Patent application number | Description | Published |
20080268373 | Imide-Urethane Resin, Photosensitive Resin Composition Including the Same and Cured Product - [PROBLEMS] To provide a photosensitive resin composition which has excellent photosensitivity and gives a cured product reduced in warpage and excellent in flexing properties, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating, etc. | 10-30-2008 |
20080286688 | Photosensitive Resin Composition and Cured Product Thereof - [PROBLEMS] To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof.
| 11-20-2008 |
20080306180 | Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof - The present invention provides a novel polyamide acid resin (A) containing an unsaturated group, suitable to a photosensitive resin composition, and a photosensitive resin composition using the same, which is excellent in photosensitivity, and the resultant cured product is excellent in flexibility as well as adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, and the like. Said polyamide acid resin (A) containing an unsaturated group is obtained by reacting an unsaturated group-containing polyester resin (a) having a terminal anhydride group, and a compound (b) having two amino groups in a molecule, and said photosensitive resin composition is obtained by reacting a resin composition containing said polyamide acid resin (A) containing an unsaturated group, a crosslinker (B) and a photopolymerization initiator (C). | 12-11-2008 |
20090012203 | Epoxy Resin and Epoxy Resin Composition - [PROBLEMS] The present invention relates to a crystalline epoxy resin, which gives a cured object excellent in various properties including flame retardancy, low water absorption, and impact resistance. The object of the present invention is to provide epoxy resin which is useful as an optical material, an epoxy resin composition containing crystals of the epoxy resin having excellent storage stability and a cured object obtained from the composition.
| 01-08-2009 |
20090042126 | Photosensitive resin composition and cured article thereof - A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided. | 02-12-2009 |
20090131607 | Epoxy Resin, Epoxy Resin Composition, Photosensitive Resin Composition and Cured Object Obtained Therefrom - [Problems] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. | 05-21-2009 |
20090202793 | Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same - The present invention relates to a photosensitive, aqueous alkaline solution-soluble polyimide resin (A) obtained by reacting a polyimide resin (a) which can be obtained by a tetracarboxylic acid dianhydride with a diamine compound with an energy ray-curing type aqueous alkaline solution-soluble resin (b); the resin has excellent photosensitivity obtained by mixing with a photopolymerization initiator and the like; the obtained cured products can be photosensitive resin compositions excellent in flexibility, low warping property, adhesion properties, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like. | 08-13-2009 |
20100035182 | PHOTOSENSITIVE RESIN COMPOSITION - The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided. | 02-11-2010 |
20100096169 | Polyamide Resin as Well as Epoxy Resin Composition Using the Same and Use Thereof - The invention provides a phenolic hydroxyl group-containing rubber-modified polyamide resin capable of providing a cured product with excellent heat resistance, adhesion properties, electrically insulating property and flame retardance and having a sufficient flexibility when being shaped into a film, which is characterized by having in its molecule (a) a phenolic hydroxyl group-containing aromatic polyamide segment represented by the following formula (1): | 04-22-2010 |
20100129604 | COPPER FOIL WITH RESIN LAYER - An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer. | 05-27-2010 |
20100207282 | PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): | 08-19-2010 |