Premachandran
Chiraharikathu Veedu Sankarapillai Premachandran, Singapore SG
Patent application number | Description | Published |
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20130037603 | Method of Forming a Bonded Structure - In an embodiment, a method of forming a bonded structure is provided. The method may include forming at least one first under bump metallurgy (UBM) structure on a first substrate, forming a first gold layer on the at least one first under bump metallurgy structure; forming a tin layer on the first gold layer, forming an indium layer on the tin layer, forming an inhibition layer configured to inhibit oxygen penetration on the indium layer, and forming at least one second under bump metallurgy structure on a second substrate, forming s second gold layer on the at least one second under bump metallurgy structure; and bringing the inhibition layer into contact with the second gold layer at a predetermined temperature to form a resultant intermetallic structure between the first substrate and the second substrate thereby bonding the first substrate to the second substrate and forming the bonded structure. | 02-14-2013 |
Chirayarikathuveedu Sankarapillai Premachandran, Republic Of Singapore SG
Patent application number | Description | Published |
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20100084032 | DISPENSER ARRANGEMENT FOR FLUIDIC DISPENSING CONTROL IN MICROFLUIDIC SYSTEM - A dispenser arrangement for fluidic dispensing control into a microfluidic component comprising an enclosed fluid holding area having a base portion and a top portion and a valve adapted to be movable between an open position and a closed position and positioned at least partially in the fluid holding area. The valve comprises an elongated hollow portion having a body and two ends adapted for fluid flow from the fluid holding area to the microfluidic component in the open position, a first opening on the body of the hollow portion positioned within the fluid holding area allowing fluid communication from the fluid holding area to the microfluidic component in the open position, a sealing portion connected to a first end of the hollow portion positioned within the fluid holding area adapted for sealing connection with the top portion of the fluid holding area in the closed position and a slant second opening at a second end of the hollow portion positioned outside of the fluid holding area. The slant second opening is adapted to pierce through a sealing layer covering the microfluidic component in the open position and to insert into a first substrate housing the microfluidic component in the closed position. A dispenser unit comprising a dispenser arrangement and an actuator, wherein the actuator is a piston is also disclosed. | 04-08-2010 |
Chirayarikathu Veedu Sankarapillai Premachandran, Singapore SG
Patent application number | Description | Published |
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20130020713 | Wafer Level Package and a Method of Forming a Wafer Level Package - In an embodiment, a wafer level package may be provided. The wafer level package may include a device wafer including a MEMS device, a cap wafer disposed over the device wafer, at least one first interconnect disposed between the device wafer and the cap wafer and configured to provide an electrical connection between the device wafer and the cap wafer, and a conformal sealing ring disposed between the device wafer and the cap wafer and configured to surround the at least one first interconnect and the MEMS device so as to provide a conformally sealed environment for the at least one first interconnect and the MEMS device, wherein the conformal sealing ring may be configured to conform to a respective suitable surface of the device wafer and the cap wafer when the device wafer may be bonded to the cap wafer. A method of forming a wafer level package may also be provided. | 01-24-2013 |