Patent application number | Description | Published |
20100319530 | SEALING APPARATUS FOR SQUARE PISTON USED FOR COMPRESSING AND FEEDING FLUID - A sealing apparatus for a square piston used for compressing and feeding a fluid is applied to equipment used for compressing or feeding the fluid on the basis of a new concept, and maintains a perfectly sealed state to thus guarantee stable operation of the equipment. The sealing apparatus includes a first sealing member having upper, lower, left-hand and right-hand sides and a first square hole in contact with the square piston, a second sealing member having upper, lower, left-hand and right-hand sides and a second square hole in contact with the square piston, first and second elastic means disposed on the upper and right-hand sides of the first sealing member and installed in a cylinder housing, and third and fourth elastic means disposed on the lower and left-hand sides of the second sealing member and installed in the cylinder housing. | 12-23-2010 |
20110229340 | PENTAGONAL TRUSS UNIT FOR TURBINE OF GENERATOR AND STRUCTURE FOR GENERATION PLANT USING THE SAME - The present invention relates to a pentagonal truss structure for generator and its structure for use in generation plant purpose. The purpose is to provide pentagonal truss structure for generator where solid support of turbine is possible by having truss structure configuration support device and convenient maintenance or replacement work of installed turbine, and generator purpose structure using pentagonal truss structure. Thus, present inventions is located at each upper and lower section of turbine as upper support and lower support to support the rotating turbine, each vertex of above upper and lower support are interconnected, but connect vertex of one support to two vertexes of other support, creating numerous coupling elements forms several triangle shaped truss structure sides, thus above higher support with regular pentagonal planar structure with upper left and right sides, lower left and right sides, and bottom side is composed, above lower support with regular pentagonal planar structure with upper left and right sides, lower left and right sides, and bottom side is composed, and upper left and right sides of lower support is located vertically below the bottom side of higher support, bottom side of lower support located vertically below upper left and right sides of upper support where one side of upper support and one side of bottom support that is located diagonally can maintain mutual parallel, a pentagonal truss unit for turbine of generator and structure for generation plant using the same are the technical essentials. | 09-22-2011 |
20110241348 | MAGNETICALLY BALANCED ELECTRIC GENERATOR - A magnetically balanced electric generator is provided, which includes a rotor rotating, a fixing structure having a fixing axis, a rotating magnet body movably coupled with the fixing axis, and engaged with the rotor, a power-generating block vertically separated from the rotating magnet body, a first magnet mounted along the circumference of the rotating magnet body, a second magnet mounted along the circumference of the power-generating block, power-generating magnets mounted in the rotating magnet body and rotating about the fixing axis upon rotation of the rotating magnet body, and power-generating units mounted in the power-generating block to generate electricity because of the interaction with the power-generating magnet. | 10-06-2011 |
20120230828 | CYLINDRICAL WINDMILL FOR WIND POWER GENERATION - The cylindrical windmill for wind power generation includes: a support frame formed in a cylindrical shape around a rotational shaft; a plurality of wing fixtures protruded from the support frame; a plurality of wing fixing plates, each of which is fixed to the corresponding wing fixture and has elastic properties; and a plurality of wings, each of which is composed of an operating range installed in such a manner that the middle portion between the center and the tip of a wing is fixed to one side of the wing fixing plate to open or close a space that is formed between the wing fixture and the wing fixing plate, and an auxiliary operating range adapted to protrude outside the wing fixture when the space is opened by the operating range. | 09-13-2012 |
20120242091 | ECCENTRIC DUAL ROTOR ASSEMBLY FOR WIND POWER GENERATION - An eccentric dual rotor assembly for wind power generation includes: a supporting structure for rotatably supporting a main shaft; a first rotor including a rotating frame and a plurality of wing assemblies provided on an outer surface of the rotating frame to receive wind and to rotate the rotating frame in the forward direction; a second rotor configured symmetrically to the first rotor and including a rotating frame and a plurality of wing assemblies provided on an outer surface of the rotating frame to receive wind and to rotate the rotating frame in the backward direction; a guide member installed at the front of the main shaft to guide oncoming wind blowing between the first and second rotors to the fronts of the first and second rotors; and power-transmitting means for transmitting kinetic energy generated by the rotation of the first and second rotors to a generating apparatus. | 09-27-2012 |
Patent application number | Description | Published |
20100210104 | METHOD FOR FORMING COPPER WIRING IN A SEMICONDUCTOR DEVICE - A process for forming a copper wiring and the prevention of copper ion migration in a semiconductor device is disclosed herein. The process includes conducting a post-cleaning process for a copper layer that is to form the cooper wiring after already having undergone a CMP process. The post-cleaning process includes conducting a primary chemical cleaning using a citric acid-based chemical. A secondary chemical cleaning is then conducted on the copper layer having undergone the primary chemical cleaning using an ascorbic acid-based chemical. After the post-cleaning process is completed, the migration of copper ions over time is prevented thereby improving the reliability of the semiconductor device. | 08-19-2010 |
20150069557 | MAGNETORESISTIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a magnetoresistive element is disclosed. The magnetoresistive element includes a reference layer, a tunnel barrier layer, a storage layer. The storage layer includes a first region and a second region provided outside the first region to surround the first region, the second region including element included in the first region and another element being different from the element. The magnetoresistive element further includes a cap layer including a third region and a fourth region provided outside the third region to surround the third region, the fourth region including an element included in the third region and the another element. | 03-12-2015 |
20150069558 | MAGNETIC MEMORY AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a magnetic memory is disclosed. The memory includes a conductive layer containing a first metal material, a stacked body above the conductive layer, and including a first magnetization film containing a second metal material, a second magnetization film, and a tunnel barrier layer between the first magnetization film and the second magnetization film, and an insulating layer on a side face of the stacked body, and containing an oxide of the first metal material. The first magnetization film and/or the second magnetization film includes a first region positioned in a central portion, and a second region positioned in an edge portion and containing As, P, Ge, Ga, Sb, In, N, Ar, He, F, Cl, Br, I, Si, B, C, O, Zr, Tb, S, Se, or Ti. | 03-12-2015 |
Patent application number | Description | Published |
20110277863 | LOW PRESSURE ACCUMULATOR FOR ANTI-LOCK BRAKE SYSTEM - Disclosed is a low pressure accumulator for an anti-lock brake system of a vehicle. The low pressure accumulator includes a cylinder having one end communicated with a fluid path connected to a valve and a pump and an opposite end formed with an opening, a piston moving back and forth in the cylinder, a spring installed in the cylinder to elastically support the piston, and a plug installed in the opening of the cylinder to support one end of the spring. The plug includes a vent to ventilate air through an inside and an outside of the cylinder. | 11-17-2011 |
20120199772 | SOLENOID VALVE FOR BRAKE SYSTEMS - Disclosed herein is a solenoid valve for brake systems which improves an assembly structure of components constituting the valve to enhance durability and control performance of the valve. The solenoid valve includes a sheet housing, a valve sheet, a sleeve, a magnetic core and an armature, the armature includes an upper body and a lower body separated from each other, the upper body is formed of a magnetic material and has an external diameter corresponding to the internal diameter of the sleeve so as to be guided and moved forward and backward within the sleeve, the lower body is formed of a non-magnetic material, is provided with an opening and closing part to open and close an orifice of the valve sheet, and elastic members to press the upper body and the lower body in the facing directions to move the upper body and the lower body together are provided. | 08-09-2012 |
20130105715 | SOLENOID VALVE FOR BRAKE SYSTEM | 05-02-2013 |
20130299288 | ELECTRONIC DISC BRAKE - Disclosed herein is an electronic disc brake. The electronic disc brake includes a carrier on which a pair of pad plates are mounted, a caliper housing, which is slidably installed on the carrier and is provided with a cylinder having a piston mounted therein, a pressure device installed within the cylinder, the pressure device converting rotational motion into rectilinear motion to press and release the piston, the pressure device having an output key which protrudes by penetrating a rear wall of the caliper housing, a motor mounted on an outer surface of the caliper housing to generate drive force, a reducer coupled with a rotary shaft of the motor to amplify the drive force, and a coupling interposed between the reducer and the pressure device to transmit the amplified drive force to the pressure device, wherein the motor, the reducer, and the pressure device are coaxially connected in series. | 11-14-2013 |
Patent application number | Description | Published |
20110307836 | MOBILE TERMINAL AND CONTROLLING METHOD THEREOF - According to one embodiment of the present invention, a mobile terminal includes a touchscreen configured to display a list including a plurality of categories and at least one content grouped for each of the plurality of categories, and a controller, if a command for a reduced display of the list is received, configured to generate summary information for each of the plurality of categories based on information of the grouped at least one content, to hide the grouped at least one content from the list, and then to control the touchscreen to display the plurality of categories and the generated summary information corresponding to the plurality of categories. | 12-15-2011 |
20130104032 | MOBILE TERMINAL AND METHOD OF CONTROLLING THE SAME - A mobile terminal and a method of controlling the same are provided. The mobile terminal captures an image relating to a predetermined item displayed on a touchscreen, maps attribute information relating to the item to the capture image, stores the capture image, and uses the capture image on the basis of the attribute information. Accordingly, a desired item is used more easily. | 04-25-2013 |
20140208244 | MOBILE TERMINAL AND CONTROL METHOD THEREOF - This specification relates to a mobile terminal capable of displaying contents and a control method thereof. The mobile terminal includes a memory configured to store a plurality of contents associated with a plurality of applications together with log information relating to each of the contents, a user input unit configured to receive condition information, input in relation to the log information and a controller configured to extract contents which satisfy the condition information based on the log information related to each of the contents, and display the extracted contents. | 07-24-2014 |
20140337729 | MOBILE TERMINAL, CONTROLLING METHOD THEREOF, AND RECORDING MEDIUM THEREOF - A touchscreen displays an edit region for writing a message to transmit to at least one counterpart and an attach region for displaying an attachment file attached to the message. While a multimedia file is displayed on the attach region by being set as the attachment file of the message, and if the multimedia file displayed on the attach region is touched and dragged to the edit region, the controller controls the multimedia file to be displayed in a manner of being inserted in the edit region. While the multimedia file is displayed in a manner of being inserted in the edit region, and if the multimedia file displayed on the edit region is touched and dragged to the attach region, the controller controls the multimedia file to be set as the attachment file of the message. | 11-13-2014 |
Patent application number | Description | Published |
20090156192 | VERIFYING AVAILABILITY OF IDLE-MODE MOBILE SUBSCRIBER STATION IN WIRELESS ACCESS SYSTEM - A method of verifying availability of a mobile subscriber station that is in an idle-mode includes requesting to a base station by the mobile subscriber station to enter an idle-mode, wherein the base station is associated with a paging group comprising a plurality of base stations, and receiving from the base station an idle-mode response command to enter the idle-mode. The method also includes receiving from the base station a paging command comprising an action code associated with performing ranging while the mobile subscriber station is in the idle-mode to verify availability of the mobile subscriber station with respect to the base station, wherein if the ranging is not successfully performed with the base station during a predetermined period, the base station continues to transmit the paging command until a paging retrial count reaches a predetermined threshold. | 06-18-2009 |
20090170534 | VERIFYING AVAILABILITY OF IDLE-MODE MOBILE SUBSCRIBER STATION IN WIRELESS ACCESS SYSTEM - A method of verifying availability of a mobile subscriber station that is in an idle-mode includes requesting to a base station by the mobile subscriber station to enter an idle-mode, wherein the base station is associated with a paging group comprising a plurality of base stations, and receiving from the base station an idle-mode response command to enter the idle-mode. The method also includes receiving from the base station a paging command comprising an action code associated with performing ranging while the mobile subscriber station is in the idle-mode to verify availability of the mobile subscriber station with respect to the base station, wherein if the ranging is not successfully performed with the base station during a predetermined period, the base station continues to transmit the paging command until a paging retrial count reaches a predetermined threshold. | 07-02-2009 |
20090170535 | VERIFYING AVAILABILITY OF IDLE-MODE MOBILE SUBSCRIBER STATION IN WIRELESS ACCESS SYSTEM - A method of verifying availability of a mobile subscriber station that is in an idle-mode includes requesting to a base station by the mobile subscriber station to enter an idle-mode, wherein the base station is associated with a paging group comprising a plurality of base stations, and receiving from the base station an idle-mode response command to enter the idle-mode. The method also includes receiving from the base station a paging command comprising an action code associated with performing ranging while the mobile subscriber station is in the idle-mode to verify availability of the mobile subscriber station with respect to the base station, wherein if the ranging is not successfully performed with the base station during a predetermined period, the base station continues to transmit the paging command until a paging retrial count reaches a predetermined threshold. | 07-02-2009 |
20100273483 | METHOD OF COMMUNICATING DATA IN A WIRELESS MOBILE COMMUNICATION SYSTEM - A method of communicating data in a wireless communication system is disclosed. More specifically, a method discloses transmitting a request by a mobile subscriber station (MSS) to a network entity via a de-registration request message requesting the network entity to retain a preferred session information, and receiving a selected session information via a de-registration command response from the network entity. | 10-28-2010 |
20140087771 | VERIFYING AVAILABILITY OF IDLE-MODE MOBILE SUBSCRIBER STATION IN WIRELESS ACCESS SYSTEM - A method of verifying availability of a mobile subscriber station that is in an idle-mode includes requesting to a base station by the mobile subscriber station to enter an idle-mode, wherein the base station is associated with a paging group comprising a plurality of base stations, and receiving from the base station an idle-mode response command to enter the idle-mode. The method also includes receiving from the base station a paging command comprising an action code associated with performing ranging while the mobile subscriber station is in the idle-mode to verify availability of the mobile subscriber station with respect to the base station, wherein if the ranging is not successfully performed with the base station during a predetermined period, the base station continues to transmit the paging command until a paging retrial count reaches a predetermined threshold. | 03-27-2014 |
Patent application number | Description | Published |
20110275007 | SOLID OXIDE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a solid oxide fuel cell and a method for manufacturing the same. The solid oxide fuel cell includes an anode layer; a cathode layer; an electrolyte layer interposed between the anode layer and the cathode layer; wherein the anode layer includes an Si-based compound selected from a group consisting of SiC, Si | 11-10-2011 |
20120021339 | SOLID OXIDE FUEL CELL AND MANUFACTURING METHOD THEREOF - Disclosed herein are a solid oxide fuel cell and a manufacturing method thereof. The solid oxide fuel cell includes: an anode layer, a cathode layer, and an electrolyte layer interposed between the anode layer and the cathode layer, wherein the anode layer includes: a conductive material; yttria stabilized zirconia (YSZ); and an oxide compound for forming a solid solution with the yttria stabilized zirconia. | 01-26-2012 |
20120058410 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell. The solid oxide fuel cell includes: a tubular first electrode support layer formed with a plurality of first passages; an inner electrolyte layer formed in the first electrode support layer; an inner second electrode layer formed on the inner surface of the first electrolyte layer and forming an inner second passage; an outer electrolyte layer formed on the outer surface of the first electrode support layer; and an outer second electrode layer formed on the outer surface of the second electrolyte layer and adjacent to the outer second passage. | 03-08-2012 |
20120064432 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell. A solid oxide fuel cell | 03-15-2012 |
20120141906 | ELECTRODE MATERIAL FOR FUEL CELL, FUEL CELL COMPRISING THE SAME AND METHOD OF MANUFACTURING THE FUEL CELL - There are provided an electrode material for a fuel cell, a fuel cell comprising the same, and a method of manufacturing the fuel cell. The electrode material for a fuel cell comprises an electrode base material and spherical polystyrene particles forming pores on the electrode base material through heat treatment. In the case of the electrode material according to an exemplary embodiment of the present invention, the average particle size and content of the spherical polystyrene particles may be controlled to form pores having a uniform size on a sintering body formed of the electrode base material, and the control of the porosity thereof may be facilitated. | 06-07-2012 |
20130075270 | METHOD FOR COATING METALLIC INTERCONNECT OF SOLID FUEL CELL - Disclosed herein is a method for coating a metallic interconnect of a solid oxide fuel cell. The method for coating a metallic interconnect of a solid oxide fuel cell includes generating a cobalt compound solution using lithium cobalt oxide (LiCoO | 03-28-2013 |
20130171535 | SYSTEM FOR MEASURING PERFORMANCE OF SOLID OXIDE FUEL CELL - Disclosed herein is a system for measuring performance of a solid oxide fuel cell, including: a heating furnace wrapping the solid oxide fuel cell, the heating furnace having a first opening part through which one lateral surface in a length direction of the solid oxide fuel cell outwardly protrudes and a fuel supply hole formed in one surface thereof; a first fuel storage unit; a second fuel storage unit; a first fuel supply control unit; a second fuel supply control unit; an electronic load measuring current or voltage outputted from the solid oxide fuel cell; and a control unit controlling the supply of fuel by using the first fuel supply control unit and the second fuel supply control unit, and controlling the measurement of current or voltage by using the electronic load. | 07-04-2013 |
20130171539 | TUBULAR SOLID OXIDE FUEL CELL MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a tubular solid oxide fuel cell module including an anode layer, an electrolyte layer, a cathode layer divided into two parts or more, a conductive mesh structure and a conductive wire, and a method of manufacturing the same. The tubular solid oxide fuel cell is advantageous in that the cathode is divided into two parts or more, so that the moving distance of electric charges is decreased, with the result that resistance loss can be minimized, thereby increasing the efficiency of collecting electric charges. | 07-04-2013 |
Patent application number | Description | Published |
20090040828 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes first and second memory cell blocks, a block decoder, and first and second block switches. The first and second memory cell blocks have a plurality of memory cells connected in a string structure and are respectively disposed in neighboring planes. The block decoder outputs first and second block select signals in response to pre-decoded address signals and first and second plane select signals, which are respectively enabled according to an enable state of the planes. The first and second block switches connect global word lines to word lines of the first and second memory cell blocks in response to the first and second block select signals, respectively. | 02-12-2009 |
20090043949 | BLOCK DECODER OF A FLASH MEMORY DEVICE - A block decoder increases the integration level of a flash memory device by reducing the number of control signals. Address signals are substituted with existing high voltage switch signals. The block decoder of a flash memory device includes a primary decoding unit and a secondary decoding unit. The primary decoding unit outputs a decoding signal in response to first and second address coding signals of a high voltage and first to third control signals. The secondary decoding unit outputs a control signal to control the potential of a block word line in response to the decoding signal and first and second pre-decoded signals. | 02-12-2009 |
20090167416 | CURRENT CONSUMPTION PREVENTION APPARATUS OF A HIGH VOLTAGE GENERATOR - A current consumption prevention apparatus includes a first current supply unit for transferring charges from a capacitor connected to a first inverter group to a capacitor connected to a second inverter group, and a second current supply unit for transferring charges of the capacitor connected to the second inverter group to the capacitor connected to the first inverter group. The current supply units are operated complementarily. | 07-02-2009 |
20090168841 | TEMPERATURE SENSOR - A temperature sensor that can be used in semiconductor devices includes a reference voltage generator for dividing a power supply voltage and outputting a reference voltage, a compare voltage generator for outputting compare voltages with different levels depending on a change of a control signal, a temperature voltage generator for generating a temperature voltage based on the reference voltage and a threshold voltage of a MOS transistor, and a comparator for comparing an amplified temperature voltage and the compare voltage. | 07-02-2009 |
20090231897 | MULTI-CHIP PACKAGE - A multi-chip package includes a plurality of memory chips and a control chip. The control chip stores information about whether the memory chips are operating normally and selects chips that are operating normally according to an address signal. | 09-17-2009 |
20100054074 | VOLTAGE GENERATION CIRCUIT AND NONVOLATILE MEMORY DEVICE INCLUDING THE SAME - A high voltage generation circuit includes a clock logic unit configured to generate a switch clock signal and a pump clock signal, that has a varying frequency, in response to an input signal, a high voltage unit configured to generate a high voltage in response to the pump clock signal, a high voltage switch configured to output a selection signal in response to the switch clock signal, and a switching element configured to transfer the high voltage, generated by the high voltage unit, to an output node in response to the selection signal. | 03-04-2010 |
20100302851 | NONVOLATILE MEMORY DEVICE AND METHOD OF PROGRAMMING THE SAME - A nonvolatile memory device and a method of programming the device includes a memory cell array configured to have a number of memory cells, a row decoder coupled to the memory cells through word lines, page buffers coupled to the memory cells through bit lines, and a control unit configured to output correction voltages for reducing a difference in voltage between a selected one of the word lines and a channel region of a selected one of the memory cells in response to a program operation being performed. | 12-02-2010 |
20110158028 | BLOCK DECODER OF SEMICONDUCTOR MEMORY DEVICE - A block decoder of a semiconductor memory device includes a control signal generation circuit configured to output a control signal in response to a first address mixing signal, a second address mixing signal, and an enable period signal and a block selection signal generation circuit configured to generate a block selection signal for selecting a memory block in response to the control signal. | 06-30-2011 |
20120139622 | SEMICONDUCTOR APPARATUS VOLTAGE SUPPLY CIRCUIT - A voltage supply circuit includes, inter alia, a clock generator, a negative voltage pump, a level shifter, a clock controller, and a pump circuit. The clock generator generates a first clock swinging between a positive voltage and a ground voltage. The negative voltage pump generates a negative voltage. A level shifter shifts the first clock by the negative voltage to output a second clock swinging between the negative voltage and the ground voltage. The clock controller generates a third clock by inverting the second clock and also generates a fourth clock by inverting the third clock. The pump circuit generates a high voltage according to the third and fourth clocks. | 06-07-2012 |
20120168905 | CAPACITOR OF NONVOLATILE MEMORY DEVICE - The capacitor of a nonvolatile memory device includes first and second electrodes formed in the capacitor region of a semiconductor substrate to respectively have consecutive concave and convex shape of side surfaces formed along each other and a dielectric layer formed between the first and the second electrodes. | 07-05-2012 |
20130070552 | NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes a plurality of memory blocks, first block switches configured to correspond to the respective odd-numbered memory blocks of the plurality of memory blocks and couple the word lines of the odd-numbered memory blocks and first local lines, second block switches configured to correspond to the respective even-numbered memory blocks of the plurality of memory blocks and couple the word lines of the even-numbered memory blocks and second local lines, a local line switch unit configured to selectively couple the first local lines or the second local lines and global word lines, and a high voltage generator configured to supply operating voltages to the global word lines. | 03-21-2013 |
20130083573 | REGULATOR AND HIGH VOLTAGE GENERATOR - A regulator includes a current path unit coupled between an input terminal and a ground terminal and including a first current determination unit coupled between the input terminal and a control node and configured to supply the high voltage to the control node so that a first or second current path is selected depending on a voltage of the control node, and a second current determination unit coupled between the control node and the ground terminal and configured to control the voltage of the control node depending on an input voltage, a voltage supply unit configured to supply the high voltage to an output terminal depending on the voltage of the control node, a voltage division unit configured to create a division voltage, and an amplification unit configured to amplify a difference between the division voltage and a first reference voltage. | 04-04-2013 |
20130083614 | VOLTAGE SUPPLY CIRCUIT, SEMICONDUCTOR MEMORY DEVICE, AND OPERATING METHOD THEREOF - A voltage supply circuit includes a high voltage generator configured to generate an operating voltage, a global word line switch configured to transfer the operating voltage to global word lines, a plurality of local line switches coupled to the global word lines and configured to transfer the operating voltage to corresponding local word lines, a precharge unit configured to supply a precharge voltage to an unselect local line switch adjacent to a select local line switch to which the operating voltage will be supplied, from among the plurality of local line switches, in a preparation section before an operation is started, and a coupling unit configured to couple the unselect local line switch and the global word line switch when the operation is started. | 04-04-2013 |
20130106483 | SEMICONDUCTOR DEVICE | 05-02-2013 |
20130106491 | VOLTAGE SELECT CIRCUIT AND INTERGRATED CIRCUIT INCLUDING THE SAME | 05-02-2013 |
20140103192 | BINARY CMOS IMAGE SENSORS, METHODS OF OPERATING SAME, AND IMAGE PROCESSING SYSTEMS INCLUDING SAME - A binary complementary metal-oxide-semiconductor (CMOS) image sensor includes a pixel array and a readout circuit. The pixel array includes at least one pixel having a plurality of sub-pixels. The readout circuit is configured to quantize a pixel signal output from the pixel using a reference signal. The pixel signal corresponds to sub-pixel signals output from sub-pixels, from among the plurality of sub-pixels, activated in response to incident light. | 04-17-2014 |
20140367756 | CAPACITOR OF NONVOLATILE MEMORY DEVICE - The capacitor of a nonvolatile memory device includes first and second electrodes formed in the capacitor region of a semiconductor substrate to respectively have consecutive concave and convex shape of side surfaces formed along each other and a dielectric layer formed between the first and the second electrodes. | 12-18-2014 |
Patent application number | Description | Published |
20100025749 | SEMICONDUCTOR DEVICE - A semiconductor device may include an isolation layer, gate electrodes, an insulating interlayer, an impurity region, a capping layer and a plug. The isolation layer may be formed in the substrate. The gate electrodes may be formed on the substrate. The insulating interlayer may be formed on the gate electrodes. The insulating interlayer may have a contact hole between the gate electrodes. The impurity region may be in the substrate exposed through the contact hole. The capping layer may be on the impurity region. The plug may be on the capping layer. Thus, the impurities may not be lost from the impurity region. As a result, the device may have improved electrical characteristics and reliability because depletion may not be generated in the electrode layer | 02-04-2010 |
20100035425 | Integrated Circuit Devices Having Partially Nitridated Sidewalls and Devices Formed Thereby - Methods of forming integrated circuit devices include forming an electrically conductive layer containing silicon on a substrate and forming a mask pattern on the electrically conductive layer. The electrically conductive layer is selectively etched to define a first sidewall thereon, using the mask pattern as an etching mask. The first sidewall of the electrically conductive layer may be exposed to a nitrogen plasma to thereby form a first silicon nitride layer on the first sidewall. The electrically conductive layer is then selectively etched again to expose a second sidewall thereon that is free of the first silicon nitride layer. The mask pattern may be used again as an etching mask during this second step of selectively etching the electrically conductive layer. | 02-11-2010 |
20100109057 | Fin field effect transistor and method of fabricating the same - A fin field effect transistor includes a fin protruding from a semiconductor substrate, a gate insulating layer formed so as to cover upper and lateral surfaces of the fin, and a gate electrode formed across the fin so as to cover the gate insulating layer. An upper edge of the fin is rounded so that an electric field concentratedly applied to the upper edge of the fin through the gate electrode is dispersed. A thickness of a portion of the gate insulating layer formed on an upper surface of the fin is greater than a thickness of a portion of the gate insulating layer formed on a lateral surface of the fin, in order to reduce an electric field applied through the gate electrode. | 05-06-2010 |
20110237037 | Methods of Forming Recessed Channel Array Transistors and Methods of Manufacturing Semiconductor Devices - In methods of manufacturing a recessed channel array transistor, a recess may be formed in an active region of a substrate. A plasma oxidation process may be performed on the substrate to form a preliminary gate oxide layer on an inner surface of the recess and an upper surface of the substrate. Moistures may be absorbed in a surface of the preliminary gate oxide layer to form a gate oxide layer. A gate electrode may be formed on the gate oxide layer to fill up the recess. Source/drain regions may be formed in an upper surface of the substrate at both sides of the gate electrode. Thus, the oxide layer may have a uniform thickness distribution and a dense structure. | 09-29-2011 |
20120282769 | METHODS OF FORMING INTEGRATED CIRCUIT DEVICES HAVING ELECTRICALLY CONDUCTIVE LAYERS THEREIN WITH PARTIALLY NITRIDATED SIDEWALLS - Methods of forming integrated circuit devices include forming an electrically conductive layer containing silicon on a substrate and forming a mask pattern on the electrically conductive layer. The electrically conductive layer is selectively etched to define a first sidewall thereon, using the mask pattern as an etching mask. The first sidewall of the electrically conductive layer may be exposed to a nitrogen plasma to thereby form a first silicon nitride layer on the first sidewall. The electrically conductive layer is then selectively etched again to expose a second sidewall thereon that is free of the first silicon nitride layer. The mask pattern may be used again as an etching mask during this second step of selectively etching the electrically conductive layer. | 11-08-2012 |
Patent application number | Description | Published |
20090026604 | Semiconductor plastic package and fabricating method thereof - A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board. | 01-29-2009 |
20090084595 | Printed circuit board and manufacturing method of the same - A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion. | 04-02-2009 |
20090236038 | Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same - A method for manufacturing an insulating sheet, a method for manufacturing a metal clad laminate, and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing an insulating sheet may include stacking a thermoplastic resin layer over a reinforcement material, and hot pressing the thermoplastic resin layer into the reinforcement material to impregnate and attach the thermoplastic resin layer into the reinforcement material. Certain embodiments of the invention can be utilized to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the multi-layer printed circuit board using the insulation board. Furthermore, the stress in the material connecting the semiconductor chip with the printed circuit board can be reduced, so that cracking or delamination in the connecting material, such as lead-free solder, may be avoided. | 09-24-2009 |
20090242248 | Insulating sheet and printed circuit board having the same - A method of manufacturing an insulating sheet can include: providing a reinforcement material on which a thermoplastic resin layer is stacked, stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate, and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate. This method can be used to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the printed circuit board using the insulation board. Furthermore, the stress in the connecting material can be reduced, so that cracking or delamination in the connecting material may be avoided, while heat-releasing performance may also be improved. | 10-01-2009 |
20090250253 | Printed circuit board and manufacturing method thereof - Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes: providing a first resin layer having a first pattern on one surface thereof; forming a conductive bump, which is electrically connected to the first pattern, on one surface of the first resin layer; compressing an insulation layer and the first resin layer such that the conductive bump passes through the insulation layer; laminating a second resin layer, which has a second pattern on a surface thereof facing the insulation layer, on the insulation layer; and forming an opening by etching a part of at least one of the first resin layer and the second resin layer. | 10-08-2009 |
20090255714 | Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board - A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin. | 10-15-2009 |
20090288293 | Metal core package substrate and method for manufacturing the same - A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps. | 11-26-2009 |
20100330747 | Method of fabricating semiconductor plastic package - A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board. | 12-30-2010 |
20110114369 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin. | 05-19-2011 |
20110123772 | CORE SUBSTRATE AND METHOD OF MANUFACTURING CORE SUBSTRATE - A core substrate and a method of manufacturing the core substrate are disclosed. In accordance with an embodiment of the present invention, the core substrate includes an adhesive resin layer having a mineral filler added therein, a metal sheet, which is patterned and embedded in the adhesive resin layer, and an insulation layer, which is stacked on both surfaces of the adhesive resin layer. Since a through-hole is formed to correspond to the number of via holes in accordance with a higher density of a printed circuit board, no conventional land is required to be formed, thereby reducing the defect of eccentricity. | 05-26-2011 |
20110126970 | METALLIC LAMINATE AND MANUFACTURING METHOD OF CORE SUBSTRATE USING THE SAME - A metallic laminate and a method of manufacturing a core substrate using the same are disclosed. In accordance with an embodiment of the present invention, the metallic laminate includes an insulation material, a carrier layer, which is stacked on both surfaces of the insulation layer and in which the carrier layer is a metal, and a first metal foil, which is stacked on one surface of the carrier layer. By symmetrically forming two core substrates on either surface above and below the insulation material, each process of forming the core substrate can be performed at the same time in the shape of a pair of facing core substrates, thereby increasing the productivity by twice. The remaining insulation material having the carrier layer stacked thereon can be used as a base substrate that is used to manufacture a printed circuit board, thus preventing unnecessary waste of the insulation material. | 06-02-2011 |
20110127073 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a metal core having Invar layers formed on either surface of a copper layer, an insulation layer, which is formed on one surface of the metal core, and a circuit pattern, which is coupled to one surface of the insulation layer. Thus, the printed circuit board can improve thermal conductivity and deformation resistance against warpage. | 06-02-2011 |
20110139499 | Printed circuit board and manufacturing method of the same - A printed circuit board the includes: an insulation layer; a first circuit pattern including a first electrode pad buried in the insulation layer such that a portion of the first circuit pattern is exposed at a surface of the insulation layer; an inner substrate having the insulation layer stacked therein and having a second circuit pattern including a second electrode pad formed thereon; a conductive post buried in the insulation layer such that one end thereof is connected to the first electrode pad and the other end thereof is connected to the second electrode pad; and a solder resist layer stacked on the insulation layer. | 06-16-2011 |
20110315437 | Printed circuit board with reinforced thermoplastic resin layer - A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher. | 12-29-2011 |
20120012247 | Method of manufacturing insulating sheet and printed circuit board having the same - A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate. | 01-19-2012 |
20120012379 | Printed circuit board - A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the insulation layer; a via electrically connecting the first pattern with the second pattern; and a second resin layer laminated on the other surface of the insulation layer to cover the second pattern. | 01-19-2012 |
20120018195 | Printed circuit board - A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist. | 01-26-2012 |
20120030938 | Method of manufacturing printed circuit board - A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist. | 02-09-2012 |
20120043128 | Printed circuit board and method of manufacturing the same - The present invention provides a multilayer printed circuit board and a method for manufacturing the same. The printed circuit board includes: an inner circuit layer which is disposed on a first insulating layer; a via land which is disposed on the first insulating layer to be spaced apart from the inner circuit layer and has a hole; a second insulating layer which is disposed on the first insulating layer including the inner circuit layer and the via land; first and second outer circuit layers which are disposed on outer surfaces of the first and second insulating layers, respectively; and a via which passes through the hole of the via land and the first and second insulating layers and electrically interconnects the first and second outer circuit layers. | 02-23-2012 |
20140165346 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin. | 06-19-2014 |
Patent application number | Description | Published |
20110221495 | DIGITAL DLL INCLUDING SKEWED GATE TYPE DUTY CORRECTION CIRCUIT AND DUTY CORRECTION METHOD THEREOF - Provided are a delay locked loop (DLL) that may can be included in a data processing device and may include a duty correction circuit, and a duty correction method of such a DLL. The duty correction method includes aligning a second transition of an output clock at a first transition of a clock for duty correction, sampling the clock for duty correction at the first transition of the output clock to detect an error of a duty cycle, and performing duty correction using a skewed gate chain according to the detected error of a duty cycle. | 09-15-2011 |
20110267874 | Invalid Write Prevention for STT-MRAM Array - In a Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) a bit cell array can have a source line substantially parallel to a word line. The source line can be substantially perpendicular to bit lines. A source line control unit includes a common source line driver and a source line selector configured to select individual ones of the source lines. The source line driver and source line selector can be coupled in multiplexed relation. A bit line control unit includes a common bit line driver and a bit line selector in multiplexed relation. The bit line control unit includes a positive channel metal oxide semiconductor (PMOS) element coupled between the common source line driver and bit line select lines and bit lines. | 11-03-2011 |
20120026783 | Latching Circuit - A non-volatile latch circuit includes a pair of cross-coupled inverters, a pair of resistance-based memory elements, and write circuitry configured to write data to the pair of resistance-based memory elements. The pair of resistance-based memory elements is isolated from the pair of cross-coupled inverters during a latching operation. A sensing circuit includes a first current path that includes a first resistance-based memory element and an output of the sensing circuit. The sensing circuit includes a second current path to reduce current flow through the first resistance-based memory element at a first operating point of the sensing circuit. The sensing circuit may also include an n-type metal-oxide-semiconductor (NMOS) transistor to provide a step down supply voltage to the first current path. | 02-02-2012 |
20120062294 | CLOCK DELAY CIRCUIT AND DELAY LOCKED LOOP INCLUDING THE SAME - A digital delay line includes a plurality of delay cells therein. The delay line is configured to delay a periodic signal received at a first input thereof by passing the periodic signal through a selected number of the plurality of delay cells, in response to a discontinuous thermometer code that encodes the selected number. A code converter is provided, which includes a group bit decoder, a shared bit decoder and a code output cell array, which are collectively configured to generate the discontinuous thermometer code in response to a binary control code. | 03-15-2012 |
20130002352 | SENSING CIRCUIT - A circuit includes a degeneration p-channel metal-oxide-semiconductor (PMOS) transistor, a load PMOS transistor, and a clamp transistor configured to clamp a voltage applied to a resistance based memory element during a sensing operation. A gate of the load PMOS transistor is controlled by an output of an operational amplifier. | 01-03-2013 |
20130003447 | SENSING CIRCUIT - A circuit includes a degeneration p-channel metal-oxide-semiconductor (PMOS) transistor, a load PMOS transistor, and a clamp transistor configured to clamp a voltage applied to a resistance based memory element during a sensing operation. A gate of the load PMOS transistor is controlled by an output of a not-AND (NAND) circuit. | 01-03-2013 |
20130120031 | FREQUENCY MULTIPLIER AND METHOD OF MULTIPLYING FREQUENCY - A frequency multiplier in accordance with some embodiments of the inventive concept may include a pulse generator receiving a differential clock signal from a delay locked loop having a plurality of delay cells to generate a pulse signal for generation of a multiplication clock signal. The pulse generator comprises an intermediate pulse signal generation unit receiving the differential clock signal to generate intermediate pulse signals; and an overlap correction unit correcting an overlap between the intermediate pulse signals to generate correction pulse signals. | 05-16-2013 |
20130182500 | LATCHING CIRCUIT - A non-volatile latch circuit includes a pair of cross-coupled inverters, a pair of resistance-based memory elements, and write circuitry configured to write data to the pair of resistance-based memory elements. The pair of resistance-based memory elements is isolated from the pair of cross-coupled inverters during a latching operation. A sensing circuit includes a first current path that includes a resistance-based memory element and an output of the sensing circuit. The sensing circuit includes a second current path to reduce current flow through the resistance-based memory element at a first operating point of the sensing circuit. | 07-18-2013 |
20130194862 | NON-VOLATILE FLIP-FLOP - A flip-flop has an output control node and an isolation switch selectively couples a retention sense node to the output control node. A sense circuit selectively couples an external sense current source to the retention sense node and to magnetic tunneling junction (MTJ) elements. Optionally a write circuit selectively injects a write current through one MTJ element and then another MTJ element. Optionally, a write circuit injects a write current through a first MTJ element concurrently with injecting a write current through a second MTJ element. | 08-01-2013 |
20130215675 | INVALID WRITE PREVENTION FOR STT-MRAM ARRAY - In a Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) a bit cell array can have a source line substantially parallel to a word line. The source line can be substantially perpendicular to bit lines. A source line control unit includes a common source line driver and a source line selector configured to select individual ones of the source lines. The source line driver and source line selector can be coupled in multiplexed relation. A bit line control unit includes a common bit line driver and a bit line selector in multiplexed relation. The bit line control unit includes a positive channel metal oxide semiconductor (PMOS) element coupled between the common source line driver and bit line select lines and bit lines. | 08-22-2013 |
20130286721 | LOW SENSING CURRENT NON-VOLATILE FLIP-FLOP - A low sensing current non volatile flip flop includes a first stage to sense a resistance difference between two magnetic tunnel junctions (MTJs) and a second stage having circuitry to amplify the output of the first stage. The output of the first stage is initially pre-charged and determined by the resistance difference of the two MTJs when the sensing operation starts. The first stage does not have a pull-up path to a source voltage (VDD), and therefore does not have a DC path from VDD to ground during the sensing operation. A slow sense enable (SE) signal slope reduces peak sensing current in the first stage. A secondary current path reduces the sensing current duration of the first stage. | 10-31-2013 |
20140203854 | DELAY LOCKED LOOP AND METHOD OF GENERATING CLOCK - Provided is a delay locked loop (DLL) including a ring oscillator (RO) including a delay line to delay a reference clock signal and generate a delayed clock signal, wherein the RO circulates, through the delay line, a feedback clock signal corresponding to the delayed clock signal to synchronize N cycles of the feedback clock signal with a cycle of the reference clock signal (where N is an integer number equal to or larger than 2); and a first frequency divider dividing the frequency of the delayed clock signal by 1/N (where N is an integer number equal to or larger than 2) to generate an output clock signal. | 07-24-2014 |
20140204974 | TEMPERATURE SENSOR AND TEMPERATURE SENSING METHOD - Provided is a temperature sensing circuit and a temperature sensing method including a delay unit delaying an input clock signal to generate a feedback clock signal, and including logic gates of which delay times are variable according to temperature, a delay control unit comparing the feedback clock signal with a reference clock signal and controlling each of the logic gates of the delay unit according to the comparison result, and an input signal control unit selecting, as the input clock signal, any one of the feedback clock signal and the reference clock signal to input the input clock signal to the delay unit. | 07-24-2014 |
Patent application number | Description | Published |
20110114397 | POWER MODULE AND VEHICLE HAVING THE SAME - Provided is a power module in which a motor and a motor driving unit are efficiently configured and a vehicle having the same. The power module includes a power module case forming an external form; an inverter provided within the power module case and configured to convert a direct current (DC) power into an alternating current (AC) power; an AC power conductor provided in the power module case and connected to the inverter to cause the AC power converted by the inverter to flow therethrough; and a motor provided in the power module case and connected to the AC power conductor to receive the AC power and generate a rotational force. | 05-19-2011 |
20110115416 | APPARATUS FOR DRIVING MOTOR OF ELECTRIC VEHICLE - An apparatus for driving a motor of an electric vehicle is provided. The apparatus includes a capacitor supplied with power by a battery; an inverter configured to include a plurality of switching elements, convert direct current (DC) power stored in the capacitor into alternating current (AC) power in accordance with the switching of the switching elements and drive a motor with the AC power; and a capacitor protector provided between the battery and the capacitor and configured to consume initial power supplied by the battery at an early stage of the supply of power by the battery, the capacitor protector including a common resistor that consumes the DC power stored in the capacitor when the capacitor is discharged. Therefore, it is possible to guarantee the reliability of the apparatus. | 05-19-2011 |
20110116235 | MOTOR DRIVE UNIT AND VEHICLE INCLUDING THE SAME - Disclosed is a motor drive unit. The motor drive unit includes a case, a capacitor provided in the case and generating heat, an inverter provided in the case and configured to convert Direct Current (DC) power into Alternating Current (AC) power, and a water cooling jacket provided in the case and configured to radiate heat generated by the inverter to the outside. The case includes a radiating plate to radiate the heat generated by the capacitor to the outside. | 05-19-2011 |
20120162912 | INVERTER STACK - An inverter stack includes an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space, a heat sink having a switching element, disposed within an upper region of the internal space, and a plurality of DC-link capacitors disposed within the internal space and below the heat sink. Through this, heat generated in high heat dissipation components is immediately moved upward by convection, thereby suppressing the damage of components due to high temperature. | 06-28-2012 |
20130271077 | CHARGE APPARATUS AND ELECTRIC VEHICLE INCLUDING THE SAME - A charging apparatus and an electric vehicle including the same are disclosed. The charging apparatus includes a rectifier to rectify input alternating current (AC) power in a charging mode, an interleaved buck-boost converter to convert the rectified power into direct current (DC) power to supply the converted DC power to a battery, the interleaved buck-boost converter including a plurality of buck-boost converters, and a converter controller to control the interleaved buck-boost converter, wherein a first buck-boost converter of the interleaved buck-boost converter includes a first buck switching element connected to the rectifier, a first boost switching element, an inductor connected between the first buck switching element and the first boost switching element, a first diode connected in parallel between the first buck switching element and the inductor, and a second diode connected between the first boost switching element and an output of the interleaved buck-boost converter. | 10-17-2013 |
Patent application number | Description | Published |
20090174307 | FLUORESCENT MIXTURE FOR FLUORESCENT LAMP, FLUORESCENT LAMP, BACKLIGHT ASSEMBLY HAVING THE SAME AND DISPLAY DEVICE HAVING THE SAME - A fluorescent lamp includes a lamp body, a fluorescent layer and a discharge electrode. The lamp body has a discharge space in which ultraviolet light is generated. The fluorescent layer is formed on an inner surface of the lamp body to change the ultraviolet light into visible light. The discharge electrode is on an end portion of the lamp body to apply a voltage to the discharge space. A ratio of intensities of the visible light at wavelengths of about 545 nm and about 516 nm is about 1.32:1 to about 1.71:1. Therefore, color reproducibility and luminance may be improved. | 07-09-2009 |
20090256480 | LAMP AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - A lamp and a liquid crystal display including the lamp, the lamp including a lamp tube into which a discharge gas is injected, an internal electrode portion disposed at each of a first end and a second end at an inner side of the lamp tube, an electrode lead connected to each of the internal electrode portions and extending to an exterior side of the lamp tube, and a transparent cap disposed on outer surface of each of the first end and the second end of the lamp tube. | 10-15-2009 |
20090284949 | OPTICAL ELEMENT, LIGHT-EMITTING DEVICE HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - An optical element includes a light-transmitting structure and a first reflection-prevention layer. The light-transmitting structure has a first surface and a second surface facing the first surface. The first reflection-prevention layer includes a plurality of first light-refractive index buffering particles deposited on the first surface such as the concentration of the particles decreases as the distance from the first surface increases. The first reflection-prevention layer decreases the variation of a light-refractive index from the light-transmitting structure to an air layer to decrease the light reflectance of the first surface. Therefore, the light transmittance of the light-transmitting structure is increased due to the reflection-prevention layer formed on a surface of the light-transmitting structure, so that luminance may be enhanced. Moreover, the reflection-prevention layer may enhance the resistance of the light-transmitting structure to external impacts. | 11-19-2009 |
20100201718 | LIGHT EMITTING LAMP, BACKLIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - A light emitting lamp, a backlight assembly and a display device including the same are provided. The light emitting lamp includes a lamp tube longitudinally extended along an extension line, and a plurality of set electrodes disposed on a periphery of the lamp tube and along the extension line. The periphery of the lamp tube is divided into a first region and a second region by a plane including the extension line, and each of the set electrodes includes a first electrode disposed on the first region and a second electrode disposed on the second region. | 08-12-2010 |
20110039472 | METHOD OF MANUFACTURING A LAMP - Disclosed is a method of manufacturing a lamp. The lamp is formed by arranging lamp electrodes in a lamp body provided therein with a discharge space and a fluorescent material. A first conductive layer is formed on a base conductor and a second conductive layer is formed on the first conductive layer by allowing the first conductive layer to react with a reaction solution including a solvent and metallic salt, thereby forming the lamp electrodes. | 02-17-2011 |
20110157916 | LIGHT EMITTING DEVICE AND DISPLAY DEVICE HAVING THE SAME - A display device includes a display panel and a light emitting device to supply light to the display panel. The light emitting device includes a light emitting element emitting a first light and a fluorescent layer receiving the first light, transmitting a portion of the first light, converting a remaining portion of the first light to a second light having a wavelength range different from the first light, and emitting the second light. The second light emitted by the fluorescent layer has a full width at half maximum equal to or larger than 110 nanometers (nm) and a light emission spectrum having a peak wavelength within a wavelength range of about 530 nm to about 560 nm. The second light has a light emission intensity corresponding to 10 to 30 percent of a peak light emission intensity of the first light. | 06-30-2011 |
Patent application number | Description | Published |
20090014497 | APPARATUS FOR WELDING UPPER AND LOWER PLATES OF METAL SEPARATING PLATE OF FUEL CELL - Provided is an apparatus for welding upper and lower plates of a metal separating plate of a fuel cell which can simplify the welding of a separating plate, improve welding and watertight performance, and prevent the thermal deformation of a separating plate. The apparatus includes a supporting unit which is disposed below a main body and on which the metal separating plate is safely seated; a friction stir unit which faces the supporting unit, and welds the metal separating plate using a friction stir welding method; and a temperature control unit which is disposed either at the friction stir unit or at the supporting unit, measures a temperature of at least a portion of the metal separating plate during the welding, and controls an operation of the friction stir unit so that the temperature of the metal separating plate can be maintained within a predetermined range. | 01-15-2009 |
20140166628 | TWIN SPOT WELDING APPARATUS - A twin spot welding apparatus includes a fixed welder in a fixed frame on a top of which a mounting unit of a robot arm is integrally formed, a guide plate mounted on the fixed frame, an angle control plate movably installed in the guide plate, a servo actuator mounted on the fixed frame to move the angle control plate on the guide plate, and a moving welder formed so that a slope of the moving welder may be controlled by an angle control unit on the angle control plate and formed in a moving frame so that, when the servo actuator and the angle control unit are operated, movement from the fixed welder and the slope of the moving welder are controlled so that a pitch and a slope between welding points of the fixed welder and the moving welder vary. | 06-19-2014 |
20140183167 | WELDING DEVICE FOR PANEL SHEETS AND WELDING METHOD FOR THE SAME - A method of welding panels overlapping each other includes a one-directional clamping step that performs one-directional clamping by positioning electrodes of a pair of one-directional spot welding guns with respect to an upper panel and a lower panel overlapping each other, a pressure welding step that forms a plurality of pressure welding portions in a zero gap status by pressure-welding the upper panel to the lower panel in a temporary welding status, by pressing and supplying electricity to the upper panel with the electrodes of the one-directional spot welding guns, plasma spot step that forms a molten portion between the pressure welding portions by performing plasma welding on the pressure welding portions with a plasma welding machine, and a cooling step that forms a welded portion by overlapping the pressure welding portions and the molten portion between the upper panel and the lower panel by cooling the molten portion. | 07-03-2014 |
20140298636 | JOINT GUARANTEE SYSTEM FOR VEHICLE ASSEMBLY AND CONTROL METHOD OF THE SAME - A system and method for vehicle assembly may include a vehicle body sensing unit sensing positions of vehicle bodies conveyed at regular intervals along a vehicle body convey line, a tool sensing unit disposed on a fastening tool for assembling parts to a vehicle body and sensing movement displacement of the fastening tool with respect to an origin of the fastening tool, a tool controller that transmits a fastening torque value of a predetermined part to the fastening tool in accordance with the movement displacement of the fastening tool and records an accumulated value of the movement displacement of the fastening tool, and a main controller that stores a result value of fastening the part, corresponding to a vehicle number of the vehicle body, on the basis of the accumulated value of the movement displacement of the fastening tool and positional information of the vehicle body. | 10-09-2014 |
20150018999 | JOINT GUARANTEE SYSTEM FOR VEHICLE ASSEMBLY AND CONTROL METHOD OF THE SAME - A joint guarantee system for vehicle assembly is applied to a vehicle assembly line that assembles an assembling object to a vehicle carried through on a conveyer line as an assembling element, and includes a vehicle detector that detects the vehicle entering the conveyer line, tool detectors disposed along the conveyer line that detect a position of an assembling tool on the conveyer line, an inertial sensor module installed in the assembling tool that detects an angle and a displacement of the assembling tool for an assembling point of the vehicle and the assembling object, a tool controller that applies control signals corresponding to a predetermined assembling point of the vehicle and the assembling object, a kind of assembling element, and assembling torque of the assembling tool, to the assembling tool, and a main controller that processes and stores the above information. | 01-15-2015 |
20150045929 | JOINT GUARANTEE SYSTEM FOR VEHICLE ASSEMBLY AND CONTROL METHOD OF THE SAME - A fastening guarantee system for vehicle assembly is used in a vehicle assembly line for assembling a fastening object to a vehicle body conveyed on a conveyer line with fastening members. The system may include i) a vehicle body sensing unit that senses a vehicle body entering the conveyer line and the distance to the vehicle body, ii) a plurality of tool sensing units at predetermined intervals along the conveyer line that senses the position of a fastening tool, iii) an inertia sensor module that senses the angle and the displacement of the fastening tool, iv) a tool controller, and v) the fastening tool. | 02-12-2015 |