Patent application number | Description | Published |
20110153228 | PHOTON IMAGING SYSTEM FOR DETECTING DEFECTS IN PHOTOVOLTAIC DEVICES, AND METHOD THEREOF - A method includes supplying current to at least one photovoltaic device via a current source and detecting emitted photon radiations from the at least one photovoltaic device via a radiation detector. The method also includes outputting a signal corresponding to the detected emitted photon radiations from the radiation detector to a processor device, and processing the signal corresponding to the detected emitted photon radiations via the processor device to generate one or more two-dimensional photon images. The method further includes analyzing the one or more two-dimensional photon images to determine at least one defect in the at least one photovoltaic device. | 06-23-2011 |
20110241539 | Light-Emitting Device and Article - A device including a layer comprising a light emissive area and a light non-emissive area. A light-extracting feature is disposed over the light non-emissive area. The light-extracting features can include surface aberrations and reflective index matching elements. A method of forming the device is also provided. | 10-06-2011 |
20110244141 | METHOD OF PROCESSING MULTILAYER FILM - A method of processing a multilayer film is provided. The method includes providing a substrate film having a substrate film first surface and a substrate film second surface. The method also includes providing a barrier layer adjacent to the substrate film second surface. The barrier layer has at least one opening allowing fluid communication between the substrate film and an outer surface of the barrier layer. Further, the method includes contacting the substrate film first surface with a first reactant and finally contacting the outer surface of the barrier layer with a second reactant, said second reactant being reactive with said first reactant. The method of contacting the substrate film first surface to the first reactant and contacting the outer surface of the barrier layer to the second reactant is carried out under conditions under which reaction between said first reactant and the second reactant results in a formation of a reaction layer. | 10-06-2011 |
20120219791 | COATED POLYMER DIELECTRIC FILM - Present invention provides a film and an article including the film. The film includes first layer, second layer and third layer. The first layer includes a polymer dielectric material. The second layer is disposed on at least one surface of the first layer and includes inorganic oxide dielectric material. The third layer is disposed on the first or second layer and includes a nitride or oxynitride material. | 08-30-2012 |
20130076191 | HYBRID DIELECTRIC FILM FOR HIGH TEMPERATURE APPLICATION - A high-temperature insulation assembly for use in high-temperature electrical machines and a method for forming a high-temperature insulation assembly for insulating conducting material in a high-temperature electrical machine. The assembly includes a polymeric film and at least one ceramic coating disposed on the polymeric film. The polymeric film is disposed over conductive wiring or used as a conductor winding insulator for phase separation and slot liner. | 03-28-2013 |
20130143018 | Coated Polymer Films - Coated polymer compositions having improved dielectric strength are disclosed. The coated polymer compositions can comprise a polymer substrate and an inorganic material. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention. | 06-06-2013 |
20140029210 | DIFFUSION BARRIER FOR SURFACE MOUNT MODULES - A surface-mount package structure for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to a substrate structure, with a dielectric material positioned between the dielectric layer and the substrate structure to fill in gaps in the surface-mount structure. A diffusion barrier layer is applied over the sub-module, adjacent the first and second level I/O connections, and extends down to the substrate structure to reduce the ingress of moisture and gases from a surrounding environment into the surface-mount structure. | 01-30-2014 |
20140036328 | STACKED FILM THRESHOLD COMPONENT, DEVICE, AND METHOD OF MANUFACTURE - A component includes a micro-hologram layer, where the micro-hologram layer includes layers inert to light interleaved with layers of functional film. The functional film layers are made of a material that undergoes a change in its refractive index when illuminated by a light beam, yet undergoes no change in its refractive index when illuminated by a different light beam. The components may further include interleaved spacer films with multiple micro-hologram layers and other elements (e.g., servo layer, coatings, and the like) so as to comprise a data storage device. Methods of manufacturing the component and device are also disclosed. | 02-06-2014 |
20140061592 | OLED DEVICES WITH INTERNAL OUTCOUPLING - Optoelectronic devices that have enhanced internal outcoupling are disclosed. The devices include a substrate, an anode, a cathode, an electroluminescent layer, and a hole injecting layer. The hole injecting layer includes inorganic nanoparticles that have a bimodal particle size distribution and which are dispersed in an organic matrix. | 03-06-2014 |
20140061593 | OLED DEVICES WITH INTERNAL OUTCOUPLING - Optoelectronic devices with enhanced internal outcoupling include a substrate, an anode, a cathode, an electroluminescent layer, and an electron transporting layer comprising inorganic nanoparticles dispersed in an organic matrix. | 03-06-2014 |
20150030785 | HYBRID DIELECTRIC FILM FOR HIGH TEMPERATURE APPLICATION - A high-temperature insulation assembly for use in high-temperature electrical machines and a method for forming a high-temperature insulation assembly for insulating conducting material in a high-temperature electrical machine. The assembly includes a polymeric film and at least one ceramic coating disposed on the polymeric film. The polymeric film is disposed over conductive wiring or used as a conductor winding insulator for phase separation and slot liner. | 01-29-2015 |