Patent application number | Description | Published |
20080282775 | CHAMBER SEALING VALVE - According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance. | 11-20-2008 |
20110019378 | COMPOSITE MICRO-CONTACTS - Composite microelectronic contacts are provided in embodiments. These may include one or more arrays of isolated conductive tines coupled to and by isolation carriers. These carriers may serve to space the conductive tines apart and to couple the isolated tines together after the tines are no longer ganged together. The isolation carriers may comprise injection molded polymers as well as stamped materials. The isolation carriers may also contain locking tabs and recesses and seating plane stops. | 01-27-2011 |
20120200993 | INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES - A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad. | 08-09-2012 |
20140082915 | INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES - A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad. | 03-27-2014 |
20140098474 | LOCKING HINGE ASSEMBLY FOR ELECTRONIC DEVICE - In one embodiment an electronic device comprises a housing having a first section and a second section comprising a display coupled to the first section by a hinge assembly, a rotation control assembly to control rotation of the hinge assembly, and a controller to activate the rotation control assembly in response to detection of a force condition at a second section of the housing of an electronic device. Other embodiments may be described. | 04-10-2014 |
20140162473 | MOBILE INDEPENDENT LOADING MECHANISM - A mobile device assembly comprising a land grid array (LGA) socket configured to couple with a board of a mobile device. The LGA socket may be configured to couple with a component of the mobile device. A mobile independent loading mechanism (ILM) may at least partially overlap the component and couple with the board of the mobile device via one or more fasteners. By coupling with the board of the mobile device, the mobile ILM may therefore apply pressure to the component, securely holding the component to the LGA socket. | 06-12-2014 |
20150277488 | HINGE HAVING MULTIPLE DEGREES OF FREEDOM - Techniques for forming a hinge are described herein. The hinge is to couple a first housing of a computing device and a second housing of the computing device. The hinge is to cause the first housing to have three degrees of freedom in movement from the second housing. | 10-01-2015 |
20150277491 | MAGNETIC ATTACHMENT MECHANISM FOR AN ELECTRONIC DEVICE - Particular embodiments described herein provide for an electronic device, such as a notebook computer, laptop, or tablet that includes a circuit board coupled to a plurality of electronic components (which may include any type of components, elements, circuitry, etc.). One particular example implementation of a docking base comprises a base housing including at least one alignment pin disposed within the base housing. Each of the at least one alignment pin is configured to engage a corresponding alignment pin receptacle of a device housing of an electronic device. The base housing further includes an attachment mechanism coupled to the at least one first alignment pin, wherein the attachment mechanism is configured to cause the at least one first alignment pin to extend at least partially from the base housing when the device housing is within a predetermined proximity of the base housing. | 10-01-2015 |