Patent application number | Description | Published |
20090011553 | THERMALLY STABLE BiCMOS FABRICATION METHOD AND BIPOLAR JUNCTION TRANSISTOR FORMED ACCORDING TO THE METHOD - A method for forming BiCMOS integrated circuits and structures formed according to the method. After forming doped wells and gate stacks for the CMOS devices and collector and base regions for the bipolar junction transistor, an emitter layer is formed within an emitter window. A dielectric material layer is formed over the emitter layer and remains in place during etching of the emitter layer and removal of the etch mask. The dielectric material layer further remains in place during source/drain implant doping and activation of the implanted source/drain dopants. The dielectric material layer functions as a thermal barrier, to limit out-diffusion of the emitter dopants during the activation step. | 01-08-2009 |
20090108359 | A SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREFOR - The present invention provides a semiconductor device, and an integrated circuit including the semiconductor device. The semiconductor device, in one embodiment, includes: (1) a gate structure located over a substrate, the gate structuring including a gate dielectric and gate electrode; (2) source/drain regions located within the substrate proximate the gate structure, (3) a multi layer etch stop located over the substrate, wherein the etch stop has a first insulative layer and a second silicon-rich nitride layer located over the first insulative layer, (4) a dielectric layer located over the etch stop, the dielectric layer having an opening formed therein that extends through at least a portion of the multi layer etch stop, (5) a conductive plug located within the opening and electrically contacting the gate electrode and one of the source/drain regions, and (6) an insulative spacer located between the conductive plug and the second silicon-rich nitride layer. | 04-30-2009 |
20090127651 | ROBUST SHALLOW TRENCH ISOLATION STRUCTURES AND A METHOD FOR FORMING SHALLOW TRENCH ISOLATION STRUCTURES - In a semiconductor substrate, a shallow trench isolation structure having a dielectric material disposed in voids of a trench-fill material and a method for forming the shallow trench isolation structure. The voids may be formed during a wet clean process after the dielectric material is formed in the trench. A conformal silicon nitride layer is formed over the substrate and in the voids. After removal of the silicon nitride layer, the voids are at least partially filled by the silicon nitride material. | 05-21-2009 |
20090139962 | METHODS AND SYSTEMS FOR CONTROLLING ACCUMULATION OF ELECTRICAL CHARGE DURING SEMICONDUCTOR ETCHING PROCESSES - A method and system are provided for controlling the accumulation of electrical charge during a semiconductor plasma etching process performed in a plasma etching chamber. The bias voltage supplied to the plasma etching chamber is modulated by a bias power modulation circuit to control the accumulation of electrical charge and to force the accumulated electrical charge to be periodically discharged at a controlled rate of discharge that prevents the wafer from being damaged. | 06-04-2009 |
20100273301 | THERMALLY STABLE BICMOS FABRICATION METHOD AND BIPOLAR JUNCTION TRNASISTORS FORMED ACCORDING TO THE METHOD - A method for forming BiCMOS integrated circuits and structures formed according to the method. After forming doped wells and gate stacks for the CMOS devices and collector and base regions for the bipolar junction transistor, an emitter layer is formed within an emitter window. A dielectric material layer is formed over the emitter layer and remains in place during etching of the emitter layer and removal of the etch mask. The dielectric material layer further remains in place during source/drain implant doping and activation of the implanted source/drain dopants. The dielectric material layer functions as a thermal barrier, to limit out-diffusion of the emitter dopants during the activation step. | 10-28-2010 |
Patent application number | Description | Published |
20080237642 | Method to Reduce Boron Penetration in a SiGe Bipolar Device - The invention, in one aspect, provides a method of manufacturing a semiconductor device. This aspect includes forming gate electrodes in a non-bipolar transistor region of a semiconductor substrate, placing a polysilicon layer over the gate electrodes in the non-bipolar transistor region and over the semiconductor substrate within a bipolar transistor region. A protective layer is formed over the polysilicon layer. The protective layer has a weight percent of hydrogen that is less than about 9% and is selective to silicon germanium (SiGe), such that SiGe does not form on the protective layer. This aspect further includes forming emitters for bipolar transistors in the bipolar transistor region, including forming a SiGe layer under a portion of the polysilicon layer. | 10-02-2008 |
20090050977 | METHOD TO REDUCE BORON PENETRATION IN A SiGe BIPOLAR DEVICE - The invention, in one aspect, provides a method of manufacturing a semiconductor device. This aspect includes forming gate electrodes in a non-bipolar transistor region of a semiconductor substrate, placing a polysilicon layer over the gate electrodes in the non-bipolar transistor region and over the semiconductor substrate within a bipolar transistor region. A protective layer is formed over the polysilicon layer. The protective layer has a weight percent of hydrogen that is less than about 9% and is selective to silicon germanium (SiGe), such that SiGe does not form on the protective layer. This aspect further includes forming emitters for bipolar transistors in the bipolar transistor region, including forming a SiGe layer under a portion of the polysilicon layer. | 02-26-2009 |
20090236668 | METHOD TO IMPROVE WRITER LEAKAGE IN SiGe BIPOLAR DEVICE - The invention, in one aspect, provides a method for fabricating a semiconductor device, which includes conducting an etch through an opening in an emitter layer to form a cavity from an underlying oxide layer that exposes a doped tub. A first silicon/germanium (SiGe) layer, which has a Ge concentration therein, is formed within the cavity and over the doped tub by adjusting a process parameter to induce a strain in the first SiGe layer. A second SiGe layer is formed over the first SiGe layer, and a capping layer is formed over the second SiGe layer. | 09-24-2009 |
20100065920 | METHOD TO REDUCE COLLECTOR RESISTANCE OF A BIPOLAR TRANSISTOR AND INTEGRATION INTO A STANDARD CMOS FLOW - The invention, in one aspect, provides a method for fabricating a semiconductor device. In one aspect, the method provides for a dual implantation of a tub of a bipolar transistor. The tub in bipolar region is implanted by implanting the tub through separate implant masks that are also used to implant tubs associated with MOS fabricate different voltage devices in a non-bipolar region during the fabrication of MOS transistors. | 03-18-2010 |
20100102418 | BIPOLAR DEVICE HAVING IMPROVED CAPACITANCE - The invention, in one aspect, provides a semiconductor device that comprises a collector located in a semiconductor substrate and an isolation region located under the collector, wherein a peak dopant concentration of the isolation region is separated from a peak dopant concentration of the collector that ranges from about 0.9 microns to about 2.0 microns. | 04-29-2010 |
20100264478 | METHOD TO REDUCE TRENCH CAPACITOR LEAKAGE FOR RANDOM ACCESS MEMORY DEVICE - A method is provided that includes forming a trench isolation structure in a dynamic random memory region (DRAM) of a substrate and patterning an etch mask over the trench structure to expose a portion of the trench structure. A portion of the exposed trench structure is removed to form a gate trench that includes a first corner formed by the substrate and a second corner formed by the trench structure. The etch mask is removed and the first corner of the gate trench is rounded to form a rounded corner. This is followed by the formation of an oxide layer over a sidewall of the gate trench, the first rounded corner, and the semiconductor substrate adjacent the gate trench. The trench is filled with a gate material. | 10-21-2010 |
20110312146 | BIPOLAR DEVICE HAVING BURIED CONTACTS - This disclosure, in one aspect, provides a method of manufacturing a semiconductor device that includes forming a collector for a bipolar transistor within a semiconductor substrate, forming a base within the collector, forming a patterned isolation layer over the collector and base, forming an emitter layer over the patterned isolation layer, forming an isolation layer over the emitter layer, patterning the patterned isolation layer, the emitter layer and the isolation layer to form at least one emitter structure having an isolation region located on a sidewall thereof, and forming a buried contact in the collector to a depth sufficient to adequately contact the collector. | 12-22-2011 |