Patent application number | Description | Published |
20080259113 | PRINTHEAD ASSEMBLY WITH PRINTHEAD IC TILES - A printhead assembly for a pagewidth printer arrangement includes a channel shaped member. A number of printhead tiles are located in the channel shaped member. Each tile has a printhead integrated circuit (IC) carrier member for receiving a printhead IC and an ink ducting member that mates with the carrier member and defines ink ducts for supplying the printhead IC with ink via the carrier member. | 10-23-2008 |
20080283190 | METHOD OF REMOVING MEMS DEVICES FROM A HANDLE SUBSTRATE - A method of removing MEMS devices ( | 11-20-2008 |
20080283197 | DIE PICKER WITH LASER DIE HEATER - A device for removing MEMS devices ( | 11-20-2008 |
20080283198 | DIE PICKER WITH HEATED PICKING HEAD - A device for removing MEMS devices ( | 11-20-2008 |
20080318352 | METHOD OF BONDING MEMS INTEGRATED CIRCUITS - A method of bonding an integrated circuit to a substrate is provided. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method comprises the steps of: (a) positioning a substrate at a backside of the integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the integrated circuit; and (c) applying a bonding force from the bonding tool, through the film frame tape and the integrated circuit, onto the substrate. | 12-25-2008 |
20090066742 | PRINTHEAD WITH INCREASING DRIVE PULSE TO COUNTER HEATER OXIDE GROWTH - An inkjet printer that has a printhead with an array of ejection devices for ejecting drops of liquid onto a media substrate. Each of the ejection devices having a chamber for holding liquid, a nozzle in fluid communication with the chamber and a heater positioned in the chamber for contact with the liquid such that resistive heating of the heater generates a vapour bubble that ejects a drop of the liquid through the nozzle. The printer also has a controller for receiving print data and generating drive pulses to energize the heaters in accordance with the print data. The controller increases the drive pulse energy during the printhead lifetime. | 03-12-2009 |
20100128090 | Mems Bubble Generator Incorporating Superalloy Heater In Direct Contact With Bubble Formation Liquid Without Intervening Protective Coating - A MEMS vapor bubble generator includes a chamber for holding liquid; and a heater positioned in the chamber, the heater being formed using a sputtering technique. The heater is formed from a superalloy material. The superalloy material of the heater is in direct contact with the liquid, without any intervening protective coating. The superalloy has a crystalline structure with a grain size less than 100 nano-metres. The superalloy is MCrAlX, where M is one or more of Ni, Co, Fe with M contributing at least 50% by weight, Cr contributing between 8% and 35% by weight, Al contributing more than zero but less than 8% by weight, and X contributing less than 25% by weight, with X consisting of zero or more other elements, preferably including but not limited to Mo, Re, Ru, Ti, Ta, V, W, Nb, Zr, B, C, Si, Y, Hf. | 05-27-2010 |
20100149291 | PRINTHEAD ASSEMBLY WITH PRINTHEAD IC TILES - A printhead assembly for a pagewidth printer arrangement includes a channel shaped member; and a number of printhead tiles located in the channel shaped member. Each tile includes a printhead integrated circuit (IC) carrier member for receiving a printhead IC; and an ink ducting member that mates with the carrier member and defines ink ducts for supplying the printhead IC with ink via the carrier member. The carrier member is a first molding that defines a channel in which the associated printhead IC is received. The first molding has conductive ribs on one side of the channel, the conductive ribs wired to electrical contacts of the printhead IC. | 06-17-2010 |
20100151600 | METHOD OF BONDING SELECTED INTEGRATED CIRCUIT TO ADHESIVE SUBSTRATE - A method of bonding an integrated circuit to an adhesive substrate. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method includes the steps of: (a) selecting one of the integrated circuits for bonding to the adhesive substrate; (b) positioning the adhesive substrate at a backside of the selected integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the selected integrated circuit; and (d) applying a bonding force from the bonding tool through the film frame tape and the selected integrated circuit onto the adhesive substrate, so as to bond the backside of the selected integrated circuit to the substrate. | 06-17-2010 |
20110122183 | PRINTHEAD INCORPORATING PRESSURE PULSE DIFFUSING STRUCTURES BETWEEN INK CHAMBERS SUPPLIED BY SAME INK INLET - An inkjet printer includes a printhead having a plurality of ink chambers fed be an ink inlet, each ink chamber having a heater element for ejecting drops of ink from a nozzle aperture of each chamber; a plurality of pressure pulse diffusing structure positioned between the plurality of ink chambers fed by the ink inlet, the plurality of pressure pulse diffusing structures for retarding a propagation of pressure waves generated by each ink chamber to adjacent ink chambers; and a controller for receiving print data and generating drive pulses to energize the heater elements in accordance with the print data. The controller increases the drive pulse energy during the printhead lifetime such that the drive pulse energy is never less than that of a preceding drive pulse. | 05-26-2011 |
20110228010 | PRINTHEAD WITH BUBBLE VENTS - An inkjet printhead includes a plurality of ink chambers fed by a common ink inlet, the plurality of ink chambers sharing a common roof structure; a plurality of heater elements respectively allocated to each of ink chambers; a plurality of nozzle apertures defined through the common roof structure and respectively aligned with the heater element of each ink chamber; and a bubble vent defined in the common roof of the ink chambers and aligned with the common ink inlet, the bubble vent sized to allow ink surface tension to restrict an egress of ink, and permit egress of gas bubbles therefrom. | 09-22-2011 |
20110318854 | METHOD OF MOUNTING MEMS INTEGRATED CIRCUITS DIRECTLY FROM WAFER FILM FRAME - A method mounting a MEMS integrated circuit on a substrate. The method includes the steps of: (a) providing a film frame tape supported by a wafer film frame, the film frame tape having the plurality of MEMS integrated circuits releasably attached via respective frontsides to the film frame tape; (b) treating a backside surface oxide layer of each MEMS integrated circuit with liquid ammonia; (c) positioning a substrate at the backside of one of said MEMS integrated circuits; (d) positioning a bonding tool on a zone of the film frame tape aligned with the MEMS integrated circuit; and (e) applying a bonding force from the bonding tool so as to bond the backside of the MEMS integrated circuit to the substrate. | 12-29-2011 |