Patent application number | Description | Published |
20080284868 | IMAGING ELEMENT - Imaging elements are provided. An imaging element has a wireless communication circuit adapted to detect a wireless communication signal and to generate a control signal; an illumination circuit having an illumination element, the illumination circuit being adapted so that the illumination element generates light at an intensity that is based upon the control signal and a body containing the wireless communication circuit and the light source, wherein the body occupies a space that is less than about five cubic millimeters. The imaging element can also incorporate radiation sensors and can provide wireless signals indicative of sampled radiation. | 11-20-2008 |
20090078204 | DEPOSITION SYSTEM FOR THIN FILM FORMATION - An apparatus for maintaining the alignment or positional relationship between at least two coating modules in an ALD system, the apparatus comprising a plurality of coating modules in a coating section, at least a first bar and a second bar for supporting the coating modules, and at least a first bar mounting structure and a second bar mounting structure for supporting the bars, wherein each of the coating modules are supported by the first bar and the second bar, and wherein the combination of the at least two coating modules and the first bar and the second bar define a coating section profile for the output faces of the coating modules. Also disclosed is a process for making such apparatus. | 03-26-2009 |
20090081366 | DELIVERY DEVICE FOR DEPOSITION - A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates, superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed. | 03-26-2009 |
20090081885 | DEPOSITION SYSTEM FOR THIN FILM FORMATION - A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material, wherein one or more of the gas flows provides a pressure that at least contributes to the separation of the surface of the substrate from the face of the delivery head. A system capable of carrying out such a process is also disclosed. | 03-26-2009 |
20090081886 | SYSTEM FOR THIN FILM DEPOSITION UTILIZING COMPENSATING FORCES - A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed. | 03-26-2009 |
20090211791 | SUBSTRATE FORMED ON CARRIER HAVING RETAINING FEATURES AND RESULTANT ELECTRONIC DEVICE - A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible substrate. The flexible substrate is provided by deposition or lamination f one or more layers of substrate material onto the carrier. A portion of the substrate is processed to form the electronic device on the processed portion of the substrate. At least the processed portion of the substrate is released from the carrier to provide the flexible substrate having electronic device formed thereon. An electronic device is formed on a flexible substrate in accordance with the method. | 08-27-2009 |
20090217878 | SYSTEM FOR THIN FILM DEPOSITION UTILIZING COMPENSATING FORCES - A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed. | 09-03-2009 |
20090291269 | METHOD FOR CONDITIONING A SUBSTRATE SURFACE FOR FORMING AN ELECTRONIC DEVICE THEREON AND RESULTANT DEVICE - A method for forming an electronic device on a flexible substrate conditions a surface of the flexible substrate to increase its malleability and to provide a conditioned substrate surface. A master surface is impressed against the conditioned substrate surface. The master surface is then released from the conditioned substrate surface, thereby forming a circuit-side surface on the substrate. The electronic device is then formed on the circuit-side surface. The substrate may be supported on a carrier during the method. | 11-26-2009 |
20100071206 | Low cost die release wafer - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be glass with the IC elements grown on the glass. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an intermediate transfer layer. | 03-25-2010 |
20100071930 | SOLVENT SOFTENING TO ALLOW DIE PLACEMENT - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include embedding IC elements onto the receiving substrate upon softening the receiving substrate. Such softening can be performed by using a softening agent and/or an activatable thermal barrier material. In an exemplary embodiment, pockets can be formed in the receiving substrate using the activatable thermal barrier material for the IC assembly. | 03-25-2010 |
20100072490 | LOW COST FLEXIBLE DISPLAY SHEET - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, onto a subsequent flexible surface using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used with an intermediate transfer member. In some embodiments the IC element can be incorporated into a subsequent flexible surface including components for a TV, radiographic detector, sensor array, or any similar product having a requirement to emit, detect, or collect energy. In addition, the IC elements can be RF emitting, or visually emitting. | 03-25-2010 |
20100072594 | LOW COST DIE PLACEMENT - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an SOI (silicon on insulator) wafer and/or an intermediate transfer member. In other embodiments, the release member can be used for a low cost placement of the IC elements in combination with a release wafer. | 03-25-2010 |
20100073166 | LASER ABLATION TO CREATE POCKET FOR DIE PLACEMENT - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and scalably embedding or seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include forming a pocket in the receiving substrate to accommodate the IC elements therein. Such pockets can be formed in the receiving substrate using laser ablation. | 03-25-2010 |
20100075459 | THERMAL BARRIER LAYER FOR INTEGRATED CIRCUIT MANUFACTURE - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and scalably embedding or seating IC elements onto/into a receiving substrate, such as a chip substrate. Preparing of the chip substrate can be performed by depositing or patterning an activatable thermal barrier material on a surface of the substrate. The IC chips are secured on the prepared substrate by activating the thermal barrier material between the chip substrate and IC chips. Securing can include softening of the chip substrate with the activated thermal barrier material to an amount suitable for embedding the IC chips. Securing can also include adhesively bonding the IC chips to the substrate with the activated thermal barrier material in the case of a non-pliable substrate. | 03-25-2010 |
20100128450 | SOLVENT SOFTENING TO ALLOW DIE PLACEMENT - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include embedding IC elements onto the receiving substrate upon softening the receiving substrate. Such softening can be performed by using a softening agent and/or an activatable thermal barrier material. In an exemplary embodiment, pockets can be formed in the receiving substrate using the activatable thermal barrier material for the IC assembly. | 05-27-2010 |
20100129945 | METAL SUBSTRATE HAVING ELECTRONIC DEVICES FORMED THEREON - A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate | 05-27-2010 |
20100129965 | METAL SUBSTRATE HAVING ELECTRONIC DEVICES FORMED THEREON - A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate | 05-27-2010 |
20100136777 | FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES FORMED THEREON - A method of manufacturing an electronic device ( | 06-03-2010 |
20100248423 | DELIVERY DEVICE COMPRISING GAS DIFFUSER FOR THIN FILM DEPOSITION - A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed. | 09-30-2010 |
20110024642 | RADIOGRAPHIC DETECTOR FORMED ON SCINTILLATOR - A projection radiographic imaging apparatus includes a scintillator and an imaging array. The imaging array includes a plurality of pixels formed directly on a side of the scintillator. Each of the pixels includes at least one photosensor and at least one readout element. | 02-03-2011 |
20110068452 | LOW COST DIE PLACEMENT - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an SOI (silicon on insulator) wafer and/or an intermediate transfer member. In other embodiments, the release member can be used for a low cost placement of the IC elements in combination with a release wafer. | 03-24-2011 |
20110097487 | FLUID DISTRIBUTION MANIFOLD INCLUDING BONDED PLATES - A fluid distribution manifold includes a first plate and a second plate. At least a portion of at least the first plate and the second plate define a relief pattern. A metal bonding agent is disposed between the first plate and the second plate such that the first plate and the second plate form a fluid flow directing pattern defined by the relief pattern. | 04-28-2011 |
20110097488 | FLUID DISTRIBUTION MANIFOLD INCLUDING MIRRORED FINISH PLATE - A fluid distribution manifold includes a first plate and a second plate. At least a portion of at least the first plate and the second plate define a relief pattern. At least one of the first plate and the second plate include a mirrored surface finish. A bonding agent is disposed between the first plate and the second plate such that the first plate and the second plate form a fluid flow directing pattern defined by the relief pattern. | 04-28-2011 |
20110097489 | DISTRIBUTION MANIFOLD INCLUDING MULTIPLE FLUID COMMUNICATION PORTS - A fluid conveyance device for thin film material deposition includes a fluid distribution manifold, a primary chamber, and a secondary fluid source. The fluid distribution manifold includes an output face that is connected in fluid communication to the primary chamber. The secondary fluid source is connected in fluid communication to the primary chamber through a plurality of conveyance ports. | 04-28-2011 |
20110097490 | FLUID DISTRIBUTION MANIFOLD INCLUDING COMPLIANT PLATES - A fluid distribution manifold includes a first plate and a second plate. The first plate includes a length dimension, a width dimension, and a thickness that allows the first plate to be deformable over at least one of the length dimension and the width dimension of the first plate. The second plate includes a length dimension, a width dimension, and a thickness that allows the second plate to be deformable over at least one of the length dimension and the width dimension of the second plate. At least a portion of at least the first plate and the second plate define a relief pattern that defines a fluid flow directing path. The first plate and the second plate are bonded together to form a non-planar shape in a height dimension along at least one of the length dimension and the width dimension. | 04-28-2011 |
20110097491 | CONVEYANCE SYSTEM INCLUDING OPPOSED FLUID DISTRIBUTION MANIFOLDS - A fluid conveyance system for thin film material deposition includes a first fluid distribution manifold and a second distribution manifold. The first fluid distribution manifold includes an output face that includes a plurality of elongated slots. The plurality of elongated slots includes a source slot and an exhaust slot. The second fluid distribution manifold includes an output face that includes a plurality of openings. The plurality of openings include a source opening and an exhaust opening. The second fluid distribution manifold is positioned spaced apart from and opposite the first fluid distribution manifold such that the source opening of the output face of the second fluid distribution manifold mirrors the source slot of the output face of the first fluid distribution manifold and the exhaust opening of the output face of the second fluid distribution manifold mirrors the exhaust slot of the output face of the first fluid distribution manifold. | 04-28-2011 |
20110097492 | FLUID DISTRIBUTION MANIFOLD OPERATING STATE MANAGEMENT SYSTEM - A fluid conveyance system for thin film material deposition is provided. A first fluid distribution manifold includes an output face that includes a plurality of elongated slots. The plurality of elongated slots include a source slot and an exhaust slot. A gas source is in fluid communication with the source slot. The gas source is configured to provide a gas to the output face of the distribution manifold. A gas receiving chamber is in fluid communication with the exhaust slot. The gas receiving chamber is configured to collect the gas provided to the output face of the distribution manifold through the exhaust slot. A sensor positioned to sense a parameter of the gas traveling from the gas source to the gas receiving chamber. A controller is connected in electrical communication with the sensor. The controller is configured to modify an operating parameter of the conveyance system based on data received from the sensor. | 04-28-2011 |
20110097493 | FLUID DISTRIBUTION MANIFOLD INCLUDING NON-PARALLEL NON-PERPENDICULAR SLOTS - A fluid conveyance device for thin film material deposition includes a substrate transport mechanism that causes a substrate to travels in a direction. A fluid distribution manifold includes an output face. The output face includes a plurality of elongated slots. At least one of the elongated slots includes a portion that is non-perpendicular and non-parallel relative to the direction of substrate travel. | 04-28-2011 |
20110097494 | FLUID CONVEYANCE SYSTEM INCLUDING FLEXIBLE RETAINING MECHANISM - A fluid conveyance system for thin film material deposition includes a fluid distribution manifold and a substrate transport mechanism. The fluid distribution manifold includes an output face that includes a plurality of elongated slots. The output face of the fluid distribution manifold is positioned opposite a first surface of the substrate such that the elongated slots face the first surface of the substrate and are positioned proximate to the first surface of the substrate. The substrate transport mechanism causes a substrate to travel in a direction and includes a flexible mechanism that contacts a second surface of the substrate in a region that is proximate to the output face of the fluid distribution manifold. | 04-28-2011 |
20110212555 | FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES AND TRACES - A method of manufacturing an electronic device ( | 09-01-2011 |
20110220610 | FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES AND TRACES - A method of manufacturing an electronic device ( | 09-15-2011 |
20120026251 | LIQUID FILM MOVING OVER POROUS CATCHER SURFACE - A printhead includes a jetting module that forms liquid drops travelling along a first path. A deflection mechanism causes selected liquid drops formed by the jetting module to deviate from the first path and begin travelling along a second path. A catcher includes a stationary porous surface. A liquid film flows over the stationary porous surface of the catcher. The catcher is positioned relative to the first path such that the liquid drops travelling along one of the first path and the second path contact the liquid film. | 02-02-2012 |
20120026252 | PRINTING METHOD USING MOVING LIQUID CURTAIN CATCHER - A method of printing is includes providing liquid drops travelling along a first path using a jetting module. A moving liquid curtain is provided using a liquid source. Selected liquid drops are caused to deviate from the first path and begin travelling along a second path using a deflection mechanism such that the liquid drops travelling along one of the first path and the second path contact the liquid curtain in a drop interception region of the liquid curtain. The liquid curtain is collected downstream from the drop interception region using a liquid collection device. | 02-02-2012 |
20120026253 | PRINTING USING LIQUID FILM POROUS CATCHER SURFACE - A method of printing provides liquid drops travelling along a first path using a jetting module. A catcher including a stationary porous surface is also provided. A liquid film is caused to flow over the stationary porous surface of the catcher using a liquid source. Selected liquid drops are caused to deviate from the first path and begin travelling along a second path using a deflection mechanism. The liquid drops travelling along one of the first path and the second path contact the liquid film. | 02-02-2012 |
20120026261 | MOVING LIQUID CURTAIN CATCHER - A printhead includes a jetting module that forms liquid drops travelling along a first path. A deflection mechanism causes selected liquid drops formed by the jetting module to deviate from the first path and begin travelling along a second path. A moving liquid curtain is positioned relative to the first path such that the liquid drops travelling along one of the first path and the second path contact the liquid curtain in a drop interception region of the liquid curtain. A liquid collection device is positioned to collect the liquid curtain downstream from the drop interception region. | 02-02-2012 |
20120219712 | DELIVERY DEVICE FOR DEPOSITION - A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates, superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed. | 08-30-2012 |
20130168462 | DELIVERY DEVICE FOR DEPOSITION - A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates, superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed. | 07-04-2013 |
20140206137 | DEPOSITION SYSTEM FOR THIN FILM FORMATION - A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material, wherein one or more of the gas flows provides a pressure that at least contributes to the separation of the surface of the substrate from the face of the delivery head. A system capable of carrying out such a process is also disclosed. | 07-24-2014 |