| Patent application number | Description | Published |
|---|
| 20080259567 | CONDUCTIVE HEAT TRANSPORT COOLING SYSTEM AND METHOD FOR A MULTI-COMPONENT ELECTRONICS SYSTEM - A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough. | 10-23-2008 |
| 20100181663 | LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMULATION FOR THERMAL INTERFACE MATERIAL AND PACKAGE - An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less. | 07-22-2010 |
| 20110069456 | SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE - A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources. | 03-24-2011 |
| 20110149505 | IN-LINE MEMORY MODULE COOLING SYSTEM - A system to aid in cooling an in-line memory module may include a thermal interface material adjacent the in-line memory module. The system may also include a heat spreader adjacent the thermal interface material. The system may further include a cold-plate adjacent the heat spreader, the cold-plate, heat spreader, and thermal interface material to aid in cooling the in-line memory module. | 06-23-2011 |
| 20120120603 | AUTOMATICALLY RECONFIGURABLE LIQUID-COOLING APPARATUS FOR AN ELECTRONICS RACK - An apparatus is provided for cooling an electronics rack, which includes an electronic subsystem across which air passing through the rack flows. A cooling unit provides, via system coolant supply and return manifolds, system coolant in parallel to the electronic subsystem and an air-to-liquid heat exchanger disposed to cool, in normal-mode, air passing through the rack. A controller monitors coolant associated with the cooling unit and automatically transitions the cooling apparatus from normal-mode to failure-mode responsive to detecting a failure of the coolant. In transitioning to failure-mode, multiple isolation valves are employed in switching to a serial flow of system coolant from the electronic subsystem to the heat exchanger for rejecting, via the system coolant, heat from the electronic subsystem to air passing across the heat exchanger. | 05-17-2012 |
| 20120199333 | CUSTOMIZED THERMAL INTERFACE TO OPTIMIZE MECHANICAL LOADING AND THERMAL CONDUCTIVITY CHARACTERISTICS - A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed. | 08-09-2012 |
| 20120200997 | SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE - A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources. | 08-09-2012 |
