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane. Process includes providing wick evaporator, providing liquid working fluid in contact with lower or upper surface of membrane, and causing liquid working fluid to be evaporated from liquid-vapor interface in membrane. | 10-01-2009 |
20090302974 | LIGHT-WEIGHT LOW-THERMAL-EXPANSION POLYMER FOAM FOR RADIOFREQUENCY FILTERING APPLICATIONS - An apparatus | 12-10-2009 |
20090315173 | HEAT-TRANSFER STRUCTURE - An apparatus | 12-24-2009 |
20100104748 | CLOSED-CELL SURFACES WITH ENHANCED DRAG-REDUCTION PROPERTIES - An apparatus, comprising a plurality of closed cells disposed on a surface of a substrate. Each of the closed cells has at least one dimension that is less than about 1 millimeter and are configured to hold a medium therein. The apparatus also comprises a foam that contacts the closed cells. The foam has fluid walls that include a surfactant, and bubbles of the foam layer are filled with the medium. | 04-29-2010 |
20120227243 | CLOSED CELL SURFACES WITH ENHANCED DRAG-REDUCTION PROPERTIES - An apparatus, comprising a plurality of closed cells disposed on a surface of a substrate. Each of the closed cells has at least one dimension that is less than about 1 millimeter and are configured to hold a medium therein. The apparatus also comprises a foam that contacts the closed cells. The foam has fluid walls that include a surfactant, and bubbles of the foam layer are filled with the medium. | 09-13-2012 |
20150014841 | HEAT-TRANSFER STRUCTURE - An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force. | 01-15-2015 |