Patent application number | Description | Published |
20130163626 | Optical Illuminator - Illuminator module comprising VCSEL arrays with planar electrical contacts, readily adaptable for surface mounting, is provided. Monolithic VCSEL arrays are configured in array patterns on two and three-dimensional surfaces. Illuminator modules are easily expandable by increasing the array size or by modularly arranging more arrays with or without a transparent substrate. Different shapes of illuminator modules may be configured by tiling array modules monolithically on a common substrate, or by tiling small modules. The surface mountable illuminator modules are easily assembled on a thermally conductive surface that may be air or liquid cooled for efficient heat dissipation. Array modules may be integrated with other electronic circuits such as current drivers, sensors, controllers, processors, etc. on a common platform, for example, a single or multiple layer printed circuit boards (PCB) to assemble illumination systems for different applications including a gesture recognition apparatus and a battery operated portable illuminator devices. | 06-27-2013 |
20130163627 | Laser Illuminator System - An optical illuminator using Vertical Cavity Surface Emitting Laser (VCSEL) is disclosed. Optical modules configured using single VCSEL and VCSEL arrays bonded to a thermal submount to conduct heat away from the VCSEL array, are suited for high power and high speed operation. High speed optical modules are configured using single VCSEL or VCSEL arrays connected to a high speed electronic module on a common thermal submount or on a common Printed Circuit Board (PCB) platform including transmission lines. The electronic module provides low inductance current drive and control functions to operate the VCSEL and VCSEL array. VCSEL apertures are designed for a desired beam shape. Additional beam shaping elements are provided for VCSELs or VCSEL arrays, for desired output beam shapes and/or emission patterns. VCSEL arrays may be operated in continuous wave (CW) or pulse operation modes in a programmable fashion using a built-in or an external controller. | 06-27-2013 |
20130266032 | Laser architectures - Disclosed herein are architectures for an external cavity laser. In some embodiments, the external cavity laser includes vertical cavity surface emitting laser (VCSEL) elements, a Brewster plate, frequency doubling chips, and a microlens array. The Brewster plate is arranged at an angle relative to the light path, and is configured to polarize at least the light received from the VCSELs and propagating on the light path in a first direction, and extract, from the external cavity, frequency-doubled light propagating on the light path in a second direction opposite to the first direction. The doubling chips are operable to receive the light and double the frequency of a portion of the received light. The microlens array is aligned with the VCSEL elements. A mount may be employed to mount the side stack of doubling chips by either side mounting or end mounting. | 10-10-2013 |
20140218898 | OPTICAL ILLUMINATOR - VCSEL arrays with planar electrical contacts readily adaptable for surface mounting are provided. Monolithic VCSEL arrays are configured in array patterns on two and three-dimensional surfaces for configuring optical illuminator modules. Illuminator modules are easily expandable by increasing the array size or by modularly arranging more arrays with or without a transparent substrate, in different shapes by tiling array modules monolithically on a common substrate, or by tiling small modules. The surface mountable illuminator modules are easily assembled on a thermally conductive surface that may be air or liquid cooled for efficient heat dissipation. Array modules may be integrated with other electronic circuits such as current drivers, sensors, controllers, processors, etc. on a common platform, for example, a single or multiple layer printed circuit boards (PCB) to assemble illumination systems for different applications including a gesture recognition apparatus and a battery operated portable illuminator devices. | 08-07-2014 |
20140247841 | VCSEL Pumped Fiber Optic Gain Systems - Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to a fiber output port. The pump module having a fiber output port is particularly suited to couple light to an inner cladding of a double-clad fiber, often used to configure high power fiber laser and fiber amplifier. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation. | 09-04-2014 |
20140333995 | VCSEL Pumped Fiber Optic Gain Systems - Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to an optical fiber output port, particularly suited to couple light to an inner cladding of a double-clad fiber suitable for a high power gain element. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes. | 11-13-2014 |
20150069113 | VCSEL Packaging - A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems. | 03-12-2015 |
20150255955 | Processes for Making Reliable VCSEL Devices and VCSEL arrays - A set of VCSEL fabrication methods has been invented which enhance the performance and long time reliability of VCSEL devices and arrays of devices. Wafer bow caused by growing a large number of epitaxial layers required to fabricate VCSEL device generates strain and results in bowing/warping of the device wafer. The stress so generated is eliminated by applying a stress compensation layer on the substrate to a surface opposite to the epitaxial layer surface. New oxidation equipment designs and process parameters are described which produce more precision apertures and reduce stress in the VCSEL device. An ultrathin fabrication procedure is described which enables high power VCSELs to be made for high power operation at many different wavelengths. A low temperature electrical contacting process improves VCSEL long term reliability. | 09-10-2015 |