Patent application number | Description | Published |
20100029076 | METHOD OF MAKING AN INTERCONNECT STRUCTURE - A damascene process is described using a copper fill process to fill a trench ( | 02-04-2010 |
20100105202 | METHOD OF FORMING AN INTERCONNECT STRUCTURE - A method of forming an interconnect structure in a semiconductor device in which via holes ( | 04-29-2010 |
20110018097 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR - Disclosed is an integrated circuit (IC) comprising a substrate ( | 01-27-2011 |
20110079649 | SENSOR - A sensor comprising a silicon substrate having a first and a second surface, integrated circuitry provided on the first surface of the silicon substrate, and a sensor structure provided on the second surface of the silicon substrate. The sensor structure and the integrated circuitry are electrically coupled to each other. | 04-07-2011 |
20110146400 | CAPACITIVE SENSOR - A capacitive sensor for detecting the presence of a substance includes a plurality of upstanding conductive pillars arranged within a first layer of the sensor, a first electrode connected to a first group of the pillars, a second electrode connected to a second, different group of the pillars, and a dielectric material arranged adjacent the pillars, for altering the capacitance of the sensor in response to the presence of said substance. | 06-23-2011 |
20110207239 | BICOMPATIBLE ELECTRODES - A biocompatible electrode is manufactured by depositing filling metal | 08-25-2011 |
20110291806 | FOOD PACKAGE WITH INTEGRATED RFID-TAG AND SENSOR - A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer. | 12-01-2011 |
20110296912 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR - Disclosed is an integrated circuit comprising an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode, wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound that is soluble in the liquid; the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface. An package and electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed. | 12-08-2011 |
20120211845 | Integrated Circuit with Sensor and Method of Manufacturing Such an Integrated Circuit - Disclosed is an integrated circuit comprising a substrate ( | 08-23-2012 |
20120249168 | LIQUID IMMERSION SENSOR - Disclosed is a liquid immersion sensor comprising a substrate ( | 10-04-2012 |
20120256645 | CAPACITIVE SENSOR, INTEGRATED CIRCUIT, ELECTRONIC DEVICE AND METHOD - A sensor for sensing an analyte includes capacitive elements, each having a pair of electrodes separated by a dielectric wherein the dielectric constant of the dielectric of at least one of the capacitive elements is sensitive to the analyte, the sensor further including a comparator adapted to compare a selected set of capacitive elements against a reference signal and to generate a comparison result signal, and a controller for iteratively selecting the set in response to the comparison result signal, wherein the sensor is arranged to produce a digitized output signal indicative of the sensed level of the analyte of interest. An IC comprising such a sensor, an electronic device comprising such an IC and a method of determining a level of an analyte of interest using such a sensor are also disclosed. | 10-11-2012 |
20120260732 | SENSOR | 10-18-2012 |
20120299126 | INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN INTEGRATED CIRCUIT - Disclosed is an integrated circuit (IC) comprising a substrate ( | 11-29-2012 |
20130032903 | INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN INTEGRATED CIRCUIT - Disclosed is an integrated circuit comprising a substrate ( | 02-07-2013 |
20130069176 | INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN INTEGRATED CIRCUIT - An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends, and it has a channel around the sensor element area to act as a trap for any encapsulation material which has crept into the opening area. | 03-21-2013 |
20130256825 | INTEGRATED CIRCUIT COMPRISING A GAS SENSOR - An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate having a major surface. The integrated circuit also includes a thermal conductivity based gas sensor having an electrically resistive sensor element located on the major surface for exposure to a gas to be sensed. The integrated circuit further includes a barrier located on the major surface for inhibiting a flow of the gas across the sensor element. | 10-03-2013 |
20140070825 | INTEGRATED CIRCUIT COMPRISING A GAS SENSOR - An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate. The integrated circuit also includes an electrical impedance based gas sensor located on the substrate. The sensor includes first and second electrically conductive sensor electrodes. Each sensor electrode is enclosed in an electrically conductive corrosion protection material. The sensor also includes a gas sensitive material located between the sensor electrodes. The impedance of the gas sensitive material is sensitive to a gas to be sensed. | 03-13-2014 |
20140102172 | INTEGRATED CIRCUIT COMPRISING A THERMAL CONDUCTIVITY BASED GAS SENSOR - An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate. The integrated circuit also includes a relative humidity sensor on the substrate. The relative humidity sensor includes a first sensor electrode, a second sensor electrode, and a humidity sensitive layer covering the first and second electrodes. The integrated circuit further includes a thermal conductivity based gas sensor on the substrate. The thermal conductivity based gas sensor has an electrically resistive sensor element located above the humidity sensitive layer. | 04-17-2014 |
20140145297 | MIM-CAPACITOR AND METHOD OF MANUFACTURING SAME - An integrated circuit includes a support, at least three metal layers above the support, the metal layers having a top metal layer with a top plate and a bottom metal layer with a bottom plate, dielectric material between the top and bottom plates to form a capacitor, and plural oxide layers above the support, such oxide layers including a top oxide layer, each oxide layer respectively covering a corresponding metal layer. The top oxide layer covers the top metal layer and has an opening exposing at least part of the top plate. A method of forming the integrated circuit by providing a support with metal and oxide layers, including a bottom plate, forming a cavity exposing the bottom plate, filling the cavity with dielectric, applying a further metal layer having a top plate and a further oxide layer, and forming an opening to expose the top plate. | 05-29-2014 |
20140151221 | BIOSENSOR MODULE COMPRISING A BIOCOMPATIBLE ELECTRODE - A method of manufacturing a module for a biosensor is disclosed. The method includes providing a substrate. The substrate includes a trench and a bond pad. The trench is filled with an electrically conductive material and the bond pad is arranged within the substrate. The method also includes removing a part of the electrically conductive material from the trench such that a recess is formed in a surface of the substrate, forming a biocompatible electrode in the recess, and removing a part of the substrate such that the bond pad is accessible through the surface of the substrate. | 06-05-2014 |
20140191348 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD - Disclosed is an integrated circuit comprising a substrate ( | 07-10-2014 |
20140203391 | INTEGRATED CIRCUIT INCLUDING A DIRECTIONAL LIGHT SENSOR - An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate having a major surface. The integrated circuit also includes a directional light sensor. The directional light sensor includes a plurality of photodetectors located on the major surface. The directional light sensor also includes one or more barriers, wherein each barrier is positioned to shade one or more of the photodetectors from light incident upon the integrated circuit from a respective direction. The directional light sensor is operable to determine a direction of light incident upon the integrated circuit by comparing an output signal of at least two of the photodetectors. | 07-24-2014 |
20140323350 | ELECTRONIC LATERAL FLOW TEST ARRANGEMENT AND METHOD - A lateral test flow arrangement for a test molecule is disclosed, comprising: a test strip for transporting an analyte away from a sampling region and towards an absorbing region, the test strip having therein and remote from the sampling region, a test region for functionalization with a molecule which binds to the test molecule or to a conjugate of the test molecule; a sensing test capacitor having electrodes extending across the test strip at least partially aligned with the test region and being physically isolated therefrom; a reference test capacitor having electrodes extending across the test strip and being physically isolated therefrom; and an electronic circuit configured to measure a time-dependant capacitance difference between the sensing test capacitor and the reference test capacitor. A method for carrying out that lateral flow tests is also disclosed, as are test systems and in particular pregnancy test systems | 10-30-2014 |
20150031158 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD - Disclosed is an integrated circuit comprising a substrate ( | 01-29-2015 |