Patent application number | Description | Published |
20100141330 | POWER-DOWN CIRCUIT WITH SELF-BIASED COMPENSATION CIRCUIT - A circuit includes a first power supply node at a first power supply voltage; a gated-node; and a first control device coupled between the first power supply node and the gated-node. The first control device is configured to pass the first power supply voltage to the gated-node or to disconnect the gated-node from the first power supply voltage. A second control device is coupled between the first power supply node and the gated-node. The second control device is configured to pass a gated-voltage to the gated-node or disconnect the gated-node from the gated-voltage. A voltage-drop device is coupled between the first power supply node and the gated-node, wherein the voltage-drop device is serially connected with the second control device. A negative-feedback current source is connected in parallel with the voltage-drop device. The negative-feedback current source is configured to provide a current tracking a variation of the gated-voltage at the gated-node. | 06-10-2010 |
20110080201 | DIGITAL LOGIC CIRCUITS HAVING A PULSE WIDTH TIMING CIRCUIT - A pulse width timing includes a first complementary resistor-capacitor (RC) circuit having an input for receiving an input signal, and a second complementary RC circuit coupled to an output of the first complementary RC circuit, wherein the first and second complementary RC circuits cooperate to produce an output signal based on the input signal, the output signal being delayed and having an adjusted pulse width with respect to the input signal. | 04-07-2011 |
20130038418 | CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL - A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | 02-14-2013 |
20130161811 | 3D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION - A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die. | 06-27-2013 |
20130302942 | 3D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION - A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die. | 11-14-2013 |
20140256063 | CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL - A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | 09-11-2014 |
20140268078 | ELECTRON BEAM LITHOGRAPHY SYSTEMS AND METHODS INCLUDING TIME DIVISION MULTIPLEX LOADING - The present disclosure provides a systems and methods for e-beam lithography. One system includes an electron source operable to produce a beam and an array of pixels operable to pattern the beam. Control circuitry is spaced a distance from and coupled to the array of pixels. The control circuitry uses time domain multiplex loading (TMDL) to control the array of pixels. | 09-18-2014 |
20150131077 | ELECTRON BEAM LITHOGRAPHY METHODS INCLUDING TIME DIVISION MULTIPLEX LOADING - An embodiment of a method of lithography includes generating a beam of electrons. A first pixel and a second pixel are each configured to pattern the beam. Using time domain multiplex loading, the first and second pixels are controlled such that the beam is patterned. The patterning includes receiving a first clock signal and using the first clock signal to generate a second clock signal and a third clock signal. The second clock signal is sent to the first pixel and sending the third clock signal is sent to the second pixel. | 05-14-2015 |