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Pin-Chia
Pin-Chia Lee, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120074959 | COIN DETECTOR - A coin detector includes an oscillator circuit using an oscillator for generating a magnetizing signal of a predetermined oscillation frequency and an eddy current sensor for producing an AC magnetic field for sensing the variation of the inductance of an eddy current produced upon passing of a coin, a FM demodulator and an AM demodulator respectively electrically coupled to the oscillator circuit by a respective buffer for demodulating the voltage frequency and voltage amplitude of the oscillation signal outputted by the oscillator circuit, and a recognition logic unit for computing the demodulated FM signal outputted by the FM demodulator and the demodulated AM signal outputted by the AM demodulator by means of using time as a parameter to recognize the authenticity and value of the sensed coin. | 03-29-2012 |
Pin-Chia Su, Shanhua TW
| Patent application number | Description | Published |
|---|---|---|
| 20110062375 | SILICON WAFER RECLAMATION PROCESS - An etchant for removing a porous low-k dielectric layer on a semiconductor substrate includes a hydrofluoric acid-based solvent, a dilating additive for dilating the pores in the porous low-k dielectric, and a passivating additive that forms a passivation layer at the interface between the low-k dielectric layer and the semiconductor substrate. | 03-17-2011 |
Pin-Chia Su, Tainan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100008013 | METHOD AND APPARATUS FOR SAFELY DECHUCKING WAFERS - A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a sensor attached to the driving means for detecting a change in the variable quantity; and a controller for controlling the variable quantity to the driving means when a predetermined variable quantity is detected in comparison to the change in the variable quantity for a predetermined time. | 01-14-2010 |
| 20100008014 | METHOD AND APPARATUS FOR SUCURELY DECHUCKING WAFERS - A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected. | 01-14-2010 |
| 20110310525 | SYSTEM FOR SECURELY DECHUCKING WAFERS - A system for chucking and de-chucking a work piece comprises a wafer stage having a chuck support for supporting a chuck. The wafer stage further comprises a chuck mounted on the chuck support for receiving and attaching the work piece thereto; a support lift means for supporting the work piece; a driving means coupled to the support lift means for gradually raising the support lift means to contact the work piece in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected. | 12-22-2011 |
Pin-Chia Su, Shanhua Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20090087929 | METHOD AND SYSTEM FOR IMPROVING WET CHEMICAL BATH PROCESS STABILITY AND PRODUCTIVITY IN SEMICONDUCTOR MANUFACTURING - A chemical processing bath and system used in semiconductor manufacturing utilizes a dynamic spiking model that essentially constantly monitors chemical concentration in the processing bath and adds fresh chemical on a regular basis to maintain chemical concentrations at desirable levels. Etch rates and etch selectivities are maintained at desirable levels and contamination from undesirable precipitation is avoided. The system and method automatically compare concentration levels to a plurality of control limits associated with various technologies and identify the technology or technologies that may undergo processing. | 04-02-2009 |
| 20090111269 | SILICON WAFER RECLAMATION PROCESS - By exposing a process control wafer having a porous low-k-dielectric layer thereon in an HF-based low-k dielectric etching solvent comprising a dilating additive and a passivating additive, the pores in the low-k dielectric layer are dilated some of which connect with one another to form one or more continuous channels extending through the thickness of the dielectric layer and allowing the HF-based solvent to reach down to the substrate. Then the passivating additive component of the HF-based etching solvent forms a passivation layer at the dielectric layer and the substrate interface that protects substrate from the HF-based etchant. | 04-30-2009 |
| 20090233447 | CONTROL WAFER RECLAMATION PROCESS - A method of recycling a control wafer having a dielectric layer deposited thereon involves removing most of the dielectric layer by plasma etching leaving a residual film of the dielectric and then removing the residual dielectric film by a wet etching process. The combination of the dry and wet etching provides effective removal of the dielectric material without damaging the wafer substrate and any residual wet etching byproduct particulate remaining on the wafer substrate is then removed by APM cleaning and scrubbing. | 09-17-2009 |
| 20110223767 | CONTROL WAFER RECLAMATION PROCESS - A method of recycling a control wafer having a low-k dielectric layer deposited thereon involves etching a portion of the low-k dielectric layer using a plasma resulting in a residual film of the low-k dielectric layer and byproduct particulates of carbon on the substrate. The residual dielectric film is removed by wet etching with a low polarization organic solvent that includes HF and a surfactant. | 09-15-2011 |