Retuta
Danny Retuta, Singapore SG
Patent application number | Description | Published |
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20090236726 | PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE - A semiconductor package that includes a substrate having first and second major surfaces is presented. The package includes a plurality of landing pads and a semiconductor die disposed on the first major surface. A molded cap is disposed on the first surface to encapsulate the die and substrate. The landing pads are covered when the cap is molded. Package interconnects are coupled to the landing pads. The package interconnects are exposed by the cap to facilitate package stacking. | 09-24-2009 |
Danny Retuta, Tustin, CA US
Patent application number | Description | Published |
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20080284015 | BUMP ON VIA-PACKAGING AND METHODOLOGIES - A semiconductor package with a semiconductor chip having under bump metallizations (UBMs) on a first surface and a substrate having open vias. The substrate is attached to the semiconductor chip with the UBMs in alignment with the open vias. An encapsulant surrounds the semiconductor chip and the substrate and a conductor fills the open vias to form external package connections. A method of forming a semiconductor package having external package connections includes providing a semiconductor chip having under bump metallizations (UBMs) on a first surface; attaching the first surface of the semiconductor chip to a substrate, the UBMs of the semiconductor chip being in alignment with open vias formed in the substrate; encapsulating the semiconductor chip and the substrate; and filling with open vias with a conductor to form the external package connections. | 11-20-2008 |
Danny Vallejo Retuta, Singapore SG
Patent application number | Description | Published |
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20080199985 | LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDUCTOR PACKAGE - A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads. | 08-21-2008 |