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Pender, US
Frank R. Pender, San Mateo, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120245992 | Incentive Program Awarding Points Per-Mile-Driven - Embodiments in accordance with the present invention relate to incentive programs awarding loyalty points based at least in part upon the number of miles driven in a motor vehicle. Reward points may be earned by having the vehicle serviced at authorized locations. At the time of servicing, the authorized location notes a current vehicle odometer reading, and the odometer reading is communicated to an administrator of the loyalty program. The odometer reading is used to calculate a number of miles driven since the last authorized servicing, and the number of mile driven is then converted into loyalty points to be credited to a consumer of the vehicle. Thus, incentives for servicing only at authorized locations are provided to the consumer. | 09-27-2012 |
Jeremiah Pender, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100022091 | METHOD FOR PLASMA ETCHING POROUS LOW-K DIELECTRIC LAYERS - Described herein are methods and apparatuses for etching low-k dielectric layers to form various interconnect structures. In one embodiment, the method includes forming an opening in a resist layer. The method further includes etching a porous low-k dielectric layer with a process gas mixture that includes a fluorocarbon gas and a carbon dioxide (CO | 01-28-2010 |
| 20100043821 | METHOD OF PHOTORESIST REMOVAL IN THE PRESENCE OF A LOW-K DIELECTRIC LAYER - Described herein are methods and apparatus for removing photoresist in the presence of low-k dielectric layers. In one embodiment, the method includes exciting a first mixture of gases having a ratio of a flow rate of reducing process gas to a flow rate of an oxygen-containing process gas that is between 1:1 and 100:1 to generate a first reactive gas mixture. Next, the method includes exposing the photoresist layer that overlays the low-k dielectric layer on a substrate to the first reactive gas mixture to selectively remove the photoresist layer from the dielectric layer. Next, the method includes exposing the photoresist layer to a second reactive gas mixture to selectively remove the photoresist layer from the dielectric layer. The first and second reactive gas mixtures contain substantially no ions when the substrate is exposed to these mixtures in order to minimize damage to the low-k dielectric layer. | 02-25-2010 |
| 20100078825 | METHOD FOR FABRICATING INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES - Described herein are methods for fabricating dual-damascene interconnect structures. In one embodiment, the interconnect structures are fabricated with a dual-damascene method having trenches then vias formed. The method includes novel liner depositions after the trench and via etches. The method includes etching trenches in a dielectric layer. Next, the method includes depositing a first liner layer on the dielectric layer. Next, the method includes etching vias in the dielectric layer and an etch stop layer. Next, the method includes depositing a second liner layer on the first liner layer. The second liner layer is deposited on the exposed surfaces of the first liner layer, dielectric layer, etch stop layer, and the first metal layer. Then, a second metal layer is deposited on the second liner layer. | 04-01-2010 |
Jeremiah T. Pender, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110079918 | PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE - Removal of organic mask material from an etched dielectric film with an etchant gas mixture including silicon fluoride (SiF | 04-07-2011 |
| 20110253670 | METHODS FOR ETCHING SILICON-BASED ANTIREFLECTIVE LAYERS - Methods for etching silicon-based antireflective layers are provided herein. In some embodiments, a method of etching a silicon-based antireflective layer may include providing to a process chamber a substrate having a multiple-layer resist thereon, the multiple-layer resist comprising a patterned photoresist layer defining features to be etched into the substrate disposed above a silicon-based antireflective coating; and etching the silicon-based antireflective layer through the patterned photoresist layer using a plasma formed from a process gas having a primary reactive agent comprising a chlorine-containing gas. In some embodiments, the chlorine-containing gas is chlorine (Cl | 10-20-2011 |
Jeremiah T.p. Pender, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090132189 | METHOD FOR DETERMINING PLASMA CHARACTERISTICS - Methods for determining characteristics of a plasma are provided. In one embodiment, a method for determining characteristics of a plasma includes obtaining metrics of current and voltage information for first and second waveforms coupled to a plasma at different frequencies, determining at least one characteristic of the plasma using the metrics obtained from each different frequency waveform. In another embodiment, the method includes providing a plasma impedance model of a plasma as a function of frequency, and determining at least one characteristic of a plasma using model. In yet another embodiment, the method includes providing a plasma impedance model of a plasma as a function of frequency, measuring current and voltage for waveforms coupled to the plasma and having at least two different frequencies, and determining ion mass of a plasma from model and the measured current and voltage of the waveforms. | 05-21-2009 |
Jeremiah T. P. Pender, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090130856 | METHOD FOR MONITORING PROCESS DRIFT USING PLASMA CHARACTERISTICS - Methods for monitoring process drift using plasma characteristics are provided. In one embodiment, a method for monitoring process drift using plasma characteristics includes obtaining metrics of current and voltage information of a first waveform coupled to a plasma during a plasma process formed on a substrate, obtaining metrics of current and voltage information of a second waveform coupled to the plasma during the plasma process formed on the substrate, the first and second waveforms having different frequencies, determining at least one characteristic of the plasma using the metrics obtained from each different frequency waveform, and adjusting the plasma process in response to the determined at least one characteristic of the plasma. | 05-21-2009 |
| 20120077344 | METHOD OF PATTERNING A LOW-K DIELECTRIC FILM - Methods of patterning low-k dielectric films are described. | 03-29-2012 |
John G. Pender, Fairbanks, AK US
| Patent application number | Description | Published |
|---|---|---|
| 20090250094 | METHOD AND SYSTEM FOR LIGHT RAY CONCENTRATION - Systems and techniques for light ray concentration. In one aspect, a solar concentration assembly includes an array of light focusing elements and an array of photovoltaic devices positioned beneath the array of light focusing elements. The arrays of light focusing elements and photovoltaic devices are spaced from one another and configured to concentrate solar rays incident on the light focusing elements to the photovoltaic elements, such that solar ray communication is maintained as an angle of the assembly relative to the sun is altered by movement of the sun during a day and wherein the angle is an oblique angle for the majority of the day. | 10-08-2009 |
| 20110146111 | ICE RESURFACING SLED - An ice resurfacing sled including a fuel source directing fuel to a manifold which distributes it under a regulated pressure to a plurality of orifices where it is burned in expansion chambers. The hot gas flows into a melting chamber formed by a top surface, two lateral sled runners and the surface of the ice to be melted. The melting chamber is shaped to have a reduced cross sectional area near its rear outlet to assist in maintaining the flow of heated gas beneath the sled to optimize melting. A wind screen is provided at the rear of the sled to prevent tail winds from disrupting the flow of hot gas through the melting chamber. | 06-23-2011 |
Mark J. Pender, Mauldin, SC US
| Patent application number | Description | Published |
|---|---|---|
| 20100319824 | TIRE HAVING ENHANCED OZONE RESISTANCE - The present invention includes rubber compositions, rubber articles and tires formulated to prevent ozone attack. A particular embodiment of the present invention includes a tire comprising a rubber structure, the rubber structure comprising an essentially unsaturated rubber elastomer, between 0.1 and 0.45 phr (parts by weight per hundred parts by weight of the rubber elastomer) of a particular compound 2,4,6-Tris-(N-1,4-dimethylpentyl-p-phenylenediamino)-1,3,5-triazine and between 0.5 and 2 phr of a phenolic resin. | 12-23-2010 |
| 20110172365 | RUBBER WITH RECYCLED CONTENT - Rubber compositions, methods of making rubber compositions and articles comprising the rubber compositions that have crumb rubber particles in the rubber compositions. A cross-linked rubber composition, comprising a diene rubber and a masterbatch material comprising between 50 and 75 wt. % natural rubber and between 25 and 50 wt. % crumb rubber particles, wherein the crumb rubber particles are 40 mesh or smaller. A method for preparing a rubber composition having crumb rubber, the method comprising mixing a masterbatch, the masterbatch comprising between 50 and 75 wt. % natural rubber and between 25 and 50 wt. % crumb rubber particles and mixing the masterbatch with a diene rubber. | 07-14-2011 |
Michael L. Pender, Ann Arbor, MI US
| Patent application number | Description | Published |
|---|---|---|
| 20110067280 | BANNER HEM SEALING APPARATUS FOR USE WITH IMPULSE SEALER AND METHOD OF USING THE SAME - The present disclosure provides a banner hem sealing apparatus for use with impulse sealer and method of using the same. The apparatus is designed to reduce the misalignment problem caused when an impulse sealer is used to hem a banner. The apparatus is comprised of: a first member which comprises a tray and the means to mount to a second member; the second member which comprises an opening, a fence, a backplate, and the means to mount to the first member. | 03-24-2011 |
Randy Pender, Woodbury, GA US
| Patent application number | Description | Published |
|---|---|---|
| 20080282587 | Display system - A display system utilizing a graphics box as a primary component is disclosed. The graphics box greatly increases the flexibility and aesthetic appeal of displayed graphics cards. The ability to mass produce the graphics box, use multiple graphics boxes to deliver displays of different size and information content and, especially, the ability to reuse the graphics boxes, means that costs of the disclosed display system are relatively low and are achievable without a decrease in the aesthetic appeal of the entire display. Structures for supporting the graphics box to further increase the flexibility of the display system are also disclosed. | 11-20-2008 |
Robert Gordon Pender, Brantford, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090096227 | Waste collection device - A device for collecting pet waste comprising a shaft having an upper end and a lower end; and a receptacle support pivotally attached to the lower end of the shaft, said support being moveable between a closed position in which the receptacle support is adjacent to the shaft and a plurality of open waste-receiving positions in which the receptacle support is spaced from the shaft at an angle to the shaft. | 04-16-2009 |
William Anthony Pender, Hollywood, FL US
| Patent application number | Description | Published |
|---|---|---|
| 20080285933 | FIBER OPTIC SPLICE AND DISTRIBUTION ENCLOSURE - An enclosure for housing fiber optic splices between a fiber optic distribution cable and fiber optic customer drop cables includes a first door providing access to a first area of the enclosure housing couplers for receiving terminals of customer drop cables. The enclosure also includes a second door providing access to a second area of the enclosure for accommodating slices in one or more distribution cables. The second area is not accessible via the first area. | 11-20-2008 |