| Patent application number | Description | Published |
|---|
| 20100012372 | Wire Beam - Manufacturing a wire beam ( | 01-21-2010 |
| 20100021639 | METHOD AND APPARATUS FOR MAKING PARTIALLY COATED PRODUCTS - Method and system for making a partially coated product ( | 01-28-2010 |
| 20100119701 | Method For Preparing a Conductive Strain Sensor on the Surface of a Device - The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of
| 05-13-2010 |
| 20100143727 | Method for Partially Metallizing a Product - Method for metallizing a product ( | 06-10-2010 |
| 20100215974 | ELECTROLESS PROCESS FOR DEPOSITING A METAL ON A NON-CATALYTIC SUBSTRATE - The invention provides an electroless process for depositing a metal on an essentially catalyst-free substrate, which process comprises the steps of: (a)providing an essentially catalyst-free substrate; and (b) exposing said essentially catalyst-free substrate to an electroless solution to deposit the metal on the substrate, which solution comprises metal ions and a reducing agent for reducing the metal ions into the metal, whereby at least the surface of the substrate has a temperature or is heated to a temperature (T1) which is higher than the temperature (T2) of the solution. | 08-26-2010 |
| 20100247907 | PROCESS FOR PREPARING A MOULDED PRODUCT - The invention provides a process for preparing a moulded product on which or in which a layer of a metal or alloy thereof is applied, in which process use is made of a mould, which process comprises a moulding step and a metallising step, wherein the moulding and metallising step are both carried out in the mould, wherein said metallising step comprises can electroless process. The invention further relates to a device comprising the moulded product obtained by said process. | 09-30-2010 |
| 20110017495 | METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT - The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step. (b); and (d) depositing by means of an electroless process a layer of a second metal or alloy thereof on the distribution of the particles of the first metal or alloy thereof as obtained in step (c), whereby the inhibiting material that is still present on the substrate after step (b) locally inhibits the second metal or alloy thereof to be deposited on the first metal or alloy thereof, ensuring that the second metal or alloy thereof will selectively be deposited on the particles of the first metal or alloy thereof that are distributed on the pattern obtained in step (b). | 01-27-2011 |
| 20110240350 | PROVIDING A PLASTIC SUBSTRATE WITH A METALLIC PATTERN - The invention is directed to a method of providing a plastic substrate with a metallic pattern and to a plastic substrate with a metallic pattern obtainable by said method. The method of the invention comprises i) replicating a pattern of recesses and protrusions on a plastic substrate by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate with recesses and protrusions; ii) removing said stamp from said substrate; iii)—applying a layer of seed material capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate in a selective pattern at least in the recesses of said plastic substrate to yield a substrate wherein said seed material remains selectively in the recesses of said substrate; and thereafter iv) using said seed material to initiate a metal deposition process. | 10-06-2011 |
