Patent application number | Description | Published |
20100252851 | LED PACKAGE WITH INCREASED FEATURE SIZES - A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having dimensions greater than 3.5 mm square used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management. | 10-07-2010 |
20110053297 | SUBMOUNTS FOR SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHODS OF FORMING PACKAGED LIGHT EMITTING DEVICES INCLUDING DISPENSED ENCAPSULANTS - A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed. | 03-03-2011 |
20110180834 | Packaged Light Emitting Devices - Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity. | 07-28-2011 |
20120138996 | Semiconductor Light Emitting Devices and Submounts - A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided. | 06-07-2012 |
20120193647 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH REFLECTIVE LAYER - A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element; and a reflective layer, the reflective layer covering at least a portion of the top surface of the substrate or the submount, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer. A method of manufacturing a solid state lighting package comprising the reflective layer, and a method of increasing the luminous flux thereof, is also provided. | 08-02-2012 |
20140021493 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH LAYER - A solid state lighting component comprising a layer having high reflectivity and/or scattering properties, the layer positioned about a solid state lighting component, and manufacturing methods of making same is disclosed. A method of increasing the luminous flux of the solid state lighting component, is also provided. | 01-23-2014 |
20140313713 | LED ASSEMBLY - An LED assembly comprises a string of LEDs. An electrical connector electrically connects the plurality of LEDs and provides the physical support between the LEDs. Lamps incorporating the LED assembly are provided. Methods of making the LED assembly are also provided. | 10-23-2014 |
20140346533 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH CONFORMAL REFLECTIVE COATING - A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate and a conformal reflective layer of inorganic particles, whereby at least of portion of the light emitted by the LED element is reflected by the conformal reflective layer. A method of manufacturing a solid state lighting package comprising the distribution of inorganic particles, and a method of increasing the luminous flux thereof, is also provided. | 11-27-2014 |
20140361317 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH REFLECTIVE LAYER - A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element; and a reflective layer, the reflective layer covering at least a portion of the top surface of the substrate or the submount, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer. A method of manufacturing a solid state lighting package comprising the reflective layer, and a method of increasing the luminous flux thereof, is also provided. | 12-11-2014 |