Sako, Tokyo
Akari Sako, Tokyo JP
Patent application number | Description | Published |
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20110086938 | NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION - A negative-tone radiation-sensitive resin composition includes an alkali-soluble resin, a radically polymerizable compound, a radiation-sensitive radical initiator, and an organic solvent. The alkali-soluble resin includes a phenolic hydroxyl group. The radically polymerizable compound includes an ethylenically unsaturated double bond. The organic solvent includes an ethylene glycol organic solvent having a saturation vapor pressure of 3 mmHg or less at 20° C. and 1 atmosphere. | 04-14-2011 |
20120296053 | PHOTOSENSITIVE COMPOSITION, CURED FILM AND ELECTRONIC PART - A photosensitive composition capable of forming a cured film having small internal stress; a cured film formed from the composition; and an electronic part including the cured film. The photosensitive composition includes: an alkali soluble resin (A), which includes at least 80% by mass of a novolak resin; a photosensitive compound (B); and a crosslinking agent (C), which includes at least a compound represented by the following formula (C1): | 11-22-2012 |
20130012618 | RESIN COMPOSITION, POLYMER, CURED FILM AND ELECTRONIC PART - Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent, | 01-10-2013 |
Akifumi Sako, Tokyo JP
Patent application number | Description | Published |
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20090060432 | LIGHT TRANSMITTING BODY AND OPTICAL INTERCONNECTION SYSTEM - An optical transmission medium includes a GI optical fiber that is made of silica glass. The GI optical fiber includes a core having a graded-index refractive index profile and a cladding formed around the core. The GI optical fiber is bent by equal to or more than a quarter turn with a curvature radius equal to or larger than 4 mm and equal to or smaller than 10 mm. | 03-05-2009 |
20100036257 | ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME - Provided is an ultrasonic probe including: a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves; an acoustic lens arranged above the cMUT chip: and a backing layer arranged below the cMUT chip. | 02-11-2010 |
20100154547 | ULTRASONIC PROBE AND ULTRASONIC DIAGNOSIS DEVICE - An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe | 06-24-2010 |
20100242612 | ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME - An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer. | 09-30-2010 |
20110071396 | ULTRASONIC PROBE, METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC APPARATUS - An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion. | 03-24-2011 |
20120320710 | ULTRASONIC PROBE AND ULTRASONIC IMAGING APPARATUS USING THE SAME - In order to provide an ultrasonic probe capable of suppressing the influence of multiple reflections occurring on the interface of a transducer with a CMUT chip and a backing layer, an ultrasonic probe of the present invention has a structure where an acoustic lens | 12-20-2012 |
20130031980 | Ultrasonic Probe, Production Method Therefor, and Ultrasonic Diagnostic Apparatus - Disclosed is an ultrasonic probe wherein the warpage of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this the ultrasonic probe is provided with: a CMUT ( | 02-07-2013 |
20130285174 | ULTRASOUND PROBE - Disclosed is an ultrasonic probe comprising: CMUT cells ( | 10-31-2013 |
20130331699 | ULTRASOUND IMAGING APPARATUS - Even when electroacoustic conversion elements with high nonlinearity are employed, a nonlinear imaging is carried out with extracting more nonlinear components. An ultrasonic wave beam is transmitted twice from the transmitter to an identical position on the imaging target, and the signal processor performs computation on the reception signals obtained in every transmission performed twice, thereby extracting a nonlinear component included in the reception signals. In one transmission out of the transmission performed twice, the transmitter delivers the transmission signal to all of multiple electroacoustic conversion elements for driving the electroacoustic conversion elements, and in the other transmission, the transmission signal is delivered selectively only to a part of the multiple electroacoustic conversion elements for driving the electroacoustic conversion elements. | 12-12-2013 |
Hiroshi Sako, Tokyo JP
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20150285849 | ANTENNA-AND-CABLE CONNECTION-STATE VERIFICATION DEVICE AND VERIFICATION METHOD - A penetration terminal for connecting the coaxial cables inside and outside of the apparatus thereto is attached on the electric apparatus' frame, and the measurement of a combined capacitance of the antenna and the coaxial cable in the inner side of the apparatus is made possible from the outer side of the apparatus, so that it is possible to perform at any time the determination whether a wiring connection of the antenna mounted in the inner side of the electric apparatus is appropriate. | 10-08-2015 |
Jumpei Sako, Tokyo JP
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20150183555 | POUCH CONTAINER - A pouch container is provided with sack-like portions provided respectively to upper parts of the front-surface sheet and the rear-surface sheet. | 07-02-2015 |
Kanjiro Sako, Tokyo JP
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20140048793 | ORGANIC LIGHT-EMITTING ELEMENT, PRODUCTION METHOD FOR ORGANIC LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND ILLUMINATION DEVICE - An organic light-emitting element having a high light extraction efficiency and a high light emission efficiency is provided, by an organic light-emitting element ( | 02-20-2014 |
20140084278 | ORGANIC LIGHT-EMITTING ELEMENT, METHOD FOR MAKING ORGANIC LIGHT-EMITTING ELEMENT, DISPLAY DEVICE AND ILLUMINATION DEVICE - An organic light-emitting element having a high light extraction efficiency and a high light emission efficiency is provided, by an organic light-emitting element ( | 03-27-2014 |
20140131690 | ORGANIC LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING ELEMENT - An organic light emitting element ( | 05-15-2014 |
20140203255 | ORGANIC LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING ORGANIC LIGHT-EMITTING ELEMENT, DISPLAY DEVICE AND ILLUMINATION DEVICE - An organic light-emitting element ( | 07-24-2014 |
Kazue Sako, Tokyo JP
Patent application number | Description | Published |
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20090044017 | SIGNATURE AND VERIFYING METHOD, AND SIGNATURE AND VERIFYING DEVICE - An RSA signature method is provided in which the length of a signature does not depend on the number of signature devices when multiple signature devices are related to the creation of the signature. A signature device i_{m} includes first conversion means SS | 02-12-2009 |
20090083190 | System and Method for Electronic Bidding - In an electronic bidding system and method, it is unnecessary to disclose to bidders a list of public keys matched to bid prices, and in which price secrecy may be proved. In a function of encryption of a bidding device | 03-26-2009 |
20090089575 | Service Providing System, Outsourcer Apparatus, Service Providing Method, and Program - When an entrustor entrusts an outsourcer with the supply of a service for members, member information managed by the entrustor is kept secret from the outsourcer, and users can receive the service without communicating with the entrustor. For using the service, user apparatus | 04-02-2009 |
20100115285 | MIX-NET SYSTEM - Each participant apparatus ( | 05-06-2010 |
20120250855 | MIX-NET SYSTEM - Each participant apparatus ( | 10-04-2012 |
20120250868 | MIX-NET SYSTEM - Each participant apparatus ( | 10-04-2012 |
Kazuhiko Sako, Tokyo JP
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20150279285 | DISPLAY DEVICE AND DISPLAY DEVICE DRIVE METHOD - A display device includes an image display panel on which pixels are arranged, a backlight which lights the image display panel from a rear of the image display panel, a first device which controls the backlight, and a second device which controls the image display panel. The first device generates an image signal, outputs the image signal to the second device, determines a light source lighting amount of the backlight on the basis of the image signal by blocks obtained by dividing a display surface of the image display panel and luminance distribution information on the backlight stored in advance, and controls the backlight by the light source lighting amount. The second device acquires the image signal, converts the image signal to a display signal for controlling display of the image display panel, and controls the image display panel. | 10-01-2015 |
Kentaro Sako, Tokyo JP
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20100129720 | POLYOLEFIN MICROPOROUS MEMBRANE - Provided are a polyolefin microporous membrane having a thickness of from 1 to 100 μm, a pore diameter of from 0.01 to 1 μm, and protrusions having a height of from 0.5 to 30 μm formed by embossing on at least one of the surfaces of the membrane; a production method of the membrane; and a separator for battery made of the membrane. | 05-27-2010 |
20110172017 | GAME MACHINE, GAME PROGRAM, AND GAME MACHINE CONTROL METHOD - [Problems] To provide a game machine comprising a controller including an acceleration sensor therein, personifiable and treatable as a mascot by using an information output function and expressiveness, and exhibiting an improved capability of entertaining the user gaming. | 07-14-2011 |
Nobuyuki Sako, Tokyo JP
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20110189828 | Method for forming silicon layer and method for manufacturing semiconductor device - A silicon layer is formed on a silicon substrate by an epitaxial growth, and, then a surface of the silicon layer is oxidized. The surface of the silicon layer is cleaned, to remove foreign material generated on the surface of the silicon layer during the epitaxial growth. | 08-04-2011 |
20120100678 | METHOD FOR FORMING SEMICONDUCTOR DEVICE - A method of forming a semiconductor device includes the following processes. A first interlayer insulating film is formed over a cell transistor and a peripheral transistor. A cell contact hole is formed in the first interlayer insulating film, the cell contact hole reaching the cell transistor. A lower contact plug is formed at a bottom of the cell contact hole. A peripheral contact hole is formed in the first interlayer insulating film, the peripheral contact hole reaching the peripheral transistor. A first peripheral contact plug is simultaneously formed in the peripheral contact hole and an upper contact plug in the cell contact hole, the upper contact plug being disposed on the lower contact plug. | 04-26-2012 |
20130011988 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A LAMINATED STRUCTURE COMPRISING A BORON-DOPED SILICON GERMANIUM FILM AND A METAL FILM - A semiconductor device has memory cell portions and compensation capacitance portions on a single substrate. The memory cell portion and the compensation capacitance portion have mutually different planar surface areas. The memory cell portion and the compensation capacitance portion include capacitance plate electrodes of the same structure. The capacitance plate electrode has a laminated structure including a boron-doped silicon germanium film and a metal film. | 01-10-2013 |
20130029470 | METHOD OF FORMING SEMICONDUCTOR DEVICE - A method of forming a semiconductor device includes the following processes. A dummy insulating film is formed over a semiconductor substrate by using a source material that is free of carbon as an essential component. A hole that penetrates the dummy insulating film is formed. A conductive film is formed, which covers at least a side wall of the hole of the dummy insulating film. The dummy insulating film is removed to expose an outer surface of the conductive film. | 01-31-2013 |
20130029487 | MANUFACTURING METHOD OF DEVICE - A device manufacturing method includes: sequentially forming a first sacrificial film, a first support film, a second sacrificial film, and a second support film on a semiconductor substrate; forming a hole to pass through these films; forming a crown-shaped electrode covering an inner surface of the hole and connected to the second support film and the first support film; forming a first opening in the second support film into a first pattern designed such that the connection between the crown-shaped electrode and the second support film is at least partially maintained; removing at least a part of the second sacrificial film through the first opening; forming a second opening in the first support film with use of the first opening; and removing the first sacrificial film through the second opening. This method is able to prevent misalignment of openings between the support films. | 01-31-2013 |
20130344674 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A LAMINATED STRUCTURE COMPRISING A BORON-DOPED SILICON GERMANIUM FILM AND A METAL FILM - A semiconductor device has memory cell portions and compensation capacitance portions on a single substrate. The memory cell portion and the compensation capacitance portion have mutually different planar surface areas. The memory cell portion and the compensation capacitance portion include capacitance plate electrodes of the same structure. The capacitance plate electrode has a laminated structure including a boron-doped silicon germanium film and a metal film. | 12-26-2013 |
20140038411 | MANUFACTURING METHOD OF DEVICE - A device manufacturing method includes: sequentially forming a first sacrificial film, a first support film, a second sacrificial film, and a second support film on a semiconductor substrate; forming a hole to pass through these films; forming a crown-shaped electrode covering an inner surface of the hole and connected to the second support film and the first support film; forming a first opening in the second support film into a first pattern designed such that the connection between the crown-shaped electrode and the second support film is at least partially maintained; removing at least a part of the second sacrificial film through the first opening; forming a second opening in the first support film with use of the first opening; and removing the first sacrificial film through the second opening. This method is able to prevent misalignment of openings between the support films. | 02-06-2014 |
Tomoyuki Sako, Tokyo JP
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20100144551 | CYTOKINE PRODUCTION REGULATOR GENE AND USE THEREOF - The invention provides a gene encoding a protein selected from among the following proteins (a) to (c): (a) a protein having any of the amino acid sequences of SEQ ID NOs: 2, 4, 6, 8, 10, 12, 14, 16, 82, 84, 86, 88, 90, 92, 94, 96, 98, 100, 102, 104, 106, and 108; (b) a protein which has an amino acid sequence equivalent to any of the amino acid sequences of (a), except that one to several amino acid residues are deleted, substituted, or added, and which exhibits cytokine production regulatory activity; and (c) a protein which has an amino acid sequence having 90% or higher identity to any of the amino acid sequences of (a), and which exhibits cytokine production regulatory activity, as well as a gene useful for regulating cytokine production and use of the gene. | 06-10-2010 |
20120021418 | GENE THAT IMPARTS OXYGEN RESISTANCE AND APPLICATION THEREOF - To provide a gene useful for imparting oxygen resistance to a microorganism and use of the gene. | 01-26-2012 |
Yusuke Sako, Tokyo JP
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20100168380 | PROCESS FOR SYNTHESIZING CYCLIC PEPTIDE COMPOUND - The objective is to provide a novel process for synthesizing a cyclic peptide compound. It is also an objective to provide a novel cyclic peptide compound. The novel process for synthesizing a cyclic peptide compound comprises the steps of: (1) translationally synthesizing a non-cyclic peptide compound having in a molecule a functional group 1 and a functional group 2, which are a pair of functional groups capable of reacting to form a bond, and (2) cyclizing the non-cyclic peptide compound by the reaction of the functional groups 1 and 2 to form a bond. The novel cyclic peptide compound can be synthesized by the process. | 07-01-2010 |