| Patent application number | Description | Published |
|---|
| 20090288699 | LAMINATE STRUCTURES FOR HIGH TEMPERATURE PHOTOVOLTAIC APPLICATIONS, AND METHODS RELATING THERETO - Laminate structures are disclosed, comprising a metal foil supporting a polyimide dielectric layer. The polyimide dielectric layer comprises a polyimide derived from at least one aromatic rigid rod diamine and at least one aromatic rigid rod dianhydride to provide a thermally and dimensionally stable polyimide. A bottom electrode is formed directly on the polyimide dielectric layer surface, and a CIGS absorber layer is formed directly on the bottom electrode. The CIGS laminates of the present disclosure can be incorporated into CIGS type solar cells, and the laminates further allow such CIGS solar cells to be monolithically integrated into a photovoltaic module on a single substrate. | 11-26-2009 |
| 20090304922 | POLYMERS CONTAINING HEXAGONAL BORON NITRIDE PARTICLES COATED WITH TURBOSTRATIC CARBON AND PROCESS FOR PREPARING THE SAME - The present invention describes polymer compositions containing boron nitride particles that are encapsulated in layers of turbostratic carbon. The polymers so prepared exhibit enhanced thermal conductivity. | 12-10-2009 |
| 20090305043 | BORON NITRIDE ENCAPSULATED IN TURBOSTRATIC CARBON AND PROCESS FOR MAKING SAME - Process for producing boron nitride particles that are encapsulated in layers of turbostratic carbon, and particles so produced. Such particles are useful in improving the thermal conductivity of organic polymers. | 12-10-2009 |
| 20090306248 | POLYMERS CONTAINING HEXAGONAL BORON NITRIDE PARTICLES COATED WITH TURBOSTRATIC CARBON AND PROCESS FOR PREPARING SAME - The present invention describes polymer compositions containing boron nitride particles that are encapsulated in layers of turbostratic carbon. The polymers so prepared exhibit enhanced thermal conductivity. | 12-10-2009 |
| 20100159244 | HEXAGONAL BORON NITRIDE COMPOSITIONS CHARACTERIZED BY INTERSTITIAL FERROMAGNETIC LAYERS, PROCESS FOR PREPARING, AND COMPOSITES THEREOF WITH ORGANIC POLYMERS - The present invention relates to a hexagonal boron nitride platelet particle having a layer of a ferromagnetic metal between the layers of hexagonal boron nitride thereof, and a process for preparing the composition thereof. The present invention further relates to polymeric composites formed therefrom. The present invention describes improvements in thermal conductivity of said composites when subject to an orienting magnetic field. | 06-24-2010 |
| 20100310861 | POLYMERS CONTAINING HEXAGONAL BORON NITRIDE PARTICLES COATED WITH TURBOSTRATIC CARBON AND PROCESS FOR PREPARING SAME - The present invention describes polymer compositions containing boron nitride particles that are encapsulated in layers of turbostratic carbon. The polymers so prepared exhibit enhanced thermal conductivity. | 12-09-2010 |
| 20110056539 | ASSEMBLIES COMPRISING A THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILM, AN ELECTRODE AND AN ABSORBER LAYER, AND METHODS RELATING THERETO - The assemblies of the present invention comprise an electrode, an absorber layer and a polyimide film. The polyimide film contains from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydride, at least about 85 mole percent of such aromatic dianhydride being a rigid rod type dianhydride, and ii. at least one aromatic diamine, at least about 85 mole percent of such aromatic diamine being a rigid rod type diamine. The polyimide films of the present disclosure further comprise a filler that: i. is less than about 800 nanometers in at least one dimension; ii. has an aspect ratio greater than about 3:1 ; iii. is less than the thickness of the polyimide film in all dimensions; and iv. is present in an amount from about 5 to about 60 weight percent of the total weight of the polyimide film. | 03-10-2011 |
| 20110065853 | POLYMERS CONTAINING HEXAGONAL BORON NITRIDE PARTICLES COATED WITH TURBOSTRATIC CARBON AND PROCESS FOR PREPARING SAME - The present invention describes polymer compositions containing boron nitride particles that are encapsulated in layers of turbostratic carbon. The polymers so prepared exhibit enhanced thermal conductivity. | 03-17-2011 |
| 20110120545 | PHOTOVOLTAIC COMPOSITIONS OR PRECURSORS THERETO, AND METHODS RELATING THERETO - A process for forming at least one photovoltaic component on a substrate is described. The substrate comprises a polyimide and a sub-micron filler. The polyimide is derived substantially or wholly from rigid rod monomers and the sub-micron filler has an aspect ratio of at least 3:1. The substrates of the present disclosure are particularly well suited for photovoltaic applications, due at least in part to high resistance to hygroscopic expansion and relatively high levels of thermal and dimensional stability. | 05-26-2011 |
| 20110123796 | INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AND METHODS RELATING THERETO - An interposer film for IC packaging is disclosed. The interposer film comprises a substrate that supports a plurality of electrically conductive domains. The substrate contains a rigid rod type polyimide and about 5-60 wt % filler. The filler has at least one dimension that (on average) is less than about 800 nanometers, and the filler also has an average aspect ratio greater than about 3:1. | 05-26-2011 |
| 20110124806 | DIMENSIONALLY STABLE POLYIMIDES, AND METHODS RELATING THERETO - A film is disclosed, containing 40-100 weight percent polyimide. The polyimide is derived from a dianhydride component and a diamine component. The dianhydride component is at least 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), and optionally is also pyromellitic dianhydride (PMDA) in a mole ratio of 50-100:50-0 (BPDA:PMDA). The diamine component comprises 1,5-naphthalenediamine (1,5-ND) and 1,4-diaminobenzene (PPD) and/or meta phenylene diamine (MPD) in a mole ratio of 15-95:85-5 (1,5-ND:PPD+MPD). The films have exceptional high temperature storage modulus (elastic modulus) and exceptionally low high temperature creep (e | 05-26-2011 |
