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Pillalamarri
Kaushhik Pillalamarri, Irving, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20100082773 | SCREEN SCRAPING INTERFACE - An interface can serve as a client-mainframe interface, enabling clients to develop applications without a need to understand mainframe processes and screen flows. Extended Tool Command Language (Tcl) can define services that can include a series of interactions with a mainframe system and service definitions can be added or updated on the interface during operation of the interface without disrupting processing. The service definitions can enable the interface to receive XML requests from a client, parse the XML requests, execute the service scripts to interact with the mainframe systems, generate the result in a XML format and send the XML file back to the client. Fundamental Mainframe Interactions (FMI) commands can interact with the mainframe systems and enable the specification of the XML structure of the request and response. The interface can provide efficient connection pooling management and connection life cycle control to improve the performance of the mainframe system interactions. | 04-01-2010 |
Shyam Prasad Pillalamarri, Los Altos Hills, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100100888 | Resource allocation - A technique for executing a segmented virtual machine (VM) is disclosed. A plurality of core VM's is implemented in a plurality of core spaces. Each core VM is associated with one of a plurality of shell VM's. Resources of the core spaces are allocated among the core VM's. | 04-22-2010 |
Sunil K. Pillalamarri, Eagan, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20090038750 | HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS - New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process. | 02-12-2009 |
| 20100206479 | HIGH-TEMPERATURE, SPIN-ON, BONDING COMPOSITIONS FOR TEMPORARY WAFER BONDING USING SLIDING APPROACH - New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process. | 08-19-2010 |
| 20110065257 | HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS - New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process. | 03-17-2011 |
Sunil K. Pillalamarri, Austin, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20080200011 | HIGH-TEMPERATURE, SPIN-ON, BONDING COMPOSITIONS FOR TEMPORARY WAFER BONDING USING SLIDING APPROACH - New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process. | 08-21-2008 |