Patent application number | Description | Published |
20080216602 | COATING PROCESS FOR MANUFACTURE OR REPROCESSING OF SPUTTER TARGETS AND X-RAY ANODES - Disclosed is a process for the reprocessing or production of a sputter target or an X-ray anode wherein a gas flow forms a gas/powder mixture with a powder of a material chosen from the group consisting of niobium, tantalum, tungsten, molybdenum, titanium, zirconium, mixtures of two or more thereof and alloys thereof with at least two thereof or with other metals, the powder has a particle size of 0.5 to 150 μm, wherein a supersonic speed is imparted to the gas flow and the jet of supersonic speed is directed on to the surface of the object to be reprocessed or produced. | 09-11-2008 |
20080271779 | Fine Grained, Non Banded, Refractory Metal Sputtering Targets with a Uniformly Random Crystallographic Orientation, Method for Making Such Film, and Thin Film Based Devices and Products Made Therefrom - The invention relates to a sputtering target which has a fine uniform equiaxed grain structure of less than 44 microns, no preferred texture orientation as measured by electron back scattered diffraction (“EBSD”) and that displays no grain size banding or texture banding throughout the body of the target. The invention relates a sputtering target with a lenticular or flattened grain structure, no preferred texture orientation as measured by EBSD and that displays no grain size or texture banding throughout the body of the target and where the target has a layered structure incorporating a layer of the sputtering material and at least one additional layer at the backing plate interface, said layer has a coefficient of thermal expansion (“CTE”) value between the CTE of the backing plate and the CTE of the layer of sputtering material. The invention also relates to thin films and their use of using the sputtering target and other applications, such as coatings, solar devices, semiconductor devices etc. The invention further relates to a process to repair or rejuvenate a sputtering target. | 11-06-2008 |
20080314737 | Methods of Making Molybdenium Titanium Sputtering Plates and Targets - Molybdenum titanium sputter targets are provided. In one aspect, the targets are substantially free of the β(Ti, Mo) alloy phase. In another aspect, the targets are substantially comprised of single phase β(Ti, Mo) alloy. In both aspects, particulate emission during sputtering is reduced. Methods of preparing the targets, methods of bonding targets together to produce large area sputter targets, and films produced by the targets, are also provided. | 12-25-2008 |
20090065747 | TIN OXIDE-BASED SPUTTERING TARGET, LOW RESISTIVITY, TRANSPARENT CONDUCTIVE FILM, METHOD FOR PRODUCING SUCH FILM AND COMPOSITION FOR USE THEREIN - The present invention is directed to a composition consisting essentially of:
| 03-12-2009 |
20090186230 | REFRACTORY METAL-DOPED SPUTTERING TARGETS, THIN FILMS PREPARED THEREWITH AND ELECTRONIC DEVICE ELEMENTS CONTAINING SUCH FILMS - Metallic materials consisting essentially of a conductive metal matrix, preferably copper, and a refractory dopant component selected from the group consisting of tantalum, chromium, rhodium, ruthenium, iridium, osmium, platinum, rhenium, niobium, hafnium and mixtures thereof, preferably in an amount of about 0.1 to 6% by weight based on the metallic material, alloys of such materials, sputtering targets containing the same, methods of making such targets, their use in forming thin films and electronic components containing such thin films. | 07-23-2009 |
20100086800 | METHOD OF MANUFACTURING BULK METALLIC STRUCTURES WITH SUBMICRON GRAIN SIZES AND STRUCTURES MADE WITH SUCH METHOD - Three dimensionally large metallic structures comprised of submicron grain sizes are produced by a process which includes directing a supersonic powder jet against a substrate such that the powder adheres to the substrate and to itself to form a dense cohesive deposit. The powder jet may be comprised of refractory metal powders. The powder may be deposited by a supersonic jet and may be extruded by Equi channel angular extrusion. | 04-08-2010 |
20110008201 | NIOBIUM BASED ALLOY THAT IS RESISTANT TO AQUEOUS CORROSION - A niobium or niobium alloy which contains pure or substantially pure niobium and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a niobium alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the niobium alloy. | 01-13-2011 |
20110041650 | NIOBIUM BASED ALLOY THAT IS RESISTANT TO AQUEOUS CORROSION - A niobium or niobium alloy which contains pure or substantially pure niobium and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a niobium alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the niobium alloy. | 02-24-2011 |
20110097236 | METHODS OF MAKING MOLYBDENUM TITANIUM SPUTTERING PLATES AND TARGETS - Molybdenum titanium sputter targets are provided. In one aspect, the targets are substantially free of the β(Ti, Mo) alloy phase. In another aspect, the targets are substantially comprised of single phase β(Ti, Mo) alloy. In both aspects, particulate emission during sputtering is reduced. Methods of preparing the targets, methods of bonding targets together to produce large area sputter targets, and films produced by the targets, are also provided. | 04-28-2011 |
20110303535 | SPUTTERING TARGETS AND METHODS OF FORMING THE SAME - In various embodiments, sputtering targets incorporate an intermediate plate having a coefficient of thermal expansion (CTE) between a CTE of the backing plate and a CTE of the target material. | 12-15-2011 |
20120189483 | Methods of forming molybdenum sputtering targets - In various embodiments, tubular sputtering targets are produced by forming a tubular billet at least by pressing molybdenum powder in a mold and sintering the pressed molybdenum powder, working the tubular billet to form a worked billet, and heat treating the worked billet. | 07-26-2012 |
20120251714 | FINE GRAINED, NON BANDED, REFRACTORY METAL SPUTTERING TARGETS WITH A UNIFORMLY RANDOM CRYSTALLOGRAPHIC ORIENTATION, METHOD FOR MAKING SUCH FILM, AND THIN FILM BASED DEVICES AND PRODUCTS MADE THEREFROM - In various embodiments, sputtering targets are refurbished by spray-depositing a powder within a furrow in the sputtering target to form a layer therein. | 10-04-2012 |
20130224059 | METHODS OF FORMING MOLYBDENUM SPUTTERING TARGETS - In various embodiments, planar sputtering targets are produced by forming a billet at least by pressing molybdenum powder in a mold and sintering the pressed powder, working the billet to form a worked billet, heat treating the worked billet, working the worked billet to form a final billet, and heat treating the final billet. | 08-29-2013 |
20130337159 | METHODS OF REJUVENATING SPUTTERING TARGETS - In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material. | 12-19-2013 |
20140299466 | HIGH-DENSITY METALLIC SPUTTERING TARGETS - The present invention is directed to a process for producing high density, refractory metal products via a press/sintering process. The invention is also directed to a process for producing a sputtering target and to the sputtering target so produced. | 10-09-2014 |
20150034477 | FINE GRAINED, NON BANDED, REFRACTORY METAL SPUTTERING TARGETS WITH A UNIFORMLY RANDOM CRYSTALLOGRAPHIC ORIENTATION, METHOD FOR MAKING SUCH FILM, AND THIN FILM BASED DEVICES AND PRODUCTS MADE THEREFROM - In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films. | 02-05-2015 |