Patent application number | Description | Published |
20090122503 | BASE ELEMENT, BASE SYSTEM AND METHOD FOR MANUFACTURING ANOTHER BASE SYSTEM - A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal of the first surface and a second face normal of the second surface. | 05-14-2009 |
20100048044 | COMPONENT HAVING A MECHANICAL CONTACT AND METHOD FOR PRODUCING THE COMPONENT - A component having a mechanical contact for connecting the component to a carrier, particularly a printed-circuit board, a coating made of an adhesive material being formed on the contact; the adhesive material containing an encapsulated adhesive substance. A method for producing a component to be mounted on a carrier, particularly on a printed-circuit board; the component being provided with a mechanical contact for connecting the component to the carrier; a coating made of an adhesive material being applied to the contact; the adhesive material having an encapsulated adhesive substance. | 02-25-2010 |
20100309637 | SUPPORT ELEMENT ARRANGEMENT AND METHOD FOR MANUFACTURING A SUPPORT ELEMENT ARRANGEMENT - A support element arrangement for an electronic component includes a first support element and a second support element, the first support element being configured perpendicularly to the second support element and having a first main extension plane, and, in addition, the first support element having a first recess, the first recess at least partially surrounding the second support element in the first main extension plane. | 12-09-2010 |
20110016982 | PRESSURE SENSOR SYSTEM - A pressure connection concept for pressure sensor modules is provided, using which the influence of assembly-related stresses in the sensor system on the sensor diaphragm and accordingly on the measuring signal detection is kept very low. The sensor system includes a sensor module for pressure detection and a connecting piece and at least one seal for coupling the sensor module to a measuring system. The sensor module includes at least one sensor element having a diaphragm and means for signal detection. Together with the means for signal detection, the sensor element is provided with packaging having a pressure connection opening and electrical contacts. A pressure channel is provided in the connecting piece, the pressure channel being coupled to the pressure connection opening of the sensor module using the seal. The packaging of the sensor module includes a tube-shaped projection which forms the pressure connection opening, and the pressure channel of the connecting piece terminates in a connecting tube. The tube-shaped projection of the sensor module and the connecting tube of the connecting piece fit into each other, and the seal designed as a radial seal is situated between the walls of the tube-shaped projection and the connecting tube. | 01-27-2011 |
20120031662 | SENSOR MODULE HAVING AN ELECTROMAGNETICALLY SHIELDED ELECTRICAL COMPONENT - In a module having an electrical component, which is situated between two ground planes for electromagnetic shielding, a trough-shaped composite component is provided between an inner and an outer housing, into which the rear side of the inner housing is inserted, the composite component having an insulator trough and, on its inside, a ground plane formed at least on the trough bottom, which forms the shielding of a rear side of the electrical component. The composite component is advantageously designed as an MID component. The outer housing of the module may be manufactured in the two-component injection molding process by extrusion-coating initially using an elastomer and subsequently a thermoplast. | 02-09-2012 |
20120036930 | EXTRUSION-COATING METHOD FOR A SENSOR DEVICE AND SENSOR DEVICE - An extrusion-coating method for a sensor device, including the following steps:
| 02-16-2012 |
20120174376 | BASE ELEMENT, BASE SYSTEM AND METHOD FOR MANUFACTURING ANOTHER BASE SYSTEM - A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal of the first surface and a second face normal of the second surface. | 07-12-2012 |
20120285735 | CONNECTING ELEMENT AND METHOD FOR MANUFACTURING A CONNECTING ELEMENT - A connecting element for electrical contacting of an electrical component having at least one electrically conductive line part, embedded at least partially in an injection-molded housing, is provided, the connecting element having at least one stiffening element reinforcing the line part. | 11-15-2012 |
20130099415 | DEVICE FOR HOLDING A COMPONENT TO BE SHEATHED IN PLASTIC, AND METHOD FOR SHEATHING A COMPONENT - A device for holding a component to be sheathed with plastic includes a holding element for producing a releasable mechanical keyed connection with an affixation region of the component, which holding element has a push-twist locking element. | 04-25-2013 |
20140093601 | DEVICE FOR ENCAPSULATING A COMPONENT WITH PLASTICS MATERIAL - The invention relates to a device ( | 04-03-2014 |
20140102225 | Sensor device - A sensor device, having a sensor component, and a fastening element, in which the fastening element is configured as a receptacle for the sensor component and as a fastening arrangement for the sensor device. | 04-17-2014 |
20150079828 | COMPOSITE INSERT - A composite insert has at least one metallic contact element which is extrusion-coated with the aid of a premolded part which has a first three-dimensional sealing surface to an injection mold, a stiffener of the contact element being formed beyond a transition region of the premolded part to the injection mold. | 03-19-2015 |