Patent application number | Description | Published |
20120149158 | FLATTENING METHOD OF A SUBSTRATE - A method of flattening a substrate includes forming a metal layer on an upper surface of a substrate, forming a photoresist layer covering the substrate and the metal layer, radiating light to the photoresist layer, through a lower surface of the substrate opposite to the upper surface, exposing the metal layer by developing the photoresist layer, exposing the upper surface of the substrate by etching the metal layer, etching the exposed upper surface of the substrate, and removing the photoresist layer. | 06-14-2012 |
20140124786 | THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - The present invention relates to a thin film transistor array panel and a manufacturing method thereof that prevent disconnection of wiring due to misalignment of a mask, and simplify a process and reduce cost by reducing the number of masks. The thin film transistor array panel according to the disclosure includes a source electrode enclosing an outer part of the first contact hole and formed on the second insulating layer; a drain electrode enclosing an outer part of the second contact hole and formed on the second insulating layer; a first connection electrode connecting the source region of the semiconductor layer and the source electrode through the first contact hole; and a second connection electrode connecting the drain region of the semiconductor layer and the drain electrode through the second contact hole. | 05-08-2014 |
20140242515 | PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING DISPLAY DEVICE USING SAME - A photoresist composition including a binder resin including a novolac resin represented by Chemical Formula 1, a diazide photosensitive initiator, and a solvent including a base solvent and an auxiliary solvent, wherein the base solvent includes propylene glycol monomethyl ether acetate, and the auxiliary solvent includes dimethyl-2-methylglutarate and ethyl beta-ethoxypropionate, | 08-28-2014 |