Pei-Chung
Pei-Chung Hsiao, Tokyo JP
Patent application number | Description | Published |
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20140120738 | METHOD OF DEPOSITING THIN FILM - A method for forming a silicon germanium oxide thin film on a substrate in a reaction space may be performed using an atomic layer deposition (ALD) process. The process may include at least one cycle comprising a germanium oxide deposition sub-cycle and a silicon oxide deposition sub-cycle. The germanium oxide deposition sub-cycle may include contacting the substrate with a germanium reactant, removing excess germanium reactant, and contacting the substrate with a first oxygen reactant. The silicon oxide deposition sub-cycle may include contacting the substrate with a silicon reactant, removing excess silicon reactant, and contacting the substrate with a second oxygen reactant. The films of the present disclosure exhibit desirable etch rates relative to thermal oxide. Depending on the films' composition, the etch rates may be higher or lower than the etch rates of thermal oxide. | 05-01-2014 |
Pei-Chung Wang, Shangai CN
Patent application number | Description | Published |
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20090152253 | ONLINE WELD INSPECTION AND REPAIR METHOD FOR RESISTANCE WELDING AND WELD-BONDING - A method to diagnose weld integrity in a welding process includes monitoring a weld indentation characteristic, comparing the monitored weld indentation characteristic to a threshold weld indentation characteristic, and identifying a discrepant weld when the weld indentation characteristic comparison shows the monitored weld indentation characteristic violates the threshold weld indentation characteristic. | 06-18-2009 |
Pei-Chung Wang, Pudong CN
Patent application number | Description | Published |
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20110284501 | WELDING SYSTEM - A welding system includes a first electrode, a first metal substrate having a first melting point temperature, and a second metal substrate having a second melting point temperature and disposed adjacent and in contact with the first metal substrate to define a faying interface therebetween. The welding system also includes a second electrode spaced apart from the first electrode and disposed in electrically-conductive relationship with the second metal substrate. Further, the welding system includes a flexible strip disposed between and in electrically-conductive relationship with each of the first electrode and the first metal substrate. The flexible strip is formed from an electrically-conductive material and has a melting point temperature that is greater than or equal to each of the first melting point temperature and the second melting point temperature. | 11-24-2011 |
20120317786 | METHOD AND APPARATUS FOR JOINING MULTIPLE COMPONENTS - A method of joining multiple components includes stacking the components vertically. Each component includes two opposite substantially planar surfaces that are arranged in a column when the components are stacked. The method also includes placing the stacked components in a clinch-crimping apparatus having a first punch, a second punch, and a crimping element. The method also includes displacing a section of the substantially planar surfaces of the stacked components by driving the first punch in a first direction that is substantially perpendicular to the surfaces. The method additionally includes retracting the first punch from the displaced section and crimping the displaced section by the crimping element to form a crush initiator. The method additionally includes disengaging the crimping element from the crimped, displaced section. Furthermore, the method includes clinching the crimped, displaced section by driving the second punch in a second direction that is opposite to the first direction. | 12-20-2012 |