Patent application number | Description | Published |
20100052145 | SEMICONDUCTOR PACKAGE AND METHOD THEREFOR - In one embodiment, a semiconductor package is formed to include a tamper barrier that is positioned between at least a portion of the connection terminals of the semiconductor package and an edge of the semiconductor package. | 03-04-2010 |
20100187663 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE THEREFOR - A semiconductor component having wetable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components. | 07-29-2010 |
20110068451 | MULTI-CHIP SEMICONDUCTOR CONNECTOR - In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die. | 03-24-2011 |
20110281397 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE THEREFOR - A semiconductor component having wetable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components. | 11-17-2011 |
20110298115 | SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE - A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component is configured to permit the determination of circuit parameters. A high side FET has a gate terminal coupled to an output terminal of a high side gate drive circuit, a drain terminal coupled for receiving an input voltage, and a source terminal coupled to the drain terminal of a low side FET. The gate terminal of the low side FET is coupled to the output terminal of low side drive circuit and the source terminal of the low side FET is coupled for receiving a source of operating potential. The high side gate drive circuit has a bias terminal coupled for receiving a floating potential where the bias terminal is electrically isolated or decoupled from the commonly connected source and drain terminals of the high side FET and the low side FET, respectively. | 12-08-2011 |
20130154073 | METHOD OF FORMING A SEMICONDUCTOR DEVICE AND LEADFRAME THEREFOR - In one embodiment, a leadframe for a semiconductor package includes a source connection area for one transistor and a drain connection point for a second transistor, and a common connection for using a connection clip to couple a drain of the first transistor to a source of the second transistor and to the common connection. | 06-20-2013 |
20140151883 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE THEREFOR - A semiconductor component having wettable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components. | 06-05-2014 |
20140239472 | DUAL-FLAG STACKED DIE PACKAGE - In one embodiment, a semiconductor package includes a first and a second die flag, wherein the first and second die flags are separated by a gap. First and second metal oxide semiconductor field effect transistor (MOSFET) die are on the first and the second die flags, respectively. A power control integrated circuit (IC) is stacked on top of at least one of the first or the second MOSFET die. A mold compound is encapsulating the power control IC, the first and second MOSFET die, and the first and second die flags. | 08-28-2014 |
20150035166 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE - A semiconductor component having wettable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. The mold compound is separated to form singulated semiconductor components. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion using one of a vibratory plating device or a spouted bed electroplating device. | 02-05-2015 |