Patent application number | Description | Published |
20080214840 | Reworkable thermosetting resin composition - This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions. | 09-04-2008 |
20090018239 | UNDERFILL ADHESIVES - In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes. | 01-15-2009 |
20110290418 | HYDROGEN PEROXIDE COMPLEXES AND THEIR USE IN THE CURE SYSTEM OF ANAEROBIC ADHESIVES - Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: | 12-01-2011 |
Patent application number | Description | Published |
20090286729 | Epidermal Growth Factor Receptor Antagonists and Methods of Use - The present invention features epidermal growth factor receptor (EGFR) antagonists. These EGFR antagonists are polypeptide variants of ligands of EGFR. The EGFR ligand polypeptide variants of the invention possess EGFR antagonistic properties and can inhibit at least one EGFR-mediated biological activity such as inhibition of the receptor's kinase activation activity and subsequently, cell proliferation. Such polypeptide variants, and nucleic acids encoding these polypeptide variants can be used therapeutically in situations in which inhibition of EGFR activity is indicated. | 11-19-2009 |
20090311783 | INSULIN-LIKE GROWTH FACTOR-I RECEPTOR ANTAGONISTS - The present invention relates to IGF-I variants that bind to the Insulin-like Growth Factor Receptor I (IGF-IR) but do not initiate signal transduction and the subsequent metabolic, growth and anti-apoptotic activities associated with this molecule and the progression of cancer. These novel variants act to block the binding of the cognate ligands but do not bind to the insulin receptor. | 12-17-2009 |
20090318350 | PAN-HER ANTAGONISTS AND METHODS OF USE - The present invention features human epidermal receptor (HER) antagonists. These antagonists are polypeptide variants of ligands of HER. The HER ligand polypeptide variants of the invention possess Pan-HER antagonistic properties and can inhibit at least one HER-mediated biological activity of one or more HER subtypes, such as inhibition of the receptor's kinase activation activity and subsequently, cell proliferation. Such polypeptide variants, and nucleic acids encoding these polypeptide variants can be used therapeutically in situations in which inhibition of HER activity is indicated. | 12-24-2009 |
20140342421 | BIOCATALYSTS WITH ENHANCED INHIBITOR TOLERANCE - Disclosed herein are biocatalysts for the production of biofuels, including microorganisms that contain genetic modifications conferring tolerance to growth and fermentation inhibitors found in many cellulosic feedstocks. Methods of converting cellulose-containing materials to fuels and chemicals, as well as methods of fermenting sugars to fuels and chemicals, using these biocatalysts are also disclosed. | 11-20-2014 |
Patent application number | Description | Published |
20090068855 | MODULAR BOARD TO BOARD CONNECTOR - A connector assembly has a receptacle module and a pin module that interconnect. Stiffener engagement projections and recesses are provided along the sides of the receptacle and pin modules in an alternating fashion. The recesses are sized and shaped to receive the stiffener engagement projections of a respective neighboring module. Stainless steel elongated stiffener plates removably engage the pin and receptacle modules in both an X-direction and/or a Y-direction. The stiffener plates have slots that extend partly through the plates and align with the stiffener engagement projections and receiving recesses. The slots receive respective ones of the projections of the neighboring pin and receptacle modules. | 03-12-2009 |
20110104948 | SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE - An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation. | 05-05-2011 |
20110212632 | HIGH DENSITY ELECTRICAL CONNECTOR AND PCB FOOTPRINT - An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns. | 09-01-2011 |
20110212649 | HIGH DENSITY ELECTRICAL CONNECTOR WITH VARIABLE INSERTION AND RETENTION FORCE - An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness. | 09-01-2011 |
20120196482 | MULTI-STAGE BEAM CONTACTS - An electrical connector has a first wafer having a first housing with a first plurality of contact beams extending from the first housing in a first plane. A second wafer has a second housing with a second plurality of contact beams extending from said second housing in a second plane substantially parallel to the first plane. A dividing panel member extends from the insulative housing between the first plurality of contact beams and the second plurality of contact beams. Each of the contact beams extending from the wafer pair is configured to mate with a corresponding backplane contact in a backplane connector. The contact beams extending from the wafer pair and the backplane contacts are configured such that each pair of corresponding contacts includes a first contact point and a second contact point. When the wafer pair is fully received by the backplane connector, contact between the contact beam and the backplane contact is maintained at both the first and second contact points. Each of the contact beams includes a pivot member configured such that the electrical connector has a low initial insertion force, but a high normal force when fully mated with the backplane connector. | 08-02-2012 |
20130316594 | MULTI-STAGE BEAM CONTACTS - An electrical connector has a first wafer having a first housing with a first plurality of contact beams extending from the first housing in a first plane. A second wafer has a second housing with a second plurality of contact beams extending from said second housing in a second plane substantially parallel to the first plane. A dividing panel member extends from the insulative housing between the first plurality of contact beams and the second plurality of contact beams. Each of the contact beams extending from the wafer pair is configured to mate with a corresponding backplane contact in a backplane connector. The contact beams extending from the wafer pair and the backplane contacts are configured such that each pair of corresponding contacts includes a first contact point and a second contact point. When the wafer pair is fully received by the backplane connector, contact between the contact beam and the backplane contact is maintained at both the first and second contact points. Each of the contact beams includes a pivot member configured such that the electrical connector has a low initial insertion force, but a high normal force when fully mated with the backplane connector. | 11-28-2013 |
20140004724 | PRINTED CIRCUIT BOARD FOR RF CONNECTOR MOUNTING | 01-02-2014 |
20140004726 | LOW COST, HIGH PERFORMANCE RF CONNECTOR | 01-02-2014 |
20140004746 | HIGH PERFORMANCE CONNECTOR CONTACT STRUCTURE | 01-02-2014 |