Patent application number | Description | Published |
20090212349 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, and a nonvolatile memory cell provided on the semiconductor substrate, the nonvolatile memory cell including a tunnel insulating film provided on a surface of the semiconductor substrate, the tunnel insulating film including semiconductor grains, the semiconductor grains included in both end portions of the tunnel insulating film having smaller grain size than the semiconductor grains included in other portions of the tunnel insulating film, a charge storage layer provided on the tunnel insulating film, an insulating film provided on the charge storage layer, and a control gate electrode provided on the insulating film. | 08-27-2009 |
20090327379 | RANDOM NUMBER GENERATING DEVICE - A random number generating device includes: a pulse voltage generator configured to generate a pulse voltage having an amplitude of 26 mV or more; a random noise generating element including source and drain regions formed at a distance from each other on a semiconductor substrate, a tunnel insulating film formed on a portion of the semiconductor substrate located between the source region and the drain region, and a gate electrode formed above the tunnel insulating film and to which the pulse voltage is applied, the random noise generating element configured to generate a random noise contained in a current flowing between the source region and the drain region; and a random number generating unit configured to generate a random number signal based on the random noise. | 12-31-2009 |
20120061746 | NONVOLATILE SEMICONDUCTOR MEMORY - According to one embodiment, in a nonvolatile semiconductor memory in which a charge store layer is formed on a tunnel insulating film formed on a channel region of a semiconductor substrate, a first nanoparticle layer containing first conductive nanoparticles is formed on the channel side, and a second nanoparticle layer containing a plurality of second conductive nanoparticles having an average particle size larger than the first conductive nanoparticles is formed on the charge store layer side. An average energy value ΔE | 03-15-2012 |
20120235219 | SEMICONDUCTOR MEMORY - In one embodiment, there is provided a semiconductor memory that includes: a semiconductor substrate having a channel region; a first tunnel insulating film on the channel region; a first fine particle layer on the first tunnel insulating film, the first fine particle layer including first conductive fine particles; a second tunnel insulating film on the first fine particle layer; a second fine particle layer on the second tunnel insulating film, the second fine particle layer including second conductive fine particles; a third tunnel insulating film on the second fine particle layer; a third fine particle layer on the third tunnel insulating film, the third fine particle layer including third conductive fine particles. A mean particle diameter of the second conductive fine particles is larger than that of the first conductive fine particles and that of the third conductive fine particles. | 09-20-2012 |
20120235223 | NONVOLATILE SEMICONDUCTOR MEMORY - According to one embodiment, a nonvolatile semiconductor memory including a first gate insulating film formed on a channel region of a semiconductor substrate, a first particle layer formed in the first gate insulating film, a charge storage part formed on the first gate insulating film, a second gate insulating film which is formed on the charge storage part, a second particle layer formed in the second gate insulating film, and a gate electrode formed on the second gate insulating film. The first particle layer includes first conductive particles that satisfy Coulomb blockade conditions. The second particle layer includes second conductive particles that satisfy Coulomb blockade conditions and differs from the first conductive particles in average particle diameter. | 09-20-2012 |
20130082319 | MEMORY DEVICE - According to one embodiment, a memory device includes the following structure. A first double tunnel junction structure includes a first nanocrystal layer that includes first conductive minute particles, and first and second tunnel insulating films arranged to sandwich the first nanocrystal layer. A second double tunnel junction structure includes a second nanocrystal layer that includes second conductive minute particles, and third and fourth tunnel insulating films arranged to sandwich the second nanocrystal layer. A charge storage layer is arranged between the first and second double tunnel junction structures. First and second conductive layers are arranged to sandwich the first double tunnel junction structure, the charge storage layer, and the second double tunnel junction structure. The first conductive minute particles has an average grain size which is different from that of the second conductive minute particles. | 04-04-2013 |
20130248967 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a first memory cell on the first fin-type active area, and a second memory cell on the second fin-type active area. Each of widths of charge storage layers of the first and second memory cells becomes narrower upward from below. Each of inter-electrode insulating layers of the first and second memory cells has a contact portion through which both are in contact with each other. | 09-26-2013 |
20140231740 | MEMORY DEVICE - According to one embodiment, a memory device includes first and second conductive layers, a variable resistance portion, and a multiple tunnel junction portion. The variable resistance portion is provided between the first and second conductive layers. The multiple tunnel junction portion is provided between the first conductive layer and the variable resistance portion, and includes first, second, and third tunnel insulating films, and first and second nanocrystal layers. The first nanocrystal layer between the first and second tunnel insulating films includes first conductive minute particles. The second nanocrystal layer between the second and third tunnel insulating films includes second conductive minute particles. | 08-21-2014 |
20140284679 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a device includes a fin type active area on a semiconductor substrate, the active area having an upper surface with a taper shape, having a width in a first direction, and extending in a second direction intersect with the first direction, a first insulating layer on the active area, a charge storage layer on the first insulating layer, the charge storage layer having an upper surface with a taper shape, a second insulating layer covering the upper surface of the charge storage layer, and a control gate electrode on the second insulating layer, the control gate electrode extending in the first direction. | 09-25-2014 |
20150021678 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a first memory cell on the first fin-type active area, and a second memory cell on the second fin-type active area. Each of widths of charge storage layers of the first and second memory cells becomes narrower upward from below. Each of inter-electrode insulating layers of the first and second memory cells has a contact portion through which both are in contact with each other. | 01-22-2015 |