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Pirogovsky
Joseph Pirogovsky, Glenview, IL US
| Patent application number | Description | Published |
|---|---|---|
| 20080307737 | Insulation Blanket System - The present invention discloses a thermal insulating blanket ( | 12-18-2008 |
Peter Pirogovsky, Portland, OR US
| Patent application number | Description | Published |
|---|---|---|
| 20100059490 | ADAPTIVE OPTIC BEAMSHAPING IN LASER PROCESSING SYSTEMS - A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M | 03-11-2010 |
| 20100078418 | METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY - A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape. | 04-01-2010 |
| 20100248451 | Method for Laser Singulation of Chip Scale Packages on Glass Substrates - An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput. | 09-30-2010 |
Peter Y. Pirogovsky, Portland, OR US
| Patent application number | Description | Published |
|---|---|---|
| 20090242525 | LASER MACHINING OF FIRED CERAMIC AND OTHER HARD AND/OR THICK MATERIALS - Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf. | 10-01-2009 |