| Patent application number | Description | Published |
|---|
| 20080293334 | METHODS AND APPARATUS FOR USING A BEVEL POLISHING HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT - Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous other aspects are provided. | 11-27-2008 |
| 20080293335 | METHODS AND APPARATUS FOR SUBSTRATE EDGE POLISHING USING A POLISHING ARM - Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing tape, ii) a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm and iii) a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction perpendicular to the longitudinal axis of the polishing arm. Numerous other aspects are provided. | 11-27-2008 |
| 20080293336 | METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF FILMS - Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled portion adapted to provide a pre-set film profile. Numerous other aspects are provided. | 11-27-2008 |
| 20080293340 | METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS - Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided. | 11-27-2008 |
| 20080293341 | METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING - An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided. | 11-27-2008 |
| 20080293344 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD - Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavity adapted to be filled with a pressure-controlled medium; and a tip region having a shape that corresponds to a shape of the notch, wherein the polishing pad is adapted to contact the polishing tape and press the polishing tape against the notch. Numerous other aspects are provided. | 11-27-2008 |
| 20090036032 | TEMPERATURE CONTROL FOR ECMP PROCESS - Methods for polishing a substrate are provided. In one embodiment, the method includes pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source, flowing an electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in contact with the substrate and the electrode, creating an electrical bias between the electrode and the substrate, and heating the electrolyte fluid with an infrared lamp to a temperature of at least 10 degrees Celsius above room temperature. | 02-05-2009 |
| 20090036037 | APPARATUS FOR CONDITIONING PROCESSING PADS - Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface. | 02-05-2009 |
| 20090264053 | APPARATUS AND METHODS FOR USING A POLISHING TAPE CASSETTE - Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided. | 10-22-2009 |
| 20100105291 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE - Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. Numerous other aspects are provided. | 04-29-2010 |
| 20100105299 | METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE - Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch. Numerous other aspects are provided. | 04-29-2010 |
