Patent application number | Description | Published |
20100044768 | REDUCED-EDGE RADIATION-TOLERANT NON-VOLATILE TRANSISTOR MEMORY CELLS - An edgeless one-transistor flash memory array includes transistors that have two polysilicon gate layers that overlay an active region. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region. An edgeless two-transistor programmable memory includes memory cells that have two active devices. Two polysilicon gate layers overlay two active regions and are shared between the two active devices. One of the devices is used to program and erase the cell while the other used as a programmable switch in a programmable logic device. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region. | 02-25-2010 |
20100149873 | PUSH-PULL FPGA CELL - A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate. | 06-17-2010 |
20100329043 | Two-Transistor Floating-Body Dynamic Memory Cell - Embodiments relate to a two-transistor (2T) floating-body cell (FBC) for embedded-DRAM applications. Further embodiments pertain to a floating-body/gate cell (FBGC), which yields reduction in power dissipation, in addition to better signal margin, longer data retention, and higher memory density. | 12-30-2010 |
20110024821 | PUSH-PULL FPGA CELL - A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate. | 02-03-2011 |
Patent application number | Description | Published |
20090042349 | SPLIT GATE MEMORY CELL AND METHOD THEREFOR - A split gate memory cell has a select gate, a control gate, and a charge storage structure. The select gate includes a first portion located over the control gate and a second portion not located over the control gate. In one example, the first portion of the select gate has a sidewall aligned with a sidewall of the control gate and aligned with a sidewall of the charge storage structure. In one example, the control gate has a p-type conductivity. In one example, the gate can be programmed by a hot carrier injection operation and can be erased by a tunneling operation. | 02-12-2009 |
20120014179 | SOFT PROGRAM OF A NON-VOLATILE MEMORY BLOCK - A method includes erasing bits and identifying bits that have been over-erased by the erasing. A first subset of the bits that have been over-erased are soft programmed. The results of soft programming the first subset of bits is measured. An initial voltage condition from a plurality of possible voltage conditions based on the results from soft programming the first subset of bits is selected. A second subset of bits that have been over-erased are soft programmed. The soft programming applies the initial voltage condition to the bits in the second subset of bits. The second subset comprises bits that are still over-erased when the step of selecting occurs. The result is that the soft programming for the second subset may begin at a more optimum point for quickly achieving the needed soft programming to bring all of the bits within the desired erase condition. | 01-19-2012 |
20120113714 | METHOD FOR PROGRAMMING A MULTI-STATE NON-VOLATILE MEMORY (NVM) - A method is provided for programming a multi-state flash memory having a plurality of memory cells. A first programming pulse is provided to the flash array; determining a threshold voltage distribution for the plurality of memory cells after providing the first programming pulse. The plurality of memory cells is categorized into at least two bins based on a threshold voltage of each memory cell of the plurality of memory cells. A first voltage is selected for a second programming pulse for programming a first bin of memory cells of the at least two bins, the first voltage based on both a threshold voltage of the first bin and a first target threshold voltage. A second voltage is selected for a third programming pulse for programming a second bin of memory cells of the at least two bins, the second voltage based on both the threshold voltage of the second bin and on a second target threshold voltage. | 05-10-2012 |
20120241909 | Low-Leakage, High-Capacitance Capacitor Structures and Method of Making - A process and device structure is provided for increasing capacitance density of a capacitor structure. A sandwich capacitor is provided in which a bottom silicon-containing conductor plate is formed with holes or cavities, upon which an oxide layer and a top silicon-containing layer conductor is formed. The holes or cavities provide additional capacitive area, thereby increasing capacitance per footprint area of the capacitor structure. The holes can form, for example, a line structure or a waffle-like structure in the bottom conductor plate. Etching techniques used to form the holes in the bottom conductor plate can also result in side wall tapering of the holes, thereby increasing the surface area of the silicon-containing layer defined by the holes. In addition, depth of holes can be adjusted through timed etching to further adjust capacitive area. | 09-27-2012 |