Patent application number | Description | Published |
20080238596 | GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die. | 10-02-2008 |
20080238602 | COMPONENTS WITH ON-DIE MAGNETIC CORES - An apparatus may include a first magnetic layer, a second magnetic layer, and a conductive pattern. The conductive pattern is at a third layer between the first and second magnetic layers. Moreover, one or more magnetic vias connect the first and second magnetic layers. The magnetic layers and vias may operate as ferromagnetic cores or shields. Further they may be integrated on a chip (on-die magnetics). The apparatus may be included in inductors, transformers, transmission lines, and so forth. | 10-02-2008 |
20080290980 | CONTROL OF EDDY CURRENTS IN MAGNETIC VIAS FOR INDUCTORS AND TRANSFORMERS IN INTEGRATED CIRCUITS - An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency. | 11-27-2008 |
20090117325 | METHODS OF FORMING MAGNETIC VIAS TO MAXIMIZE INDUCTANCE IN INTEGRATED CIRCUITS AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of a magnetic material on a substrate, forming an oxide layer on the first layer of the magnetic material, forming at least one conductive structure on the first magnetic layer, forming a dielectric layer on the at least one conductive structure, forming a second layer of the magnetic material on the at least one conductive structure, and forming a magnetic via coupled to the first and second layers of the magnetic material, wherein the magnetic via comprises a shape to increase inductance of the inductive structure. | 05-07-2009 |
20090166804 | FORMING INDUCTOR AND TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS USING DAMASCENE PROCESSING FOR INTEGRATED CIRCUITS - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of magnetic material and at least one via structure disposed in a first dielectric layer, forming a second dielectric layer disposed on the first magnetic layer, forming at least one conductive structure disposed in the second dielectric layer, forming a third layer of dielectric material disposed on the conductive structure, forming a second layer of magnetic material disposed in the third layer of dielectric material and in the second layer of dielectric material, wherein the first and second layers of the magnetic material are coupled to one another. | 07-02-2009 |
20090174377 | MULTIPHASE TRANSFORMER FOR A MULTIPHASE DC-DC CONVERTER - A multiphase DC-DC converter is provided that includes a multiphase transformer, the multiphase transformer including a plurality of input voltage terminals and an transformer output voltage terminal, each input voltage terminal associated with a corresponding phase. Each phase is assigned to an input voltage terminal of the plurality of input voltage terminals to minimize a ripple current at the input voltage terminals of the multiphase transformer. | 07-09-2009 |
20090199033 | Power Delivery System - A system is disclosed. The system includes a load, a voltage regulator circuit coupled to the load a power supply, a load coupled to the power supply to receive one or more voltages from the power supply, and a digital bus, coupled between the power supply and the load. The digital bus transmits power consumption measurements from the load to the power supply and transmits power consumption measurements from the power supply to the load. | 08-06-2009 |
20090207576 | SLOTTED MAGNETIC MATERIAL FOR INTEGRATED CIRCUIT INDUCTORS - An embodiment is an inductor that may include a slotted magnetic material to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers. | 08-20-2009 |
20090267722 | GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die. | 10-29-2009 |
20100115301 | CPU POWER DELIVERY SYSTEM - A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout. | 05-06-2010 |
20100118501 | Integrated inductor - An inductor and multiple inductors embedded in a substrate (e.g., IC package substrate, board substrate, and/or other substrate) is provided herein. | 05-13-2010 |
20100219516 | Power management integrated circuit - An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout. | 09-02-2010 |
20110001202 | FORMING INDUCTOR AND TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS USING DAMASCENE PROCESSING FOR INTEGRATED CIRCUITS - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of magnetic material and at least one via structure disposed in a first dielectric layer, forming a second dielectric layer disposed on the first magnetic layer, forming at least one conductive structure disposed in the second dielectric layer, forming a third layer of dielectric material disposed on the conductive structure, forming a second layer of magnetic material disposed in the third layer of dielectric material and in the second layer of dielectric material, wherein the first and second layers of the magnetic material are coupled to one another. | 01-06-2011 |
20110043318 | GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die. | 02-24-2011 |
20110068887 | ON-DIE MICRO-TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS - Some embodiments include a die having a transformer. The transformer includes windings formed from a set of lines, such that no two lines belonging to any one winding are nearest neighbors. The lines are formed within one layer on the die. Other embodiments are described. | 03-24-2011 |
20110095788 | High-speed comparator with asymmetric frequency response - A comparator to provide an output voltage indicative of comparing an input voltage with a reference voltage, where the comparator has an asymmetric frequency response. With an asymmetric frequency response, the bandwidth of the input voltage may be greater than the bandwidth of the reference voltage. A comparator includes a differential pair of transistors coupled to a current mirror and biased by a current source, where in one embodiment, a capacitor shunts the sources of the differential pair. In a second embodiment, a capacitor couples the input voltage port to the gates of the current mirror transistors. In a third embodiment, the comparator utilizes both capacitors of the first and second embodiments. | 04-28-2011 |
20120169425 | DC-DC CONVERTER SWITCHING TRANSISTOR CURRENT MEASUREMENT TECHNIQUE - A method is described comprising conducting a first current through a switching transistor. The method also comprises conducting a second current through a pair of transistors whose conductive channels are coupled in series with respect to each other and are together coupled in parallel across the switching transistor's conductive channel. The second current is less than and proportional to the first current. | 07-05-2012 |
20120194245 | PULSE WIDTH MODULATOR - Disclosed herein are pulse width modulator (PWM) solutions with comparators not relying on a variable reference to adjust duty cycle. In accordance with some embodiments, a pulse width modulator having a comparator with an applied adjustable waveform to generate a bit stream with a controllably adjustable duty cycle is provided. | 08-02-2012 |
20130113444 | MULTIPHASE TRANSFORMER FOR A MULTIPHASE DC-DC CONVERTER - A multiphase DC-DC converter is provided that includes a multiphase transformer, the multiphase transformer including a plurality of input voltage terminals and an transformer output voltage terminal, each input voltage terminal associated with a corresponding phase. Each phase is assigned to an input voltage terminal of the plurality of input voltage terminals to minimize a ripple current at the input voltage terminals of the multiphase transformer. | 05-09-2013 |
20130182365 | INTEGRATED INDUCTORS - Multiple-inductor embodiments for use in substrates are provided herein. | 07-18-2013 |
20130271105 | DC-DC CONVERTER SWITCHING TRANSISTOR CURRENT MEASUREMENT TECHNIQUE - A method is described comprising conducting a first current through a switching transistor. The method also comprises conducting a second current through a pair of transistors whose conductive channels are coupled in series with respect to each other and are together coupled in parallel across the switching transistor's conductive channel. The second current is less than and proportional to the first current. | 10-17-2013 |
20140089687 | POWER MANAGEMENT INTEGRATED CIRCUIT - An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout. | 03-27-2014 |