Patent application number | Description | Published |
20090267713 | HIGH-FREQUENCY TRANSMISSION LINE - A high-frequency transmission line includes: a dielectric substrate; a signal line formed on one surface of the dielectric substrate; a first and a second surface ground patterns formed so as to sandwich the signal line at a given distance from the signal line on the surface of the dielectric substrate; a backside surface ground pattern formed on another surface of the dielectric substrate; and a plurality of contacts penetrating the dielectric substrate for connecting the first and the second surface ground pattern to the backside surface ground pattern. In a given frequency range, the sum of the shortest distance from any point of the first and the second surface ground patterns to the nearest contact and the thickness of the dielectric substrate is shorter than ΒΌ of the effective wavelength of a transmission signal converted in the effective permittivity of the dielectric substrate. | 10-29-2009 |
20100254094 | High-Frequency Wiring Board and High-Frequency Module That Uses the High-Frequency Wiring Board - The high-frequency wiring board of the present invention is a wiring board that includes first coplanar lines and second coplanar lines formed on a different layer than the first coplanar lines; the first coplanar lines and second coplanar lines being connected at the line ends of each. The first coplanar lines are provided with a first signal line ( | 10-07-2010 |
20110001971 | ELECTROMAGNETIC FIELD MEASUREMENT DEVICE - There is provided an electromagnetic field measurement apparatus capable of achieving correct and timely circuit operation detection in an area where electronic devices are mounted at high density. An electromagnetic field measurement apparatus includes: a laser light source; a polarized wave controller that linearly polarizes laser light; an optical fiber probe that has an electrooptic material or a magnetooptic material at its leading end and in which the laser light reflected at the leading end is subjected to polarization modulation in accordance with an electric field intensity or a magnetic field intensity; and an analyzer that converts the laser light reflected by the optical fiber probe into intensity modulated light. The laser light source emits time-multiplexed laser light of a plurality of wavelengths different from one another. The electromagnetic field measurement apparatus further includes: an optical circulator that outputs the laser light linearly polarized by the polarized wave controller to a multiplexer/demultiplexer and outputs the laser light input from the multiplexer/demultiplexer to the analyzer; and a multiplexer/demultiplexer that outputs the laser light to different optical fiber probes according to the wavelength of the laser light and outputs the laser light to the optical circulator. | 01-06-2011 |
20110032056 | HIGH-FREQUENCY SUBSTRATE AND HIGH-FREQUENCY MODULE - A high-frequency substrate in which a coplanar line including a signal line which transmits a signal and a pair of front ground patterns disposed in parallel with the signal line interposed therebetween is formed on one surface of a dielectric substrate, a back ground pattern is formed to cover the other surface of the dielectric substrate, and a plurality of conductive vias which connect the front ground patterns to the back ground pattern are arranged at a predetermined interval, the high-frequency substrate including: a signal line breaking portion which breaks the signal line; a substantially rectangular parallelepiped signal-line capacitor which is formed to connect the breaking ends of the signal line to each other; and ground pattern breaking portions which are disposed on both sides of the signal line breaking portion of the signal line to break the front ground patterns. | 02-10-2011 |
20110128100 | HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE WIRING BOARD - The high-frequency wiring board of the present invention includes: first coplanar lines provided with a first signal line and a first planar ground pattern formed on the same wiring layer as the first signal line; second coplanar lines provided with a second signal line formed on a different wiring layer than the first signal line and a second planar ground pattern formed on the same wiring layer as the second signal line; and a first ground pattern formed on the same wiring layer as the first coplanar lines. The first coplanar lines and the second coplanar lines are connected. At least the first ground pattern and the first planar ground pattern are separated in a region following the second signal line from the connection of the first signal line and the second signal line. | 06-02-2011 |
20110156844 | WAVEGUIDE, WAVEGUIDE CONNECTION STRUCTURE AND WAVEGUIDE CONNECTION METHOD - A waveguide includes: a first tubular waveguide path that transmits electromagnetic waves having a predetermined wavelength; and a stub that is formed such that a depth thereof becomes a quarter of the predetermined wavelength, an open end of the stub making internal contact with a contour line, and the contour line being spaced apart from an inner wall part of one end of the first tubular waveguide path in a radially outward direction by only a quarter of the predetermined wavelength. | 06-30-2011 |
20110226518 | SUBSTRATE OF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR - A coplanar line formed on a high-frequency substrate of a high-frequency module includes a first dielectric layer, a signal line which is formed on the surface of the first dielectric layer and connected to a core line of a coaxial connector, a ground which is formed in opposite areas beside the signal line with a clearance therebetween, and a lower ground of the first dielectric layer. A second dielectric layer is laminated with the first dielectric layer so as to interpose the lower ground therebetween. Additionally, the lower ground is exposed on the terminal face of the high-frequency substrate coupled with the coaxial connector in either the first dielectric layer or the second dielectric layer and connected to an outer conductor of the coaxial connector. Thus, it is possible to prevent an insertion loss from increasing due to electromagnetic emission occurring in the clearance of the high-frequency substrate in response to transmitting signals in a high frequency range. | 09-22-2011 |
20120098560 | ELECTROMAGNETIC FIELD MEASURING APPARATUS, ELECTROMAGNETIC FIELD MEASURING METHOD USED FOR THE SAME, AND NON-TRANSITORY COMPUTER READABLE MEDIUM STORING ELECTROMAGNETIC FIELD MEASUREMENT CONTROL PROGRAM - An electromagnetic field measuring apparatus capable of measuring an electromagnetic field for a minuscule area in which electronic devices are densely packed with a high sensitivity is provided. In an electromagnetic field measuring apparatus according to the present invention, the amplitude level of signal light (pf) is adjusted by the analyzer ( | 04-26-2012 |
20120326812 | HIGH-FREQUENCY TRANSMISSION LINE AND CIRCUIT SUBSTRATE - In order that the total distance of a first high-frequency current path, which is defined in the periphery of slits ( | 12-27-2012 |