Patent application number | Description | Published |
20080248485 | Radiolabeled 3-[3- (Benzoyl-Amido) Benzyloxy] Aspartic Acid Derivative and Method of Producing the Same - The present invention provides a radiolabeled ligand which is highly selective and potent for glutamate transporters and is usable in specifically detecting the glutamate transporter. | 10-09-2008 |
20110033381 | MOLECULAR PROBE FOR IMAGING OF PANCREATIC ISLET AND THE PRECURSOR, AND USE OF THE SAME - A precursor of molecular probe for imaging of pancreatic islets is provided. A polypeptide represented by any one of the following formulae (1) to (4), or a polypeptide having a homology with the foregoing polypeptide. | 02-10-2011 |
20110059483 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - To provide a molecular probe for imaging of pancreatic islets. A molecular probe for use in imaging of pancreatic islets is provided. The molecular probe includes any one of the following polypeptides; polypeptides represented by the following formulae (1), (5), and (9); and polypeptides having homology with the foregoing polypeptides; | 03-10-2011 |
20110081663 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - A molecular probe for imaging of pancreatic islets is provided. The molecular probe includes a polypeptide represented by the following formula (1), or a polypeptide that has a homology with the foregoing polypeptide. | 04-07-2011 |
20110171129 | Molecular Probe Precursor for Imaging of Pancreatic Islet, and Use Thereof - A precursor of a molecular probe for imaging of pancreatic islets is provided. The precursor includes a polypeptide represented by any one of the following formulae (1) to (12), or a polypeptide having a homology with the foregoing polypeptide: | 07-14-2011 |
20110206605 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - A molecular probe for use in imaging of pancreatic islets is provided. The molecular probe comprises a polypeptide represented by the following formula (1), (2), or (3), or a polypeptide having homology with the foregoing polypeptide, | 08-25-2011 |
20120029209 | METHOD FOR SYNTHESIZING [18F]SFB USING MICROSYNTHESIS TECHNIQUE - A method for synthesizing [ | 02-02-2012 |
20120087863 | Peptide Derivative and Use of the Same - A new peptide derivative is provided. The peptide derivative is represented by the following general formula (I), | 04-12-2012 |
20120107239 | Precursor of Molecular Probe for Pancreatic Islet Imaging and Use of the Same - A precursor of a molecular probe for imaging of pancreatic islets is a compound expressed as the following formula (I): | 05-03-2012 |
20120253010 | COMPOUND ACCUMULATING IN INFLAMMATORY SITE, DIAGNOSTIC AGENT CONTAINING THE COMPOUND IN LABELED STATE AND ITS PRECURSOR COMPOUND FOR LABELING - Embodiments of the invention provide a compound accumulating in an inflammatory site, a diagnostic agent containing the compound in labeled state and its precursor compound for labeling. Such a compound accumulating in inflammatory site may be represented by the following formula (1): | 10-04-2012 |
20120330024 | RADIOACTIVE IODINE LABELED ORGANIC COMPOUND OR SALT THEREOF - The present invention is a compound represented by the following formula (1) or a salt thereof. Furthermore, the present invention is an imaging agent used for imaging a tau protein, the imaging agent containing a compound represented by the formula (1) below or a salt thereof. In the formula (1), R | 12-27-2012 |
20130052132 | Method for Producing Radioactively Labeled Polypeptide - The present invention relates to a method for producing a polypeptide. The method includes labeling a molecular probe precursor represented by an amino acid sequence of the formula (1) using a labeling compound capable of labeling a lysine or lysine derivative: | 02-28-2013 |
20130149252 | SWITCHING FLUORESCENT NANOPARTICLE PROBE AND FLUORESCENT PARTICLE IMAGING METHOD USING SAME - The present invention provides a novel fluorescent nanoparticle imaging probe having a switching function (a function to quench a fluorescent dye during nanoparticle preparation, and emit fluorescence during imaging). A switching fluorescent nanoparticle probe comprising: a molecular assembly composed of an amphiphilic block polymer having a hydrophilic block chain and a hydrophobic block chain; and a fluorescent dye encapsulated in the molecular assembly, wherein (a) the hydrophilic block chain comprises, as an essential hydrophilic structural unit, a unit selected from a sarcosine unit and an alkylene oxide unit, (b) the hydrophobic block chain comprises, as an essential hydrophobic structural unit, a unit selected from the group consisting of an amino acid unit and a hydroxylic acid unit, and (c) the fluorescent dye is a cyanine compound represented by the formula (I): | 06-13-2013 |
20130336896 | SWITCHING-TYPE FLUORESCENT NANOPARTICLE PROBE, AND FLUORESCENT MOLECULAR IMAGING METHOD USING SAME - [Problem] To provide a novel fluorescent nanoparticle imaging probe having a switching function (a function to quench a fluorescent dye in a blood component and emit fluorescence in a tumor or an inflamed site to be imaged). | 12-19-2013 |
20140088306 | RADIOACTIVE FLUORINE-LABELED QUINOXALINE COMPOUND - Provided is a compound effective as a diagnostic imaging probe targeting amyloid and an agent for Alzheimer's disease diagnosis including the compound. | 03-27-2014 |
20140127128 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - To provide a molecular probe for imaging of pancreatic islets. A molecular probe for use in imaging of pancreatic islets is provided. The molecular probe includes any one of the following polypeptides: polypeptides represented by the following formulae (1), (5), and (9); and polypeptides having homology with the foregoing polypeptides: | 05-08-2014 |
20140187784 | RADIOACTIVE QUINOLINONE DERIVATIVE AND PHARMACEUTICAL DRUG COMPRISING THE SAME - It is intended to provide a radioactive compound that has higher selectivity for CYP11B2 than that for CYP11B1, exhibits highly selective accumulation in the adrenal gland compared with blood and organs adjacent to the adrenal gland, and permits commercial supply. The present invention provides a radioactive quinolinone derivative represented by the predetermined general formula or a salt thereof. | 07-03-2014 |
20150231284 | MOLECULAR PROBE FOR IMAGING OF PANCREATIC ISLET AND THE PRECURSOR, AND USE OF THE SAME - A precursor of molecular probe for imaging of pancreatic islets is provided. A polypeptide represented by any one of the following formulae (1) to (4), or a polypeptide having a homology with the foregoing polypeptide. | 08-20-2015 |
Patent application number | Description | Published |
20110135408 | Temporary Coupling Mechanism for Cutting Tip and Indexable Cutting Tool with Same - A temporary coupling mechanism facilitates replacement of a cutting tip in a pocket of a cutting tool, by preventing the cutting tip from falling out of the pocket when a clamping member, e.g., a screw member or wedge member, is loosened. The pocket is provided with a first coupling portion and the cutting tip is provided with a second coupling portion configured to engage the first coupling portion. In one embodiment, the second coupling portion is at least one concave groove or convex portion located in a predetermined position of the cutting tip. A convex portion or a concave groove is provided in at least one of the pocket's tip mounting seat and the clamping member to engage the concave groove and the convex portion of the cutting tip. The concave groove extends substantially in parallel with the seat face of the tip mounting seat and the convex portion is inserted and fitted into the concave groove so as to be engaged thereto when the cutting tip is inserted into the tip mounting seat and is taken out of the tip mounting seat, causing the cutting tip to be movable only in a predetermined direction relative to the tip mounting seat. | 06-09-2011 |
20110293381 | Cutting Edge-Replaceable Cutting Tool and Cutting Insert for Use Therein - A cutting edge-replaceable cutting tool includes a tool body, and a cutting insert is removably installed on the tool body. The cutting tool-replaceable cutting tool includes an insert mounting seat formed on the tool body and on which the cutting insert is mounted, and a upper wall portion formed integrally with the tool body and overhanging the insert mounting seat. | 12-01-2011 |
20120009029 | Cutting Insert and Cutting Edge Replaceable Cutting Tool - A cutting insert includes two end surfaces each having a main surface usable as an attachment surface to a tool body, a peripheral side surface extending between the two end surfaces and a plurality of cutting edge portions each formed at an intersection between each end surface and the peripheral side surface. Each cutting edge portion includes a corner edge formed at a corner of a related end surface, a major cutting edge extending from one end of the corner edge and extending so as to depart from an intermediate plane defined to be perpendicular to the first axis and to include the second axis, and a minor cutting edge extending from the other end of the corner edge and extending in a direction to approach the intermediate plane. | 01-12-2012 |
20130142579 | CLAMPING DEVICE FOR CUTTING INSERT, CUTTING TOOL, AND CUTTING INSERT - A clamping device having a high clamping force and operability when a cutting insert is attached/detached is provided. The clamping device has a guide hole, a screw hole, a clamp member having a clamp portion and arranged movably in the guide hole, and a screw member screwed with the screw hole and movable in first and second directions, wherein the screw member can be engaged with the clamp member in movement both in the directions and the guide hole has a first cam surface engaged with the clamp member and converting a force in the first direction received from the screw member into a force for moving the clamp member in a direction toward the cutting insert and a second cam surface converting a force in the second direction into a force for moving the clamp portion in a direction away from the cutting insert. | 06-06-2013 |
20130170915 | CUTTING INSERT AND INDEXABLE ROTARY CUTTING TOOL - A cutting insert has a first cutting edge provided with a chip breaker suitable for cutting an outermost region of a hole. The cutting insert has a substantially polygonal upper face, a substantially polygonal lower face, and a plurality of side faces extending between the upper face and the lower face. The plurality of side faces include a main side face constituting a flank of a linear cutting edge and a sub side face constituting a flank of a corner cutting edge; the main side face has a relief angle of 0°, the sub side face has a relief angle larger than 0°. A second cutting edge is further provided at an intersection portion between the main side face and the lower face. | 07-04-2013 |
20140212226 | CUTTING-EDGE REPLACEABLE CUTTING TOOL - Provided is a cutting-edge replaceable cutting tool having a configuration capable of stably supporting a rotational moment acting on a cutting insert clamped on an insert mounting face of a body. It includes a cutting insert, a body including an insert mounting portion for removably mounting the cutting insert and a reception mechanism to receive the rotational moment acting on the cutting insert so as to rotate the cutting insert mounted on the insert mounting portion on a base surface, the mechanism including a first engagement portion formed on a lower surface of the cutting insert and a second engagement portion formed on the base surface of the insert mounting portion which is formed to engage with a specific portion of a surface defining the first engagement portion to receive the rotational moment. | 07-31-2014 |
20150217384 | CUTTING EDGE ADJUSTMENT DEVICE, ROTARY MEMBER APPLIED TO SAME, AND TOOL BODY, CARTRIDGE, AND CUTTING INSERT HAVING STRUCTURES SUITABLE FOR THE DEVICE - A cutting edge adjustment device for a cutting tool for adjusting the position of a cutting edge of a cutting insert by causing movement of the cutting insert includes a rotary member for producing the movement. The rotary member is formed into a shape in which a substantially cylindrical portion having a constant radius and a cam portion having a cam face whose radius is gradually increased in a manner corresponding to the amount of the movement are arranged in a direction of a rotational center axis. The cam face is formed in such a manner as to have a section in which a radius is linearly increased, and consequently, the unit rotational angle of the rotary member on the rotational center axis is proportional to the unit movement amount of the cutting insert. | 08-06-2015 |
Patent application number | Description | Published |
20090116265 | DRIVING CIRCUIT FOR POWER SWITCHING DEVICE, DRIVING METHOD THEREOF, AND SWITCHING POWER SUPPLY APPARATUS - A driving circuit according to the present invention is a driving circuit which drives the voltage control type switching device in the switching power supply apparatus and includes: a generation unit configured to generate a driving signal for turning on and off the voltage control type switching device, the driving signal having plural levels of voltage at which the voltage control type switching device is turned on; and a switching control unit configured to switch between the plural levels of voltage at which the power switching device is turned on, depending on a status of the power switching device. | 05-07-2009 |
20100085781 | ENERGY TRANSMISSION DEVICE AND SEMICONDUCTOR DEVICE FOR ENERGY TRANSMISSION CONTROL - The present invention includes a voltage clamping circuit | 04-08-2010 |
20100315841 | SEMICONDUCTOR DEVICE AND SWITCHING POWER SUPPLY APPARATUS - A switching power supply apparatus includes: a turn-on control circuit which generates a turn-on signal; a feedback control circuit which generates a reference voltage V | 12-16-2010 |
20110292689 | DRIVING CIRCUIT FOR POWER SWITCHING DEVICE, DRIVING METHOD THEREOF, AND SWITCHING POWER SUPPLY APPARATUS - A driving circuit includes a generator configured to generate a driving signal having plural levels of voltage at which a power switching device is turned on. The driving circuit also includes a switching controller configured to switch between the plural levels of voltage at which the power switching device is turned on. The driving circuit further includes a load current detector configured to output a load current detection signal to the switching controller, the load current detection signal indicating whether or not a current flowing through the power switching device exceeds a threshold, wherein the switching controller is configured to perform the switching based on the load current detection. | 12-01-2011 |
20140036552 | SEMICONDUCTOR DEVICE PROVIDED WITH SWITCHING POWER SUPPLY DEVICE WITH INTERMITTENT OSCILLATION CONTROL - A control circuit varies an intermittent oscillation frequency using a period signal. A period signal period signal frequency is set to a frequency lower than the intermittent oscillation frequency, or is set to be higher than the intermittent oscillation frequency and to a frequency other than integer multiples of the intermittent oscillation frequency. The phase difference of the period signal with respect to an intermittent oscillation control signal is set so that the distribution of the intermittent oscillation frequency is dispersed. | 02-06-2014 |
20140036561 | CONVERTER AND SEMICONDUCTOR DEVICE - A converter includes: a bridge diode; an X capacitor provided upstream of the bridge diode; a smoothing capacitor provided downstream of the bridge diode; an AC shutoff detection circuit which outputs an AC shutoff detection signal when input AC voltage is shut off; and a discharging circuit which is connected to a connection point at which the cathode of the bridge diode and the smoothing capacitor are connected, and allows residual charges in the smoothing capacitor and the X capacitor to be discharged when the AC shutoff detection signal is output, and the discharging circuit includes a JFET which has a drain terminal connected to the above connection point and lowers discharge voltage; and a first discharging switch element connected to the source terminal of the JFET. | 02-06-2014 |
20140328090 | SWITCHING POWER SUPPLY APPARATUS AND SEMICONDUCTOR DEVICE - A switching power supply apparatus includes a PFM control circuit that outputs a clock signal Set such that a switching frequency of a switching element varies in accordance with a load state. The clock signal Set determines a turn-on timing of the switching element. A reference value of a current flowing through the switching element determines a turn-off timing of the switching element. A modulation signal is applied to the turn-off timing of the switching element to modulate one of a peak value of a drain current flowing through the switching element and an on-time of the switching element. Input control is performed separately on the clock signal Set and the modulation signal. Accordingly, even when the clock signal Set and the modulation signal contribute to each other to offset each other, modulation effects are not cancelled. | 11-06-2014 |
20150131334 | SWITCHING POWER SUPPLY APPARATUS AND SEMICONDUCTOR DEVICE - Provided is a switching power supply apparatus that shifts to an OFF mode when electronic equipment is on standby, and includes: an OFF mode delay circuit that delays shifting to the OFF mode; and an electric storage unit and a power supply circuit that function as a power supply source of an OFF mode control circuit. With the configuration, the power consumption can almost be eliminated, and the switching power supply apparatus can start without any charge in an electricity storage component such as a primary battery or a secondary battery. | 05-14-2015 |
Patent application number | Description | Published |
20140051367 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051368 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051369 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051370 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051371 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140133114 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions. | 05-15-2014 |
20140133117 | HIGH FREQUENCY CIRCUIT MODULE - A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction. | 05-15-2014 |
20140133120 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 05-15-2014 |
20140285213 | COMPONENT-EMBEDDED CIRCUIT SUBSTRATE AND METHOD OF INSPECTING THE SAME - In a component-embedded circuit substrate having a plurality of capacitors embedded therein, the capacitors are connected in parallel, inspection electrodes are formed, and the inspection electrodes connect to respective terminal electrodes of the capacitor through via conductors. At the terminal electrodes of the capacitor, the connection position of the via conductors for connecting the inspection electrodes differs from the connection position of via conductors for connecting respective terminal electrodes of the capacitor. | 09-25-2014 |
20140299358 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal linein a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area. | 10-09-2014 |
20140308906 | HIGH FREQUENCY CIRCUIT MODULE - A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components. | 10-16-2014 |
20140349596 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 11-27-2014 |
20150043170 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench. | 02-12-2015 |
20150043172 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section. | 02-12-2015 |
20150044822 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness. | 02-12-2015 |
20150049439 | CIRCUIT MODULE - A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield. | 02-19-2015 |
20150062835 | CIRCUIT MODULE - A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion. | 03-05-2015 |
20150070849 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section. | 03-12-2015 |
20150098203 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 04-09-2015 |
20150119102 | COMMUNICATION MODULE - A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section. | 04-30-2015 |
20150119104 | CIRCUIT MODULE - A circuit module includes: an RFIC that has a transceiver circuit for processing high-frequency signals related to mobile phone communication and a reception circuit for processing reception signals related to GPS, which is a satellite positioning system; GPS front end components; and mobile phone front end components. The mobile phone front end components are mounted on one main surface of a circuit substrate, and at least one of the GPS front end components (a second band-pass filter) is embedded in the circuit substrate. | 04-30-2015 |
20150236393 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area. | 08-20-2015 |
Patent application number | Description | Published |
20080315167 | Engagement chain type hoisting and lowering device - An engagement chain type hoisting and lowering device is disclosed, including a hoisting and lowering table attached to the upper end of hoisting and lowering driving engagement chains. The engagement chains are raised and lowered by a pair of hoisting and lowering sprockets driven by a driving motor. The driving motor is located in a peripheral area spaced apart from the lowest lowered position of the hoisting and lowering table. In so doing, the lowest position of the hoisting and lowering table is lowered, reducing the burden of loading and unloading items onto the hoisting and lowering table, and making maintenance safe and simple. | 12-25-2008 |
20080315168 | Engagement chain type hoisting and lowering device - An engagement chain type hoisting and lowering device is disclosed, having a hoisting and lowering table attached to the upper end of two or more pairs of hoisting and lowering driving engagement chains. A driving motor drives two pairs of hoisting and lowering sprockets which, in turn, raise or lower two pairs of hoisting and lowering driving engagement chains. By arranging two pairs of hoisting and lowering driving engagement chains on two opposed sides of the hoisting and lowering table, buckling of the hoisting and lowering driving engagement chains is suppressed, resulting in stable hoisting and lowering operations without slippage of articles on the hoisting and lowering table, and chain endurance is improved. The device is designed so that the lowest position of the hoisting and lowering table can be lower than the height of the peripherally located driving motor, for ease and safety of operation and maintenance. | 12-25-2008 |
20090118048 | Hoisting and lowering driving engagement multi-row chain - A hoisting and lowering driving engagement multi-row chain is disclosed, in which bending of the connecting pins in the chain is suppressed to avoid fatigue failure. Additionally, the load carrying balance in the chain width direction is improved, and contact vibrations and contact noises generated between the chain and the hoisting and lowering sprockets are suppressed. Endurance of the bush in the chain is thereby improved. Bending of connecting pins is avoided by press-fitting bushes, through which connecting pins pass, into intermediate tooth plates. This also improves load carrying balance widthwise. Contact noises and vibrations between the bushes and sprockets are suppressed by providing bushes with a separate sprocket engagement portion having a larger diameter than the press-fitting portion of the bushes. | 05-07-2009 |
20100051424 | ENGAGEMENT CHAIN - An engagement chain in which a buckling strength of a pair of engagement chains engaged with each other is improved without blocking engagement operations between inner tooth plates and between outer tooth plate. The chain includes inner tooth plates, bushes, outer tooth plates and connecting pins. Buckling limiting flat surfaces of adjoining plates are brought into surface contact with each other when opposing segments of the chain are integrated together by driving sockets. | 03-04-2010 |
20100059727 | ENGAGEMENT CHAIN TYPE DRIVING DEVICE - The invention relates to an engagement chain type driving device including a pair of driving sprockets, which rotate positively and reversely in opposite directions about a pair of rotating shafts, a pair of engagement chains, which engage with each other by the pair of driving sprockets so to be integrated together, and a driving source, which drives the pair of driving sprockets, wherein the engagement chain includes inner tooth plates and outer tooth plates, which each include buckling limiting flat surfaces, the inner tooth plates and outer tooth plates being brought opposite to each other and into contact with each other when the engagement chains are integrated by the pair of driving sprockets, such that the flat surfaces hold the chain engagement position. | 03-11-2010 |
Patent application number | Description | Published |
20130205927 | ENGAGEMENT CHAIN TYPE DEVICE FOR FORWARD AND BACKWARD MOVEMENT OPERATION - In order to stably drive a body to be driven such as a lifting table, an engagement chain type device ( | 08-15-2013 |
20130276422 | MESHING CHAIN STOPPER - Chain detachment and chain entry are avoided, and a process for setting the length of a meshing chain is avoided, while the chain feed length can also be freely changed. A meshing chain stopper ( | 10-24-2013 |
20130298705 | ADVANCING/RETRACTING ACTUATION DEVICE WITH MESHING CHAIN - An interlocking chain type forward and backward actuating device is provided that does not increase workload involved in assembling the device, adjusting the rotation phase, and servicing and maintaining the device. The device is capable of smoothly actuating a driven body by advancing and retracting the body, and of preventing any pulsation or the like of the meshing chain. The interlocking chain type forward and backward actuating device includes chain-guide grooves formed so as to equalize an interlocked-state pin-to-pin distance (D | 11-14-2013 |
20130312554 | ENGAGEMENT CHAIN TYPE DEVICE FOR FORWARD AND BACKWARD MOVEMENT OPERATION - Provided is an interlocking chain forward and backward actuating device type device, the device being configured so that the space within the device is effectively utilized and that a device configuration most suitable for driving interlocking chains is selected to enable the interlocking chains to be smoothly driven. An interlocking chain type forward and backward actuating device ( | 11-28-2013 |
20140041467 | ENGAGEMENT CHAIN UNIT - Provided is an interlocking chain unit configured such that chains reliably and firmly engage with each other and that the buckling and twisting of a rigidified chain portion are avoided. An interlocking chain unit is configured such that the outer edges of a plate overlap region (P) are defined by contact portion faces and flat buckling restricting end faces, and that the plate overlap region (P) is constructed from the outlines of two plate overlap portions (Pa, Pa) which are point-point-symmetric about the point (C) of intersection between hook-shaped interlocking end faces and the buckling restricting end faces . | 02-13-2014 |
20140076082 | ENGAGEMENT CHAIN UNIT - Provided is an interlocking chain unit that has reliable and strong interlocking and avoids buckling, breaking, and bending of a rigidified chain portion. In the interlocking chain unit ( | 03-20-2014 |