| Patent application number | Description | Published |
|---|
| 20080196930 | Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure - This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern ( | 08-21-2008 |
| 20080202801 | Circuit Board Structure and Method for Manufacturing a Circuit Board Structure - The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil ( | 08-28-2008 |
| 20080261338 | Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer - Method for manufacturing an electronic module, which electronic module includes a component ( | 10-23-2008 |
| 20080295326 | Manufacture of a Layer Including a Component - A method for manufacturing a circuit-board layer on a base surface ( | 12-04-2008 |
| 20090014872 | METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT BOARD STRUCTURE - This publication discloses a method for manufacturing a circuit-board structure. | 01-15-2009 |
| 20090133251 | MANUFACTURE OF A CIRCUIT BOARD AND CIRCUIT BOARD CONTAINING A COMPONENT - A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line. | 05-28-2009 |
| 20100062568 | ELECTRONIC MODULE WITH A CONDUCTIVE-PATTERN LAYER AND A METHOD OF MANUFACTURING SAME - This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component ( | 03-11-2010 |
| 20100103635 | SINGLE-LAYER COMPONENT PACKAGE - A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconductor component having flat contact zones; and solid contact pillars containing copper and solderlessly, metallurgically and electrically connecting the flat contact zones to the single conductive-pattern layer. | 04-29-2010 |
| 20100202114 | ELECTRIC MODULE - An electronic module, comprising: a conductive-pattern layer; an insulating-material layer supporting the conductive-pattern layer; at least one component inside the insulating-material layer, the at least one component comprising a first surface and contact zones on the first surface; a first hardened adhesive layer on the first surface of the at least one component; a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer; holes in the first and second hardened adhesive layer at the locations of the contact zones; and conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer. | 08-12-2010 |
| 20100202115 | CIRCUIT BOARD INCLUDING AN EMBEDDED COMPONENT - The document describes a circuit board and an electronic module, comprising a conductor-pattern layer, an insulating-material layer supporting the conductor-pattern layer, and at least one component inside the insulating-material layer. The component has a plurality of contact areas and the circuit board or electronic module comprises contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component such that at least two of the contact elements are in direct contact with a common contact area. | 08-12-2010 |
| 20110061909 | CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - Manufacturing method and circuit module, which comprises an insulator layer ( | 03-17-2011 |
