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Roel Daamen
Roel Daamen, Leuven BE
| Patent application number | Description | Published |
|---|---|---|
| 20110097896 | Method for fabrication of in-laid metal interconnects - The present invention relates to a method for fabrication of in-laid metal interconnects. The method comprises the steps of providing a substrate with a dielectric material ( | 04-28-2011 |
Roel Daamen, Herkenbosch NL
| Patent application number | Description | Published |
|---|---|---|
| 20100029076 | METHOD OF MAKING AN INTERCONNECT STRUCTURE - A damascene process is described using a copper fill process to fill a trench ( | 02-04-2010 |
| 20100105202 | METHOD OF FORMING AN INTERCONNECT STRUCTURE - A method of forming an interconnect structure in a semiconductor device in which via holes ( | 04-29-2010 |
| 20110018097 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR - Disclosed is an integrated circuit (IC) comprising a substrate ( | 01-27-2011 |
| 20110079649 | SENSOR - A sensor comprising a silicon substrate having a first and a second surface, integrated circuitry provided on the first surface of the silicon substrate, and a sensor structure provided on the second surface of the silicon substrate. The sensor structure and the integrated circuitry are electrically coupled to each other. | 04-07-2011 |
| 20110146400 | CAPACITIVE SENSOR - A capacitive sensor for detecting the presence of a substance includes a plurality of upstanding conductive pillars arranged within a first layer of the sensor, a first electrode connected to a first group of the pillars, a second electrode connected to a second, different group of the pillars, and a dielectric material arranged adjacent the pillars, for altering the capacitance of the sensor in response to the presence of said substance. | 06-23-2011 |
Roel Daamen, Ab Herkenbosch NL
| Patent application number | Description | Published |
|---|---|---|
| 20090267166 | METHOD OF MANUFACTURING A DEVICE WITH A CAVITY - The invention relates to a micro-device with a cavity ( | 10-29-2009 |
| 20100006957 | MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE - A method of packaging a micro electromechanical structure is disclosed. The method comprises the steps of forming the structure on a substrate, depositing a sacrificial layer over the structure, patterning the sacrificial layer, depositing a porous layer over the patterned sacrificial layer, removing the patterned sacrificial layer through the porous layer, treating the porous layer with a plasma and depositing a capping layer over the plasma-treated porous layer. The plasma treatment step ensures that the capping layer material cannot enter the cavity formed by the removal of the sacrificial layer through the porous layer. A device formed by this method is also disclosed. | 01-14-2010 |
Roel Daamen, Posterholt NL
| Patent application number | Description | Published |
|---|---|---|
| 20090127537 | ELECTRIC DEVICE WITH PHASE CHANGE RESISTOR - An electric device has an electrically switchable resistor ( | 05-21-2009 |