Patent application number | Description | Published |
20090071805 | GROUND CONTACT SWITCH FOR PERSONAL NAVIGATION SYSTEM - A ground contact switch system comprises a first object configured to contact a ground surface during a stride, and one or more switches coupled to the first object. An inertial measurement unit can be coupled to the first object. The one or more switches are configured to detect when the first object is at a stationary portion of the stride. The one or more switches can also be configured to send a signal to activate an error correction scheme for the inertial measurement unit. | 03-19-2009 |
20090073045 | ULTRASONIC MULTILATERATION SYSTEM FOR STRIDE VECTORING - A lateration system comprising at least one transmitter attached to a first object and configured to emit pulses, three or more receivers attached to at least one second object and configured to receive the pulses emitted by the transmitter, and a processor configured to process information received from the three or more receivers, and to generate a vector based on lateration. Lateration is one of multilateration and trilateration. The vector is used by the processor to constrain error growth in a navigation solution. | 03-19-2009 |
20090326795 | METHOD OF PERSONAL NAVIGATION USING STRIDE VECTORING - A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object. | 12-31-2009 |
20100019364 | SAW DEBRIS REDUCTION IN MEMS DEVICES - An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area. | 01-28-2010 |
20100084752 | SYSTEMS AND METHODS FOR IMPLEMENTING A WAFER LEVEL HERMETIC INTERFACE CHIP - Systems and methods for enabling hermetic sealing at the wafer level during fabrication of a microelectromechanical sensor (MEMS) device. The MEMS device has a specialized hermetic interface chip (HIC) that facilitates a stable hermetic sealing process. The HIC includes a plurality of vias in a substrate layer, a plurality of mesas having etched portions, a seal ring, a plurality of conductive leads on a first side of the HIC, and a plurality of conductive leads on a second side of the HIC. The plurality of conductive leads on the first side of the HIC feeds from the etched portions of the plurality of mesas through the plurality of vias in the substrate layer to the plurality of conductive leads on the second side of the HIC. The conductive leads are capable of connecting an external circuit to the MEMS device. | 04-08-2010 |
20100220291 | WEARABLE EYE TRACKING SYSTEM - An eye tracking system includes a transparent lens, at least one light source, and a plurality of light detectors. The transparent lens is adapted for disposal adjacent an eye. The at least one light source is disposed within the transparent lens and is configured to emit light toward the eye. The at least one light source is transparent to visible light. The plurality of light detectors is disposed within the transparent lens and is configured to receive light that is emitted from the at least one light source and is reflected off of the eye. Each of the light detectors is transparent to visible light and is configured, upon receipt of light that is reflected off of the eye, to supply an output signal. | 09-02-2010 |
20100320595 | HYBRID HERMETIC INTERFACE CHIP - A hermetically sealed MEMS device package comprises a MEMS device platform, a hermetic interface chip, and an outer seal ring. The MEMS device platform includes a MEMS device surrounded by a continuous outer boundary wall with a top surface. The hermetic interface chip includes a glass substrate and at least one silicon mesa. The glass substrate includes at least one hole and has a lower surface with an inner portion surrounded by an outer portion. The at least one silicon mesa is bonded to the inner portion of the lower surface of the glass substrate, such that the at least one silicon mesa is aligned with the at least one hole in the glass substrate. The outer seal ring bonds the outer portion of the lower surface of the glass substrate to the top surface of the continuous outer boundary wall of the MEMS device platform. | 12-23-2010 |
20110242638 | PHOTONIC STRUCTURES AND PHOTONIC DEVICES - Photonic structures and photonic devices are provided. A photonic structure includes a three-dimensional photonic crystal and an actuator. The three-dimensional photonic crystal comprises an elastomeric, auxetic material and configured to provide a predetermined optical bandgap. The actuator is coupled to the three-dimensional photonic crystal and is configured to compress the three-dimensional photonic crystal. When the actuator compresses the three-dimensional photonic crystal, the three-dimensional photonic crystal shifts from reflecting light in a first wavelength range to light in a second wavelength range. | 10-06-2011 |
20110290021 | HEMITOROIDAL RESONATOR GYROSCOPE - One exemplary embodiment is directed to a vibratory structure gyroscope having a substrate having a top surface. The vibratory structure gyroscope can also include a resonator having a hemitoroidal shape, the resonator including a stem and an outer lip that surrounds the stem, the stem attached to the top surface of the substrate and the outer lip located apart from the top surface to allow the resonator to vibrate. | 12-01-2011 |
20120059583 | METHOD OF PERSONAL NAVIGATION USING STRIDE VECTORING - A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object. | 03-08-2012 |
20120126348 | SYSTEMS AND METHODS FOR A FOUR-LAYER CHIP-SCALE MEMS DEVICE - Systems and methods for a micro-electromechanical system (MEMS) apparatus are provided. In one embodiment, a system comprises a first double chip that includes a first base layer; a first device layer bonded to the first base layer, the first device layer comprising a first set of MEMS devices; and a first top layer bonded to the first device layer, wherein the first set of MEMS devices is hermetically isolated. The system also comprises a second double chip that includes a second base layer; a second device layer bonded to the second base layer, the second device layer comprising a second set of MEMS devices; and a second top layer bonded to the second device layer, wherein the second set of MEMS devices is hermetically isolated, wherein a first top surface of the first top layer is bonded to a second top surface of the second top layer. | 05-24-2012 |
20120126349 | SYSTEMS AND METHODS FOR A THREE-LAYER CHIP-SCALE MEMS DEVICE - Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer. | 05-24-2012 |
20120126350 | BATCH FABRICATED 3D INTERCONNECT - In an example, a method of fabricating one or more vertical interconnects is provided. The method includes patterning and stacking a plurality of wafers to form a wafer stack. A plurality of apertures can be formed in the wafer stack within one or more saw streets of the wafer stack, and conductive material can be deposited on sidewalls of the plurality of apertures. The wafer stack can be diced along the one or more saw streets and through the plurality of apertures such that the conductive material on the sidewalls is exposed on an edge portion of resulting stacked dies | 05-24-2012 |
20120126881 | MEMS SENSOR USING MULTI-LAYER MOVABLE COMBS - A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields. | 05-24-2012 |
20120130671 | VIBRATION ISOLATION INTERPOSER DIE - In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections. | 05-24-2012 |
20120130672 | MEMS VERTICAL COMB STRUCTURE WITH LINEAR DRIVE/PICKOFF - A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs. The proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one anchor having a second plurality of combs. The anchor is coupled to the substrate such that the anchor and second plurality of combs are fixed in position relative to the substrate. The first plurality of combs are interleaved with the second plurality of combs. Each of the combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that capacitance between the combs varies approximately linearly with displacement of the movable combs in an out-of-plane direction. | 05-24-2012 |
20120142136 | WAFER LEVEL PACKAGING PROCESS FOR MEMS DEVICES - A process for packaging micro-electro-mechanical systems (MEMS) devices comprises providing a lower cover wafer and an upper cover wafer, providing a semiconductor wafer including a plurality of MEMS devices on a substrate layer, bonding the semiconductor wafer to a first surface of the lower cover wafer, and bonding a second surface of the upper cover wafer to the semiconductor wafer. The first surface of the lower cover wafer and the second surface of the upper cover wafer define a plurality of hermetically sealed cavity sections when bonded to the semiconductor wafer such that each of the MEMS devices is located inside one of the sealed cavity sections. A plurality of holes are formed that extend from the first surface of the upper cover wafer to the second surface of the upper cover wafer after the upper cover wafer is bonded to the semiconductor wafer. A metal lead layer is then deposited in each of the holes to provide an electrical connection with the MEMS devices. | 06-07-2012 |
20120272730 | SYSTEMS AND METHODS FOR AN ENCODER AND CONTROL SCHEME - Systems and methods for an encoder and control scheme are provided. In one embodiment, a micro-electromechanical system (MEMS) device comprises: a stator having a first marker and a second marker arranged on a surface of the stator to form a sensing pattern; a sweeping element that dithers in a plane parallel to the surface of the stator along a sweep path that crosses the first marker and a second marker; an overlap sense circuit operable to measure an area overlap between the sweeping element and the sensing pattern, wherein the overlap sense circuit generates a pulse train signal output that varies as a function of the area overlap. | 11-01-2012 |
20120272731 | TWO DEGREE OF FREEDOM DITHERING PLATFORM FOR MEMS SENSOR CALIBRATION - Systems and methods for two degree of freedom dithering for micro-electromechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer. | 11-01-2012 |
20140014826 | FOLDED OPTICS FOR BATCH FABRICATED ATOMIC SENSOR - System and methods for a vacuum cell apparatus for an atomic sensor are provided. In at least one embodiment, the apparatus comprises a cell wall encircling an enclosed volume, the cell wall having a first open end and a second open end opposite from the first open end and a first panel over the first open end of the cell wall and having a first surface, the first surface facing the enclosed volume and having a first set of diffractive optics therein. Further, the apparatus comprises a second panel over the second open end of the cell wall and having a second surface, the second surface facing the enclosed volume and having a second set of diffractive optics therein; wherein the first set of diffractive optics and the second of diffractive optics are configured to reflect at least one optical beam within the enclosed volume along a predetermined optical path. | 01-16-2014 |
20140068931 | HEMITOROIDAL RESONATOR GYROSCOPE - A method for fabricating a vibratory structure gyroscope is provided herein. An annular cavity is formed in a first surface of a substrate, the annular cavity defining an anchor post located in a central portion of the annular cavity. A bubble layer is formed over the first surface of the substrate and over the annular cavity. The substrate and the bubble layer are heated to form a hemitoroidal bubble in the bubble layer over the annular cavity. A sacrificial layer is deposited over the hemitoroidal bubble of the bubble layer and an aperture is formed in the sacrificial layer, the aperture disposed over the anchor post in the annular cavity. A resonator layer is deposited over the sacrificial layer and the sacrificial layer between the bubble layer and the resonator layer is removed. | 03-13-2014 |
20150024534 | TWO DEGREE OF FREEDOM DITHERING PLATFORM FOR MEMS SENSOR CALIBRATION - Systems and methods for two degree of freedom dithering for micro-electromechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer. | 01-22-2015 |