Rudaz
Daniel Rudaz, La Tour-De-Peilz CH
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20160084531 | Heat Flow Sensor - The present invention relates to a heat exchanger comprising a plurality of exchange tubes ( | 03-24-2016 |
Denis Rudaz, Prevessin-Moens FR
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20120057434 | TIMEPIECE FURNISHED WITH A DEVICE FOR DISPLAYING DETERMINED TIME PERIODS - This device for displaying time periods comprises a display element (A), an indicator component ( | 03-08-2012 |
20130003507 | DEVICE FOR RESETTING TO A PREDETERMINED POSITION AN INDICATOR MEMBER INDICATIVE OF A PARAMETER CONNECTED WITH TIME | 01-03-2013 |
Denis Rudaz, Segny FR
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20130028056 | BALANCE WHEEL ASSEMBLY WITH OPTIMIZED PIVOTING - A balance wheel for timepiece movement, which obeys the following condition: D | 01-31-2013 |
20140177397 | TIMEPIECE COMPRISING A WINDING MECHANISM AND AT LEAST ONE MECHANISM FOR CORRECTING AT LEAST ONE INDICATOR MEMBER - The invention relates to a horological device, in particular a horological movement or timepiece, comprising a winding mechanism and at least one mechanism for correcting at least one indicator member. According to the invention, the aforementioned mechanisms can be actuated by a control stem that can occupy at least two axial positions, each corresponding to the actuation of one of the mechanisms, said control stem (T) comprising: a winder pinion ( | 06-26-2014 |
20140321247 | TIME PIECE CAPABLE OF DISPLAYING TWO TIME ZONES | 10-30-2014 |
Nicolas Rudaz, Veyras CH
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20130114876 | METHOD FOR GENERATING A SECURITY BI-LEVEL IMAGE FOR A BANKNOTE - The present invention proposes a method for generating a security bi-level image used to form one of the inks of a banknote, said image comprising an original bi-level image and a security pattern, said security pattern being obtained in the spatial domain by the inverse Fourier transform of the combination in the frequency domain between the Fourier transform of an auxiliary image and a two-dimensional sweep, said two-dimensional sweep being a circularly symmetric, two-dimensional pattern created by sweeping a self-similar, one-dimensional function along a 360-degree arc, such as said security pattern being detectable from the maximum value of the cross-correlation of said one-dimensional function with the Fourier transform of one line of said banknote, said method comprising the step of:—determining a distance map of the original bi-level image,—generating a merged image by linearly interpolating at least a part of said distance map with said security pattern,—thresholding the merged image to obtain the security bi-level image,—applying the security bi-level image on a support. | 05-09-2013 |
Serge L. Rudaz, Sunnyvale, CA US
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20110297979 | PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE - In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure. | 12-08-2011 |
20130252358 | PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE - In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure. | 09-26-2013 |
Serge Laurent Rudaz, Sunnyvale, CA US
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20100207140 | COMPACT MOLDED LED MODULE - A method of forming a light emitting diode (LED) module molds an array of lens support frames over an array of connected lead frames. LEDs are bonded to the lead frame contacts within the support frames. Molded lenses are then affixed over each support frame, and the lead frames are diced to create individual LED modules. In another embodiment, the lenses are molded along with the support frames to create unitary pieces, and the support frames are affixed to the lead frames in the array of connected lead frames. In another embodiment, no lenses are used, and cups are molded with the lead frames so that the LED module is formed solely of the unitary lead frame/cup and the LED. Since each LED enclosure is formed of only one or two separate pieces, and the modules are fabricated on an array scale, the modules can be made very small and simply. | 08-19-2010 |
20130248913 | HIGHLY REFLECTIVE COATING ON LED SUBMOUNT - A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer. | 09-26-2013 |