Patent application number | Description | Published |
20100149622 | DIGITAL MICRO-MIRROR DEVICE - A digital micro-mirror device comprising an array of micro-mirror assemblies positioned on a substrate. Each micro-mirror assembly comprises: a mirror spaced apart from the substrate; a stem supporting the mirror; and first and second electrodes positioned on either side of the stem. The stem is comprised of a resiliently flexible material, such that the mirror can tilt either towards the first electrode or towards the second electrode by an electrostatic force. The digital micro-mirror device may be used in data projectors and the like. | 06-17-2010 |
20100149623 | METHOD OF FABRICATING MICRO-MIRROR ASSEMBLY - A method of fabricating a micro-mirror assembly. The method comprises the steps of: (a) forming a pair of electrodes spaced apart on a surface of a substrate; (b) depositing a layer of sacrificial material over the electrodes and the substrate; (c) defining a stem opening in the sacrificial material so as to form a scaffold; (d) depositing a layer of resiliently flexible material over the scaffold; (e) depositing a metal layer over the flexible layer; (f) etching through the metal layer and the flexible layer to define an individual micro-mirror; and (g) removing the sacrificial material to provide the micro-mirror assembly. The method produces a micro-mirror assembly with minimal number of MEMS fabrication steps. | 06-17-2010 |
20110018935 | PRINTHEAD HAVING POLYSILSESQUIOXANE COATING ON INK EJECTION FACE - A printhead having an ink ejection face coated with a hydrophobic polymeric material. The polymeric material is comprised of a polysilsesquioxane, such as poly(methylsilsesquioxane) or poly(phenylsilsesquioxane). The printhead is compatible with various printhead maintenance operations requiring contact with the ink ejection face. | 01-27-2011 |
20110018936 | PRINTHEAD HAVING POLYMER INCORPORATING NANOPARTICLES COATED ON INK EJECTION FACE - A printhead having an ink ejection face, wherein at least part of the ink ejection face is coated with a polymeric material. The polymeric material is comprised of a polymerized siloxane incorporating nanoparticles. The printhead may be compatible with various printhead maintenance operations, ink characteristics and inkjet nozzle types. | 01-27-2011 |
20110018937 | PRINTHEAD HAVING INK EJECTION FACE COMPLEMENTING INK OR OTHER FEATURES OF PRINTHEAD - An inkjet printhead for ejection of an ejectable fluid. The printhead has an ink ejection face coated with a polymeric material incorporating nanoparticles. The nanoparticles impart predetermined characteristics to the ink ejection face, which complement an inherent property of the ejectable fluid, a printhead maintenance regime associated with the printhead or a type of nozzle actuator. | 01-27-2011 |
20110018939 | INKJET PRINTHEAD ASSEMBLY HAVING BACKSIDE ELECTRICAL CONNECTION - An inkjet printhead assembly comprising an ink supply manifold; printhead integrated circuits and a connector film for supplying power to drive circuitry in the printhead integrated circuits. Each printhead integrated circuit has a frontside comprising the drive circuitry and inkjet nozzle assemblies, a backside attached to the ink supply manifold, and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. A connection end of the connector film is sandwiched between part of the ink supply manifold and the printhead integrated circuits. | 01-27-2011 |
20110018940 | PRINTHEAD INTEGRATED CIRCUIT CONFIGURED FOR BACKSIDE ELECTRICAL CONNECTION - A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry. | 01-27-2011 |
20110018941 | PRINTHEAD INTEGRATED COMPRISING THROUGH-SILICON CONNECTORS - A printhead integrated circuit comprising a silicon substrate defining a frontside and a backside, inkjet nozzle assemblies positioned at the frontside, drive circuitry for supplying power to the inkjet nozzle assemblies and through-silicon connectors extending from the frontside towards the backside. The through-silicon connectors provides electrical connections between the drive circuitry and corresponding integrated circuit contacts. The integrated circuit contacts are positioned for connection to a backside-mounted connector film supplying power to the drive circuitry. | 01-27-2011 |
20110020964 | METHOD OF FABRICATING INKJET PRINTHEAD ASSEMBLY HAVING BACKSIDE ELECTRICAL CONNECTIONS - A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections. | 01-27-2011 |
20110020965 | METHOD OF FABRICATING PRINTHEAD INTEGRATED CIRCUIT WITH BACKSIDE ELECTRICAL CONNECTIONS - A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads. | 01-27-2011 |
20110047781 | METHOD OF FABRICATING CRACK-RESISTANT THERMAL BEND ACTUATOR - A method of fabricating a thermal bend actuator comprises the steps of: (a) depositing a first layer comprised of silicon nitride onto a sacrificial scaffold; (b) depositing a second layer comprised of silicon dioxide onto the first layer; (c) depositing an active beam layer onto the second layer; (d) etching the active beam layer, the first layer and the second layer to define the thermal bend actuator; and (e) releasing the thermal bend actuator by removing the sacrificial scaffold. | 03-03-2011 |
20110050806 | CRACK-RESISTANT THERMAL BEND ACTUATOR - A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam comprises a first layer comprised of silicon nitride and a second layer comprised of silicon dioxide. The second layer is sandwiched between the first layer and the active beam to provide thermal insulation for the first layer. | 03-03-2011 |