Patent application number | Description | Published |
20090218667 | SMART CARDS AND METHODS FOR PRODUCING A SMART CARD - The invention relates to smart cards. In one embodiment a smart card has a card body having at least a first, a second and a third layer. The first and the second layer are at least partly composed of polycarbonate. The third layer is arranged between the first and the second layer and is composed of a material having a melting point of T | 09-03-2009 |
20130082112 | Smart Card Module for a Smart Card - The present invention describes a smart card module for a smart card, comprising a first laminate layer, a chip having electric contacts, a first conductive layer, wherein the electrical contacts of the chip are connected to the conductive layer and the first conductive layer is arranged between the chip and the first laminate layer, and wherein the smart card module furthermore comprises an adhesive means, wherein the adhesive means is arranged between the chip and the first conductive layer and/or the first laminate layer. | 04-04-2013 |
20130278378 | SECURE EPASS BOOKLET BASED ON DOUBLE CHIP TECHNOLOGY - A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna. | 10-24-2013 |
20140084070 | CHIP CARD AND METHOD FOR MANUFACTURING A CHIP CARD - According to one embodiment, a chip card is provided comprising a booster antenna wherein the booster antenna comprises a material having an electrical resistivity of at least 0.05 Ohm*mm | 03-27-2014 |
20140239428 | CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT - According to various embodiments, a chip arrangement may be provided, the chip arrangement including: a chip; an antenna structure disposed over a first side of the chip, wherein the antenna structure may include an antenna being electrically conductively coupled to the chip; and a reinforcement structure, wherein the reinforcement structure supports the chip to increase the stability of the chip arrangement. | 08-28-2014 |
20140353384 | SMART CARD MODULE, SMART CARD AND METHOD FOR PRODUCING A SMART CARD MODULE - A smart card module includes a carrier; a chip arrangement arranged over a first side of the carrier; and an antenna arranged over a second side of the carrier, wherein the second side of the carrier is opposite the first side of the carrier. The antenna is electrically conductively connected to the chip arrangement in order to transmit electrical signals. The smart card module further includes a display module arranged over the first side of the carrier; and at least one electrical line structure arranged on the first side of the carrier, which electrical line structure electrically conductively connects the chip arrangement and the display module to one another. | 12-04-2014 |
20140353387 | Smart Card Module and Method for Producing a Smart Card Module - A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides. | 12-04-2014 |
20150069132 | Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card - A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer. | 03-12-2015 |