Rebhan
Bernhard Rebhan, Haag A.h. AT
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20140102221 | METHOD AND DEVICE FOR DETERMINING THE PRESSURE DISTRIBUTION FOR BONDING - A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution. | 04-17-2014 |
Bernhard Rebhan, Haag A. H. AT
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20140154867 | METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEANS OF SOLID STATE DIFFUSION OR PHASE TRANSFORMATION - A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused. | 06-05-2014 |
20140196842 | METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS, AS WELL AS CUTTING TOOL - A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of: | 07-17-2014 |
20150224755 | METHOD FOR COATING AND BONDING SUBSTRATES - A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 μm. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates. | 08-13-2015 |
20160071817 | METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SACRIFICIAL LAYER APPLIED ON ONE OF THE CONTACT AREAS IN AT LEAST ONE OF THE CONTACT AREAS - A method for bonding of a first, at least partially metallic contact surface of a first substrate to a second, at least partially metallic contact surface of a second substrate, with the following steps, especially the following progression: application of a sacrificial layer which is at least partially, especially predominantly soluble in the material of at least one of the contact surfaces to at least one of the contact surfaces, bonding of the contact surfaces with at least partial solution of the sacrificial layer in at least one of the contact surfaces. | 03-10-2016 |
Bernhard Rebhan, Haag Am Hausruck AT
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20150069115 | DEVICE AND METHOD FOR BONDING SUBSTRATES - A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space, | 03-12-2015 |
Helmut Rebhan, Weiden FR
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20160049762 | ARRANGEMENT FOR ELECTRICAL LINES MOUNTED IN A MOTOR VEHICLE - An arrangement for electrical lines is set forth which is mounted in a steering column switching module and/or in a steering wheel mounted on the module, equipped with its ends electrically conductively connected to one of the electrical components, which is fixedly mounted in the steering wheel switching module or in the steering wheel mounted thereon. At least two of the lines are connected with their other free ends to electrical contacts, which are arranged in at least one coupling body ( | 02-18-2016 |
Michael H. Rebhan, Vero Beach, FL US
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20160080403 | SYSTEM AND METHOD FOR MONITORING DATA AND PROVIDING ALERTS - A method for monitoring data and providing alerts is disclosed. In particular, the method may including monitoring and capturing data associated with a user of a device. Additionally, the method may include determining if a portion of the captured data matches a condition for triggering an alert. If the portion of the data is determined to match the condition for triggering the alert, the method may include storing the alert data and transmitting a notification to a client service to indicate the triggering of the alert. The method, by utilizing the client service, may include retrieving the alert data associated with the portion of the data. Furthermore, the method may include transmitting the alert including the alert data to a notification server for processing. The alert data may be configured to not include the portion of the data that is determined to match the condition for triggering the alert. | 03-17-2016 |
Thomas Rebhan, Haag Am Hausruck AT
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20100044350 | Production Installation and Method for Joining Parts - The invention discloses a method and a production installation for producing a sub-assembly consisting of a plurality of parts joined together, in which the first part ( | 02-25-2010 |