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Preda
Cornel Preda, Cumming, GA US
| Patent application number | Description | Published |
|---|---|---|
| 20100201504 | Emergency cars visual device (ECVD) - The Insulating Board System is a procedure where an insulation is added to any panel made from wood, cement, siding, or sheetrock, as a way to improve the R-value, the noise reduction and vibration, and improve the structure resistance of the construction. | 08-12-2010 |
| 20100223875 | Insulating board system - The Insulating Board System is a procedure where an insulation is added to any panel made from wood, cement, siding, or sheetrock, as a way to improve the R-value, to help reduce the noise and vibration, and in the same time to improve, in some instances, the structure resistance of the construction. | 09-09-2010 |
Dorin V. Preda, Medford, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20090220430 | Fluorescent Imaging Agents - Provided is a family of intramolecularly quenched imaging agents for use in both in vivo and in vitro imaging that contain at least one enzymatically cleavable oligopeptide and two fluorophores or a fluorophore and a quencher. When subjected to proteolytic cleavage, at least one fluorophore is unquenched and becomes capable of producing a fluorescent signal upon excitation with light of an appropriate wavelength. Also provided are in vivo and in vitro imaging methods using such imaging agents. | 09-03-2009 |
Francesco Preda, New Braunfels, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20090200074 | Circuit Substrate Having Post-Fed Die Side Power Supply Connections - A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate. | 08-13-2009 |
| 20090256253 | Continuously Referencing Signals Over Multiple Layers in Laminate Packages - A mechanism for continuously referencing signals over multiple layers in laminate packages provides a continuous path for signals from one layer to another while using the ideal voltage reference for all areas of the package and still avoiding discontinuities in the voltage reference. A reference plane adjustment engine analyzes a package design and identifies an ideal top plane for all areas of the package, including areas under particular chip die(s) and areas that are not under a chip die. The reference plane adjustment engine then modifies the package design to reposition ground planes, source voltage planes, signal planes, and vias between layers to maintain a continuous voltage reference regardless of the top layer. The reference plane adjustment engine provides the resulting mixed voltage plane package design to a design analysis engine. A package fabrication system fabricates the package. | 10-15-2009 |
| 20100330797 | FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE POWER SUPPLY CONNECTIONS - A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate. | 12-30-2010 |
Marin Preda, New Westminster CA
| Patent application number | Description | Published |
|---|---|---|
| 20080202636 | Log Deflector With Removable Accessory Portion and Associated Method - A forestry work machine comprises a carrier and a log deflector for deflecting away from the carrier a log held by the forestry work machine. The log deflector comprises a base portion attached to a side of the carrier and an accessory portion projecting laterally outwardly from and removably attached to the base portion. An associated method is disclosed. | 08-28-2008 |