Patent application number | Description | Published |
20090246891 | MARK FORMING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A mark forming method includes forming a first mask layer on a semiconductor substrate; forming at least three first patterns having periodicity on the first mask layer; forming a second mask layer on the first mask layer having the first patterns formed thereon; and forming an opening in the second mask layer to cover at least two patterns on ends of the at least three first patterns, thereby forming a mark composed of exposed ones of the first patterns. | 10-01-2009 |
20090305165 | WAFER EXPOSING METHOD, EUV EXPOSING APPARATUS, AND EB EXPOSING APPARATUS - A wafer exposing method comprising EUV-exposing a product area, which is formed as a product chip, on a wafer and EB-exposing a peripheral area on the wafer, wherein the EB exposure of a wafer different from the wafer being EUV-exposed is performed while the EUV exposure of the wafer is performed. | 12-10-2009 |
20100021826 | REFLECTIVE MASK, MANUFACTURING METHOD FOR REFLECTIVE MASK, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A reflective mask comprising: a reflective layer that is arranged on a surface on a side on which EUV light is irradiated and reflects the EUV light; a buffer layer containing Cr that is arranged on a side of the reflective layer on which the EUV light is irradiated and covers an entire surface of the reflective layer; and a non-reflective layer that is arranged on a side of the buffer layer on which the EUV light is irradiated and in which an absorber that absorbs the irradiated EUV light is arranged in a position corresponding to a mask pattern to be reduced and transferred onto a wafer. | 01-28-2010 |
20100075443 | TEMPLATE INSPECTION METHOD AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat substrate, filling the first fluid into a pattern of the template, and by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the substrate, wherein a difference between an optical constant of the first fluid and an optical constant of the template is larger than a difference between an optical constant of air and the optical constant of the template. | 03-25-2010 |
20100252188 | TEMPLATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A template formed of an optically-transparent material according to an embodiment includes a contact surface which contacts a resist material, a concave portion for resist pattern formed on the contact surface in which the resist material is filled and cured so as to form a resist pattern part, and a concave portion for alignment mark formed on the contact surface which is used for an optical alignment of the template, includes an opening and a bottom portion and has a shape that an area of the opening is larger than that of the bottom portion or a shape that a depth thereof is deeper than that of the concave portion for resist pattern. | 10-07-2010 |
20110229988 | PATTERN FORMING METHOD, PROCESSING METHOD, AND PROCESSING APPARATUS - According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent. | 09-22-2011 |
20120040293 | REFLECTIVE MASK, MANUFACTURING METHOD FOR REFLECTIVE MASK, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A reflective mask comprising: a reflective layer that is arranged on a surface on a side on which EUV light is irradiated and reflects the EUV light; a buffer layer containing Cr that is arranged on a side of the reflective layer on which the EUV light is irradiated and covers an entire surface of the reflective layer; and a non-reflective layer that is arranged on a side of the buffer layer on which the EUV light is irradiated and in which an absorber that absorbs the irradiated EUV light is arranged in a position corresponding to a mask pattern to be reduced and transferred onto a wafer. | 02-16-2012 |
20120045854 | INSPECTING METHOD, TEMPLATE MANUFACTURING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING METHOD, AND INSPECTING SYSTEM - According to one embodiment, a template for manufacturing a memory cell array comprising a relievable area and a redundant area replaceable with the relievable area is to be inspected. First, based on a defect position of a defect-detected template and position information on a relievable area, a decision is made as to whether the detected defect is positioned within the relievable area. A decision is made as to whether the number of defect-detected relievable areas exceeds the preset permissible number. When the detected defect is positioned outside the relievable area or when the number of defect-detected relievable areas exceeds the permissible number, a notification that the template has failed the inspection is output. | 02-23-2012 |
20120072003 | IMPRINTING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING METHOD AND DROP RECIPE CREATING METHOD - According to one embodiment, a defect inspection is made on a pattern transferred on substrates to be processed, thereby generating defect image data. When a defect is detected, a defect contour is extracted from the generated image data, the extracted defect contour is reflected on a pattern of the semiconductor integrated circuit and a first drop recipe is generated based on the pattern data on which the defect contour is reflected. A drop recipe used for applying a hardening resin material is updated with the generated first drop recipe. | 03-22-2012 |
20120129279 | IMPRINTING METHOD, IMPRINTING APPARATUS AND MEDIUM - According to one embodiment, there is provided an imprinting method for applying a first hardening resin material on a substrate to be processed and transferring a pattern of a semiconductor integrated circuit formed on a template onto the substrate to be processed on which the first hardening resin material is applied, wherein a second hardening resin material with higher separability than the first hardening resin material is applied on at least part of the outer periphery of an area in which the pattern is formed by one transferring. | 05-24-2012 |
20120131056 | DROP RECIPE CREATING METHOD, DATABASE CREATING METHOD AND MEDIUM - According to one embodiment, a plurality of test drop recipes are first created based on design data on a semiconductor integrated circuit. Based on a defect inspection result of a pattern of a hardening resin material, which is formed by pressing a template on which patterns of the semiconductor integrated circuit are formed onto the hardening resin material applied to a substrate to be processed by use of the test drop recipes, a drop recipe with least defects is selected per press position on the substrate to be processed from the test drop recipes. The selected drop recipes for respective press positions are collected per functional circuit block configuring the semiconductor integrated circuit, thereby to generate a drop recipe creation assistant database. | 05-24-2012 |