Phua
Chee Keong Phua, Cupertino, CA US
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20140151846 | SHIELDING SILICON FROM EXTERNAL RF INTERFERENCE - Consistent with an example embodiment, there is an integrated circuit device (IC) built on a substrate of a thickness. The IC comprises an active device region of a shape, the active device region having a topside and an underside. Through silicon vias (TSVs) surround the active device region, the TSVs having a depth defined by the substrate thickness. On the underside of and having the shape of the active device region, is an insulating layer. A thin-film conductive shield is on the insulating layer, the conductive shield is in electrical contact with the TSVs. | 06-05-2014 |
Chee Teck Phua, Singapore SG
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20090203988 | Apparatus And Method For Non-Invasively Sensing Pulse Rate And Blood Flow Anomalies - The present invention provides an apparatus and method for non-invasively sensing pulse rate and blood flow anomalies using a localized, uni-directional, and constant magnetic field. The apparatus comprises a magnetic source for producing the magnetic field, a signal acquisition module with a magnetic sensor for detecting the modulations of the magnetic field caused by the blood flow; and a signal processing module for processing the acquired signals so as to produce data of pulse rate and blood flow anomalies. The method senses pulse rate and blood flow anomalies by providing a localized, uni-directional, and constant magnetic field in proximity to a blood vessel; detecting the variations of the magnetic field caused by the flow of pulsatile blood within the blood vessel; and processing the signals of the detected variations so as to monitor the blood flow. | 08-13-2009 |
20100042006 | Packages Of Apparatus For Non-Invasive Detection Of Pulse Rate And Blood Flow Anomalies - The present invention provides a package for an apparatus for non-invasively monitoring of blood flow of an object, a magnetic field sensing device, and a magnetic source positioning device. | 02-18-2010 |
Cheng Siong Phua, Singapore SG
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20120257945 | THREADED FASTENER - A threaded fastener having a threaded portion with a ratio of pitch diameter to minor diameter less than 1.28, and the threaded portion with a major diameter portion, a leading flank having a normal angle between 10° and 60°, a trailing flank having a normal angle between 1° and 30°, and a shank portion extending between the trailing flank and the leading flank of adjacent threads of a arcuate surface having a radius greater than the thread height. The arcuate surface forming the shank portion may have a radius between 1.2 and 1.8 times the thread height. | 10-11-2012 |
20130336744 | THREADED MASONRY FASTENER - A thread forming fastener for use in concrete, masonry, brick, and the like, having a first thread, second thread, and third thread about a shank, the second thread having a major diameter greater than the major diameter of at least one of the first and third threads with grooves on either side of the second thread adapted to accommodate chips of material during fastening, and the second thread having notches in the major diameter of at least one turn adapted to engage at least one of concrete, masonry, and brick, a helical land axially extending between the third thread and adjacent first thread having an outside diameter greater than the minor diameter and less than the major diameter of the first thread and third thread, the axial land width between the third thread and adjacent first thread being at least 25% of the thread pitch. | 12-19-2013 |
20140003883 | SELF-CLINCHING FASTENER | 01-02-2014 |
Han Tian Phua, Singapore SG
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20140125724 | INK BARRIER FOR OPTICAL SENSOR IN INKJET PRINTER - A carriage assembly for an inkjet printer, the carriage assembly includes an inkjet printhead having a printhead die with an array of nozzles, and a holding receptacle for the inkjet printhead. The holding receptacle includes a bottom portion having an opening into which the printhead die extends. A viewing hole is disposed in the bottom portion of the holding receptacle for providing an optical pathway for an optical sensor. A barrier projects from the bottom portion between the opening and the viewing hole for impeding the flow of ink toward the viewing hole. | 05-08-2014 |
Hui Ying Alexa Phua, Singapore SG
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20120140975 | METHOD FOR OPTIMIZING PERFORMANCE OF A MULTI-TRANSDUCER EARPIECE AND A MULTI-TRANSDUCER EARPIECE - There is provided a method for optimizing performance of a multi-transducer earpiece, where the multi-transducer earpiece includes a perpendicular flange that partitions the cross sectional area of the acoustic delivery channel in a manner where mixing of signals from both the high frequency transducer and the mid/low frequency transducer is carried out in the ear canal of a user during reproduction of audio signals. | 06-07-2012 |
Jason Phua, Singapore SG
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20090286167 | CROSS TECHNOLOGY RETICLES - A method of fabricating a device is presented. The method includes forming a mask that includes multiple images. A substrate is patterned using the mask. An image of the multiple images corresponds to a respective patterning process. The substrate is processed further to complete the processing of the substrate to form the desired function of the device. | 11-19-2009 |
Josephine Phua, San Jose, CA US
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20090007030 | DESIGN-BASED MONITORING - A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the PDP comprising an indication of a site in a layer of the IC that is susceptible to a process fault. Upon fabricating the layer of the IC on the wafer, a process monitoring tool is applied to perform a measurement at the site in the layer responsively to the PDP. | 01-01-2009 |
Kia-Ming Phua, New Taipei TW
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20140344364 | ELECTRONIC DEVICE AND METHOD FOR SHARING COURSE SYLLABUS OF THE ELECTRONIC DEVICE - In a method for an electronic device to share a course syllabus, contents of the course syllabus are obtained from an input device of the electronic device. The method generates the course syllabus according to the inputted contents, and sets different sharing authorities of the course syllabus corresponding to different operators. Each sharing authority includes an access authority for accessing contents of the course syllabus. The course syllabus is uploaded to a server connected to the electronic device. When an operator accesses the course syllabus stored in the server, an operation requirement is sent from the electronic device to the server. When the course syllabus is found by the server according to the operation requirement, the method receives contents of the course syllabus sent from the server according to an access authority of the operator. | 11-20-2014 |
20140358992 | IMAGES MONITORING AND BROADCASTING SYSTEM AND METHOD - An image monitoring and broadcasting method is executed by a first electronic device. A user interface of the first electronic device is displayed. When a monitoring or a broadcasting command is received from the user interface, the method acquires connection information of the second electronic devices which have been connected to the server. If the monitoring command is received, the method transmits connection information of the first electronic device and a preset monitoring notice to the second electronic devices, receives images transmitted from the second electronic devices to be displayed on the user interface. If the broadcasting command is received, the method transmits a preset broadcasting notice images displayed on the first display screen to the second electronic devices. | 12-04-2014 |
Kok Soon Phua, Singapore SG
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20110191350 | METHOD AND SYSTEM FOR CONCENTRATION DETECTION - A method and system for concentration detection. The method for concentration detection comprises the steps of extracting temporal features from brain signals; classifying the extracted temporal features using a classifier to give a score x | 08-04-2011 |
20130138011 | BRAIN-COMPUTER INTERFACE SYSTEM AND METHOD - A system and method for brain-computer interface (BCI) based interaction. The method comprising the steps of: acquiring a person's EEG signal; processing the EEG signal to determine a motor imagery of the person; detecting a movement of the person using a detection device; and providing feedback to the person based on the motor imagery, the movement, or both; wherein providing the feedback comprises activating a stimulation element of the detection device for providing a stimulus to the person. The system comprising: means for acquiring a person's EEG signal; means for processing the EEG signal to determine a motor imagery of the person; means for detecting a movement of the person using a detection device; and means for providing feedback to the person based on the motor imagery, the movement, or both; wherein the means for providing the feedback comprises a stimulation element of the detection device for providing a stimulus to the person. | 05-30-2013 |
20140018694 | METHOD AND SYSTEM FOR MOTOR REHABILITATION - A method of calibrating a motor imagery detection module and a system for motor rehabilitation are provided. The method comprises acquiring Electroencephalography (EEG) data from a subject; selecting classification features from the EEG data; wherein the feature selection comprises modelling an idle state ω | 01-16-2014 |
Ooi Yong Phua, Hong Kong HK
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20160004008 | GUIDING LIGHT PLATFORM - A guiding light platform includes a frame having a side plate, a top light-transmitting plate covering top of the frame, a bottom plate covering bottom of the frame, a LED strip mounted on the frame, and a separation plate mounted between the LED strip and the bottom plate. A top inner portion of the side plate is formed with a slanted surface disposed underneath and at an angle with respect to a bottom surface of the top light-transmitting plate to thereby define a space for receiving therein a waterproof adhesive. | 01-07-2016 |
Seow Khee Phua, Singapore SG
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20090252631 | MAGNETIC TRAP FOR FERROUS CONTAMINANTS IN LUBRICANT - A compressor includes a tubular vertical shaft, which rotates about its vertical axis, a cylinder block for supporting the tubular vertical shaft, a rotor for driving the rotation of the tubular vertical shaft, and a stator affixed to the cylinder block. A lubricant is channelled from the lower end of the tubular vertical shaft through an inlet of its interior path to the outlet. A magnet is disposed within the interior path to trap ferrous contaminants in he lubricant before the lubricant is distributed to other parts of the compressor. | 10-08-2009 |
Swee Hoe Phua, Singapore SG
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20110081993 | GOLF TEE AND METHOD OF PRODUCING A GOLF TEE - A golf tee ( | 04-07-2011 |
20130231203 | GOLF TEE AND METHOD OF PRODUCING A GOLF TEE - A golf tee | 09-05-2013 |
Teng Soong Phua, Singapore SG
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20150287822 | SEMICONDUCTOR DEVICE PRODUCTION METHOD AND SEMICONDUCTOR DEVICE - A semiconductor device production method includes a first step of forming a planar silicon layer on a silicon substrate and forming first and second pillar-shaped silicon layers on the planar silicon layer; a second step of forming a gate insulating film around the first and second pillar-shaped silicon layers, forming a metal film and a polysilicon film around the gate insulating film, controlling a thickness of the polysilicon film to be smaller than a half of a distance between the first and second pillar-shaped silicon layers, depositing a resist, exposing the polysilicon film on side walls of upper portions of the first and second pillar-shaped semiconductor layers, etching-away the exposed polysilicon film, stripping the third resist, and etching-away the metal film; and a third step of forming a resist for forming a gate line and performing anisotropic etching to form a gate line and first and second gate electrodes. | 10-08-2015 |
Teo Chye Phua, Singapore SG
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20100110733 | Self-Coupled Driver Used In Dual-Switch Forward Power Converter - A dual-switch forward power converter, and a method of operating the same, employs a self-coupled driver to achieve among other advantages higher efficiency, lower part count and component cost. In one aspect of the present invention, a power converter comprises a transformer and two switching transistors, and said transformer has two serially-connected primary windings with the first winding connected to a first switching transistor which is biased by a pulse controller, and the second winding couples the voltage across said first winding to bias the second switching transistor. In addition, the circuit on the primary side of said transformer further comprises means of dissipating magnetization current and the circuit on the secondary side comprises a rectifier and a low-pass filter. | 05-06-2010 |
Timothy Phua, Singapore SG
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20100230744 | RELIABLE MEMORY CELL - A method of forming a semiconductor device is presented. A substrate prepared with a second gate is provided. The second gate is processed to form a second gate with a rounded corner and a first gate is formed on the substrate. The first gate is adjacent to and overlaps a portion of the second gate and the rounded corner. | 09-16-2010 |
Yoke Hor Phua, Singapore SG
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20130087931 | Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure - A semiconductor wafer has a plurality of semiconductor die distributed over a surface area. The semiconductor die are singulated from the semiconductor wafer. The semiconductor die are mounted to a carrier to form a reconstituted semiconductor wafer. The carrier has a surface area 10-50% larger than the surface area of the semiconductor wafer. The number of semiconductor die mounted to the carrier is greater than a number of semiconductor die singulated from the semiconductor wafer. The reconstituted wafer is mounted within a chase mold. The chase mold is closed with the semiconductor die disposed within a cavity of the chase mold. An encapsulant is dispersed around the semiconductor die within the cavity under temperature and pressure. The encapsulant can be injected into the cavity of the chase mold. The reconstituted wafer is removed from the chase mold. An interconnect structure is formed over the reconstituted wafer. | 04-11-2013 |
20130127018 | Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure - A semiconductor wafer has a plurality of semiconductor die distributed over a surface area. The semiconductor die are singulated from the semiconductor wafer. The semiconductor die are mounted to a carrier to form a reconstituted semiconductor wafer. The carrier has a surface area 10-50% larger than the surface area of the semiconductor wafer. The number of semiconductor die mounted to the carrier is greater than a number of semiconductor die singulated from the semiconductor wafer. The reconstituted wafer is mounted within a chase mold. The chase mold is closed with the semiconductor die disposed within a cavity of the chase mold. An encapsulant is dispersed around the semiconductor die within the cavity under temperature and pressure. The encapsulant can be injected into the cavity of the chase mold. The reconstituted wafer is removed from the chase mold. An interconnect structure is formed over the reconstituted wafer. | 05-23-2013 |
20130256923 | Semiconductor Device and Method of Forming Reconstituted Wafer With Larger Carrier to Achieve More EWLB Packages Per Wafer with Encapsulant Deposited Under Temperature and Pressure - A semiconductor wafer has a plurality of semiconductor die distributed over a surface area. The semiconductor die are singulated from the semiconductor wafer. The semiconductor die are mounted to a carrier to form a reconstituted semiconductor wafer. The carrier has a surface area 10-50% larger than the surface area of the semiconductor wafer. The number of semiconductor die mounted to the carrier is greater than a number of semiconductor die singulated from the semiconductor wafer. The reconstituted wafer is mounted within a chase mold. The chase mold is closed with the semiconductor die disposed within a cavity of the chase mold. An encapsulant is dispersed around the semiconductor die within the cavity under temperature and pressure. The encapsulant can be injected into the cavity of the chase mold. The reconstituted wafer is removed from the chase mold. An interconnect structure is formed over the reconstituted wafer. | 10-03-2013 |
20130292673 | Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure - A semiconductor wafer has a plurality of semiconductor die distributed over a surface area. The semiconductor die are singulated from the semiconductor wafer. The semiconductor die are mounted to a carrier to form a reconstituted semiconductor wafer. The carrier has a surface area 10-50% larger than the surface area of the semiconductor wafer. The number of semiconductor die mounted to the carrier is greater than a number of semiconductor die singulated from the semiconductor wafer. The reconstituted wafer is mounted within a chase mold. The chase mold is closed with the semiconductor die disposed within a cavity of the chase mold. An encapsulant is dispersed around the semiconductor die within the cavity under temperature and pressure. The encapsulant can be injected into the cavity of the chase mold. The reconstituted wafer is removed from the chase mold. An interconnect structure is formed over the reconstituted wafer. | 11-07-2013 |
20140252641 | Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package - A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die. A second prefabricated insulating film is disposed over the first prefabricated insulating film. | 09-11-2014 |
Yong Soon Phua, Sembawang SG
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20140056714 | TURBOMACHINE ROTOR HAVING DOVETAIL SLOT AND METHOD OF MACHINING - Various embodiments include a rotor having a dovetail slot with a bulbous fillet region, and in some cases, recessed inclined bearing surfaces. Various embodiments include methods of forming such a slot in a turbomachine rotor. | 02-27-2014 |