Patent application number | Description | Published |
20130280550 | DEVICE HOUSING AND METHOD FOR MAKING THE SAME - A device housing includes a metallic substrate, a pattern element formed in the substrate, and a transparent or translucent decorative layer formed on the substrate and the pattern layer. The substrate defines a receiving space therein, and the pattern element is formed in the receiving space. The pattern element is made of thermosetting plastic. A method for making the device housing is also described. | 10-24-2013 |
20130321988 | ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME - An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed. | 12-05-2013 |
20150153782 | DISPLAY DEVICE, PORTABLE ELECTRONIC DEVICE USING THE SAME AND MANUFACTURING METHOD - A display device includes a display, a receiving member, and a buffer member. The receiving member includes a peripheral wall. The buffer member is attached to the receiving member. The display is received in an interior of the peripheral wall of the receiving member and the buffer member is positioned at an exterior of the peripheral wall of the receiving member. | 06-04-2015 |
20150245520 | HOUSING, ELECTRONIC DEVICE USING THE SAME - A housing includes a main body, the main body includes a plurality of metal sheets and a plurality of resin layers, each metal sheet alternates with one resin layer, each two adjacent metal sheets are fixed together by one resin layer located between the two metal sheets. An electronic device using the housing is also provided. | 08-27-2015 |
Patent application number | Description | Published |
20090026244 | Driver Guiding Set for Power Nail Gun - A driver guiding set for a power nail gun includes a forward plate fixedly disposed at a bottom portion of the gun body, with a surface entirely being flat for supporting the striking blade from one side; a first rearward plate fixedly mounted to the forward plate for supporting the striking blade from the other side; a first magazine rail fixedly disposed on the first rearward plate; a second magazine rail slidably disposed on the first magazine rail; a second rearward plate fixedly mounted to the second magazine rail, which is capable of locating at a first position to engage with the first rearward plate and contact on the forward plate, and locating at a second position to be separated from the forward plate and the first rearward plate, so that the second rearward plate is capable of moving between the first and second positions; and a nail guiding track formed between the first and the second rearward plates when the second rearward plate is located at the first position, for guiding the striking blade to strike a nail therein. The first rearward plate includes a protruding side wall disposed at a bottom thereof and adjacent to the nail guiding track, and when a nail is locked in the nail guiding track, the second rearward plate is moved to the second position and the nail guiding track is opened without blocking by the protruding side wall so that the locked nail is removed. | 01-29-2009 |
20090038277 | Compressed air Filter Assembly for Nail Gun - An exemplary compressed air filter assembly for nail gun has an end cap at a handle of the nail gun, having an inlet aperture for guiding external compressed air therein, communicating with a main air chamber of the handle; an inlet pipe extending in the inlet aperture and the main air chamber, having a ring-shaped step formed at an inner peripheral surface of a sidewall thereof; and a filter disposed at the inlet pipe. At least one bar is provided at the sidewall of the inlet pipe, transversely disposed in the inlet aperture, and the filter being disposed between the at least one bar and the ring-shaped step. The compressed air filter assembly for nail gun utilize the at least one bar to support a center portion of the filter, which can improve the strength of the filter to resist the blasting of the compressed air. | 02-12-2009 |
Patent application number | Description | Published |
20100234970 | METHOD AND APPARATUS FOR ADVANCED PROCESS CONTROL - A method includes: initializing first and second variables; operating equipment based on the variables; measuring first and second parameters; determining a new value for the first variable based on the first parameter, and calculating a new value for the second variable based on the second parameter and the current value of the second variable; and repeating the operating, measuring, determining and calculating. According to a different aspect, an apparatus includes a computer-readable medium storing a computer program. When executed, the program causes: initializing of first and second variables; operating equipment based on the variables; receiving measured first and second parameters; determining a new value for the first variable based on the first parameter, and calculating a new value for the second variable based on the second parameter and the current value of the second variable; and repeating the operating, measuring, determining and calculating. | 09-16-2010 |
20100292824 | SYSTEM AND METHOD FOR IMPLEMENTING A WAFER ACCEPTANCE TEST ("WAT") ADVANCED PROCESS CONTROL ("APC") WITH NOVEL SAMPLING POLICY AND ARCHITECTURE - System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process. | 11-18-2010 |
20110238198 | METHOD AND SYSTEM FOR IMPLEMENTING VIRTUAL METROLOGY IN SEMICONDUCTOR FABRICATION - The present disclosure provides a method of fabricating a semiconductor device. The method includes collecting a plurality of manufacturing data sets from a plurality of semiconductor processes, respectively. The method includes normalizing each of the manufacturing data sets in a manner so that statistical differences among the manufacturing data sets are reduced. The method includes establishing a database that includes the normalized manufacturing data sets. The method includes normalizing the database in a manner so that the manufacturing data sets in the normalized database are statistically compatible with a selected one of the manufacturing data sets. The method includes predicting performance of a selected one of the semiconductor processes by using the normalized database. The selected semiconductor process corresponds to the selected manufacturing data set. The method includes controlling a semiconductor processing machine in response to the predicted performance. | 09-29-2011 |
20110320026 | SYSTEM AND METHOD FOR DATA MINING AND FEATURE TRACKING FOR FAB-WIDE PREDICTION AND CONTROL - System and method for data mining and feature tracking for fab-wide prediction and control are described. One embodiment is a system comprising a database for storing raw wafer manufacturing data; a data mining module for processing the raw wafer manufacturing data to select the best data therefrom in accordance with at least one of a plurality of knowledge-, statistic-, and effect-based processes; and a feature tracking module associated with the data mining module and comprising a self-learning model wherein a sensitivity of the self-learning model is dynamically tuned to meet real-time production circumstances, the feature tracking module receiving the selected data from the data mining module and generating prediction and control data therefrom; wherein the prediction and control data are used to control future processes in the wafer fabrication facility. | 12-29-2011 |
20120130525 | ADAPTIVE AND AUTOMATIC DETERMINATION OF SYSTEM PARAMETERS - A MIMO optimizer is used to identify tunable process parameters for processing equipment. | 05-24-2012 |
20130144419 | INTEGRATED CIRCUIT MANUFACTURING TOOL CONDITION MONITORING SYSTEM AND METHOD - A system and method for monitoring a process tool of an integrated circuit manufacturing system are disclosed. An exemplary method includes defining zones of an integrated circuit manufacturing process tool; grouping parameters of the integrated circuit manufacturing process tool based on the defined zones; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters. | 06-06-2013 |
20130150997 | METHOD AND SYSTEM FOR TOOL CONDITION MONITORING - A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool. | 06-13-2013 |
20140067324 | QUALITATIVE FAULT DETECTION AND CLASSIFICATION SYSTEM FOR TOOL CONDITION MONITORING AND ASSOCIATED METHODS - The present disclosure provides various methods for tool condition monitoring, including systems for implementing such monitoring. An exemplary method includes receiving data associated with a process performed on wafers by an integrated circuit manufacturing process tool; and monitoring a condition of the integrated circuit manufacturing process tool using the data. The monitoring includes evaluating the data based on an abnormality identification criterion, an abnormality filtering criterion, and an abnormality threshold to determine whether the data meets an alarm threshold. The method may further include issuing an alarm when the data meets the alarm threshold. | 03-06-2014 |
20140074258 | ADAPTIVE AND AUTOMATIC DETERMINATION OF SYSTEM PARAMETERS - A method of automatically determining process parameters for processing equipment includes processing at least one first substrate in the processing equipment at a first time; and processing at least one second substrate in the processing equipment at a second time. The method includes collecting data on process monitors for the at least one first substrate; and the at least one second substrate. The method includes receiving the data by a multiple-input-multiple-output (MIMO) optimization system. The method includes revising a sensitivity matrix, by a MIMO optimizer, using the data and an adaptive-learning algorithm, wherein the adaptive-learning algorithm revises the sensitivity matrix based on a learning parameter which is related to a rate of change of the processing equipment over time. The method includes determining a set of process parameters for the processing equipment by the MIMO optimizer, wherein the MIMO optimizer uses the revised sensitivity matrix to determine the process parameters. | 03-13-2014 |
20140207271 | TOOL OPTIMIZING TUNING SYSTEMS AND ASSOCIATED METHODS - The present disclosure provides various methods for tuning process parameters of a process tool, including systems for implementing such tuning. An exemplary method for tuning process parameters of a process tool such that the wafers processed by the process tool exhibit desired process monitor items includes defining behavior constraint criteria and sensitivity adjustment criteria; generating a set of possible tool tuning process parameter combinations using process monitor item data associated with wafers processed by the process tool, sensitivity data associated with a sensitivity of the process monitor items to each process parameter, the behavior constraint criteria, and the sensitivity adjustment criteria; generating a set of optimal tool tuning process parameter combinations from the set of possible tool tuning process parameter combinations; and configuring the process tool according to one of the optimal tool tuning process parameter combinations. | 07-24-2014 |
20150162166 | SYSTEM AND METHOD FOR CONTROLLING ION IMPLANTER - A system, a method, and a non-transitory computer readable storage medium for controlling an ion implanter are disclosed herein. The system includes a sample module and a control module. The sample module is configured to generate a summarized value from process data of the ion implanter, and the process data correspond to a control parameter. The control module is configured to tune a control parameter, and the control module performs an ion implantation by releasing tools of the ion implanter in accordance with the control parameter when the summarized value meets a predetermined stability requirement. | 06-11-2015 |